PRE-PLATING SOLUTIONS FOR MAKING PRINTED CIRCUIT BOARDS AND METHODS FOR PREPARING THE SAME
First Claim
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1. A pre-plating solution for making a printed circuit board comprising:
- carbon nanotubes of 0.01-3 wt %, a surfactant of 0.01-4 wt %, an alkaline substance of 0.01-1 wt % and a solvent.
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Abstract
A pre-plating solution for making a printed circuit board includes carbon nanotubes of 0.01-3 wt %, a surfactant of 0.01-4 wt %, an alkaline substance of 0.01-l wt % and a solvent. A method for preparing a pre-plating solution comprising the steps of: providing a plurality of carbon nanotubes; purifying the carbon nanotubes; treating the purified carbon nanotubes with an acid; mixing the treated carbon nanotubes, an alkaline substance and a solvent to form suspension; and adding surfactant into suspension.
9 Citations
17 Claims
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1. A pre-plating solution for making a printed circuit board comprising:
- carbon nanotubes of 0.01-3 wt %, a surfactant of 0.01-4 wt %, an alkaline substance of 0.01-1 wt % and a solvent.
- View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A method for preparing a pre-plating solution comprising the steps of:
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providing a plurality of carbon nanotubes; purifying the carbon nanotubes; treating the purified carbon nanotubes with an acid; mixing the treated carbon nanotubes, an alkaline substance and a solvent to form suspension; and adding surfactant into suspension. - View Dependent Claims (12, 13, 14, 15, 16, 17)
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Specification