ILLUMINATOR AND METHOD FOR PRODUCING SUCH ILLUMINATOR

• US 20090078948A1
• Filed: 11/14/2005
• Published: 03/26/2009
• Est. Priority Date: 11/18/2004
• Status: Active Grant

• Current Assignee: Lumileds LLC (Apollo Global Management, Inc.)
• Original Assignee: Koninklijke Philips Electronics N.V. (Koninklijke Philips N.V.)
• Inventors: Rutjes, Cornelius Franciscus Jozef, Hoelen, Christoph Gerard August, De Samber, Marc Andre, Van Os, Koen, Van Den Ackerveken, Antonius Constant Johanna Cornelis, Treurniet, Theodoor Cornelis
• Granted Patent: US 8,541,797 B2
• Time in Patent Office: Days
• US Class Current: 257/98
• CPC Class Codes: H01L 2224/14 of a plurality of bump connectors
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/60 Reflective elements

Abstract

The present invention relates to an illuminator (10) comprising a substrate (12), a structured conductive layer (16) applied to one surface of the substrate, and at least one light source (18, 26) connected to the structured conductive layer. The illuminator is characterized in that it further comprises an unstructured reflective layer (24) applied on top of said structured conductive layer, which unstructured reflective layer has an essentially continuous extension at least in a surrounding of the at least one light source. Due to the unstructured reflective layer, the optical efficiency of the illuminator can be improved. The invention also relates to a method for producing such illuminator.

Claims

1. An illuminator (10) comprising:

a substrate (12),

a structured conductive layer (16) applied to one surface of said substrate, and

at least one light source (18, 26) connected to said structured conductive layer,

characterized in that the illuminator further comprises;

an unstructured reflective layer (24) applied on top of said structured conductive layer, said unstructured reflective layer having an essentially continuous extension at least in a surrounding of said at least one light source.

2. An illuminator according to claim 1, wherein said unstructured reflective layer covers essentially the entire surface of the substrate.

3. An illuminator according to claim 1, further comprising an isolating layer (20) applied between said structured conductive layer and said unstructured reflective layer.

4. An illuminator according to claim 3, wherein said isolating layer comprises contact holes (22) for enabling connection between the light source(s) and the structured conductive layer.

5. An illuminator according to claim 1, wherein said light source is one of a flip chip light source (18) and a wire bonded light source (26).

6. An illuminator according to claim 1, wherein said light source is a light emitting diode.

7. A method for producing an illuminator (10), said method comprising:

providing a substrate (12),

applying a structured conductive layer (16) on one surface of said substrate, and

placing at least one light source (18, 26) in connection with said structured conductive layer,

characterized in that the method further comprises;

applying an unstructured reflective layer (24) on top of said structured conductive layer, said unstructured reflective layer having an essentially continuous extension at least in a surrounding of said at least one light source.

8. A method according to claim 7, wherein said unstructured reflective layer covers the entire surface of the substrate not occupied by any light source(s) or any electrical connectors associated with said light source(s).

9. A method according to claim 7, further comprising:

applying an isolating layer (20) between said structured conductive layer and said unstructured reflective layer.

10. A method according to claim 9, further comprising:

providing contact holes (22) in the isolating layer for enabling connection between the light source(s) and structured conductive layer.