Package structure with replaceable element for light emitting diode

• US 20090078950A1
• Filed: 09/21/2007
• Published: 03/26/2009
• Est. Priority Date: 09/21/2007
• Status: Abandoned Application

• Current Assignee: Edison Opto Corporation
• Original Assignee: Edison Opto Corporation
• Inventors: Sun, Tsung-Ting
• Application Number:
  US11/902,370
• Publication Number:
  US 20090078950A1
• Time in Patent Office: Days
• US Class Current: 257/98
• CPC Class Codes: G02B 19/0014 at least one surface having optical power
• CPC Class Codes: G02B 19/0061 the light source comprising a LED semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission H01L33/00
• CPC Class Codes: G02B 27/0955 Lenses lenses per se G02B3/00
• CPC Class Codes: G02B 7/022 lens and mount having complementary engagement means, e.g. screw/thread
• CPC Class Codes: H01L 33/483 Containers
• CPC Class Codes: H01L 33/58 Optical field-shaping elements

Abstract

A package structure for an LED is disclosed. The structure includes a first substrate, an LED chip, a second substrate, a protection layer and a replaceable optical element. The LED chip is disposed on the first substrate. The second substrate is disposed on the first substrate, and surrounds the LED chip. The second substrate has a first thread. The protection layer covers the LED chip. The replaceable optical element has a second thread, and is fastened to the second substrate through the first thread. An interior wall of the optical element corresponds to a surface of the protection layer in arc shape.

Claims

1. A package structure for a light emitting diode (LED), comprising:

a first substrate;

an LED chip, disposed on the first substrate;

a second substrate, disposed on the first substrate and for surrounding the LED chip, and the second substrate has a first thread;

a protection layer, for covering the LED chip; and

a replaceable optical element, having a second thread, and fastened to the second substrate through the first thread, and an interior wall of the optical element corresponding to a surface of the protection layer in arc shape.

2. The package structure for the LED of claim 1, wherein the first substrate and the second substrate are made by integrated molding.

3. The package structure for the LED of claim 1, wherein the optical element is a lens.

4. The package structure for the LED of claim 1, wherein the second substrate has high reflective capability.

5. The package structure for the LED of claim 1, wherein a surface of the second substrate has a reflective surface.

6. The package structure for the LED of claim 1, wherein a normal of the interior wall of the optical element is similar to a normal of the surface of the protection layer.

7. The package structure for the LED of claim 1, wherein the interior wall of the optical element contacts with the surface of the protection layer or an interval is between the interior wall of the optical element and the surface of the protection layer.

8. The package structure for the LED of claim 1, wherein materials of the protection layer includes silicone or epoxy resin.

9. The package structure for the LED of claim 3, wherein the lens includes a Lambertian lens, a side light lens or a lens with specific-angle light.

10. The package structure for the LED of claim 1, wherein the first substrate is a high thermal conducting material.

11. A package structure for an LED, comprising:

a first substrate;

an LED chip, disposed on the first substrate;

a second substrate, disposed on the first substrate and surrounding the LED chip, the second substrate having a first thread;

a protection layer, for covering the LED chip;

a lens holder, having an accommodating space and a second thread, and fastened to the second substrate through the first thread; and

at least one optical element, disposed in the accommodating space of the lens holder.

12. The package structure for the LED of claim 11, wherein the first substrate and the second substrate are made by integrated molding.

13. The package structure for the LED of claim 11, wherein the optical element includes a lens or a polarizer.

14. The package structure for the LED of claim 13, wherein the lens includes a convex lens or a concave lens.

15. The package structure for the LED of claim 11, wherein the second substrate has high reflective capability.

16. The package structure for the LED of claim 11, wherein a surface of the second substrate has a reflective surface.

17. The package structure for the LED of claim 11, wherein the lens holder is a hollow cylinder.

18. The package structure for the LED of claim 11, wherein an interior wall of the lens holder has a reflective surface.

19. The package structure for the LED of claim 11, wherein the lens holder has an adjustment mechanism for adjusting a position of the optical element.

20. The package structure for the LED of claim 11, wherein the first substrate is a high thermal conducting material.