TAPE SUBSTRATE AND SEMICONDUCTOR MODULE FOR SMART CARD, METHOD OF FABRICATING THE SAME, AND SMART CARD

• US 20090079053A1
• Filed: 09/17/2008
• Published: 03/26/2009
• Est. Priority Date: 09/20/2007
• Status: Active Grant

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: HUANG, Yucai
• Granted Patent: US 7,847,380 B2
• Time in Patent Office: Days
• US Class Current: 257/679
• CPC Class Codes: H01L 2224/05554 being square
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48228 the bond pad being disposed in a recess of the surface of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 23/3121 a substrate forming part of the encapsulation
• CPC Class Codes: H01L 23/49855 for flat-cards, e.g. credit cards cards per se G06K19/00
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/10161 with a rectangular active surface
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/207 Diameter ranges

Abstract

Provided are a tape substrate for a smart card, a method of fabricating the same, and a semiconductor module and a smart card using the tape substrate. The tape substrate includes at least one tape unit. The at least one tape unit includes a chip mounting unit defining a region on which a semiconductor chip is to be mounted, a plurality of pin electrode units arranged around the chip mounting unit and separated from one another, a border unit encircling the chip mounting unit and the pin electrode units, and a cutting unit disposed between the chip mounting unit and the border unit and between the pin electrode units and the border unit. The cutting unit includes a plurality of connection lines connecting the chip mounting unit and the pin electrode units to the border unit.

Claims