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METHOD AND STRUCTURE OF EXPANDING, UPGRADING, OR FIXING MULTI-CHIP PACKAGE

  • US 20090079055A1
  • Filed: 09/25/2007
  • Published: 03/26/2009
  • Est. Priority Date: 09/25/2007
  • Status: Active Grant
First Claim
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1. A system, comprising:

  • a multi-chip package (MCP) having a plurality of dies, a bottom package substrate for interfacing with a printed circuit board (PCB), and a top package substrate serving as an interface between the MCP and an add-on package; and

    an add-on package attached to the top package substrate of the multi-chip package to alter functionality of the multi-chip package.

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