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INTERCONNECT STRUCTURES WITH PATTERNABLE LOW-K DIELECTRICS AND METHOD OF FABRICATING SAME

  • US 20090079075A1
  • Filed: 09/20/2007
  • Published: 03/26/2009
  • Est. Priority Date: 09/20/2007
  • Status: Active Grant
First Claim
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1. An interconnect structure comprising:

  • at least one patterned and cured low-k dielectric material located on a surface of a patterned and cured antireflective coating located between said at least one patterned and cured low-k dielectric material and a substrate, said at least one cured and patterned low-k material and said patterned and cured antireflective coating having conductively filled regions embedded therein.

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