INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERPOSER
First Claim
Patent Images
1. An integrated circuit packaging system comprising:
- fabricating an interposer array having an access opening;
fabricating a base package substrate sheet;
attaching a first integrated circuit die over the base package substrate sheet;
mounting the interposer array over the first integrated circuit die; and
singulating a base package from the base package substrate sheet and the interposer array by cutting the access opening generally through the center.
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Accused Products
Abstract
An integrated circuit packaging system comprising: fabricating an interposer array having an access opening; fabricating a base package substrate sheet; attaching a first integrated circuit die over the base package substrate sheet; mounting the interposer array over the first integrated circuit die; and singulating a base package from the base package substrate sheet and the interposer array by cutting the access opening generally through the center.
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Citations
20 Claims
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1. An integrated circuit packaging system comprising:
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fabricating an interposer array having an access opening; fabricating a base package substrate sheet; attaching a first integrated circuit die over the base package substrate sheet; mounting the interposer array over the first integrated circuit die; and singulating a base package from the base package substrate sheet and the interposer array by cutting the access opening generally through the center. - View Dependent Claims (2, 3, 4, 5)
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6. An integrated circuit packaging system comprising:
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fabricating an interposer array having an access opening including forming an interposer bonding contact adjacent to the access opening; fabricating a base package substrate sheet including forming an upper surface contact on the base package substrate sheet; attaching a first integrated circuit die over the base package substrate sheet including applying an adhesive between the base package substrate sheet and the first integrated circuit die; mounting the interposer array over the first integrated circuit die including applying the adhesive between the interposer array and the first integrated circuit die; and singulating a base package from the base package substrate sheet and the interposer array by generally cutting the access opening through the center. - View Dependent Claims (7, 8, 9, 10)
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11. An integrated circuit packaging system comprising:
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a base package substrate sheet; a first integrated circuit die attached over the base package substrate sheet; an interposer array mounted over the first integrated circuit die; and a base package characterized in having been singulated from the base package substrate sheet and the interposer array includes an interposer having corners that extend to a singulation edge. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification