NOVEL CAPACITIVE ELEMENTS AND FILTERED FEEDTHROUGH ELEMENTS FOR IMPLANTABLE MEDICAL DEVICES

• US 20090079517A1
• Filed: 07/31/2008
• Published: 03/26/2009
• Est. Priority Date: 09/25/2007
• Status: Abandoned Application

• Current Assignee: Medtronic Incorporated (Medtronic Plc)
• Original Assignee: Medtronic Incorporated (Medtronic Plc)
• Inventors: IYER, RAJESH V.
• Application Number:
  US12/183,922
• Publication Number:
  US 20090079517A1
• Time in Patent Office: Days
• US Class Current: 333/182
• CPC Class Codes: A61N 1/3754 Feedthroughs
• CPC Class Codes: B23K 1/0016 Brazing of electronic components
• CPC Class Codes: B23K 1/008 Soldering within a furnace B23K1/012 takes precedence
• CPC Class Codes: B23K 2101/36 Electric or electronic devices
• CPC Class Codes: H01G 2/04 specially adapted for mounting on a chassis
• CPC Class Codes: H01G 2/106 Fixing the capacitor in a housing
• CPC Class Codes: H01G 4/224 Housing; Encapsulation
• CPC Class Codes: H01G 4/35 Feed-through capacitors or anti-noise capacitors
• CPC Class Codes: H03H 2001/0014 Capacitor filters, i.e. capacitors whose parasitic inductance is of relevance to consider it as filter

Abstract

A capacitive element for an implantable medical device feedthrough element includes a bore, to receive a feedthrough member, or pin of the filtered feedthrough element, an external surface extending laterally outward from a first opening of the bore, and a recessed area formed in the external surface and extending about an outer perimeter thereof. The recessed area may provide a location on which to apply a conductive material to form a joint that electrically couples the capacitive element to a ferrule of the filtered feedthrough element.

Claims

1. A method for forming a filtered feedthrough element for an implantable device, the method comprising:

providing a feedthrough subassembly that comprises a ferrule, an insulator, an and a pin wherein the insulator being coupled to the ferrule and the pin;

placing a capacitive element inside the ferrule such that the feedthrough pin slides through an inner diameter of the capacitive element;

introducing conductive material between the pin and the inner diameter of the capacitive element;

introducing conductive material between the outer diameter of the capacitive element and the ferrule, wherein the capacitive element includes at least one recessed area at the outer diameter of the capacitive element to form a subassembly; and

applying heat to the subassembly.

2. The method of claim 1, wherein the at least one recessed area being formed by a first side, and a second side with an angle theta therebetween, theta being about ≦

88 degrees.

3. The method of claim 2, wherein the at least one recessed area being formed by a first side, and a second side with an angle theta therebetween, theta being about ≦

70 degrees.

4. The method of claim 2, wherein the at least one recessed area being formed by a first side, and a second side with an angle theta therebetween, theta being about ≦

60 degrees.

5. The method of claim 2, wherein the at least one recessed area being formed by a first side, and a second side with an angle theta therebetween, theta being about ≦

50 degrees.

6. The method of claim 1 wherein the recessed area extending about a perimeter of the first external surface

7. The method of claim 1 wherein the conductive material comprises one of conductive epoxy and conductive polyimide.

8. A method for forming a filtered feedthrough element for an implantable device, the method comprising:

providing a feedthrough subassembly that comprises a ferrule, an insulator, an and a pin wherein the insulator being coupled to the ferrule and the pin;

placing a capacitive element inside the ferrule such that the feedthrough pin slides through an inner diameter of the capacitive element;

introducing a first solder perform over the feedthrough pin;

introducing a second solder perform in a gap between an outer diameter of the capacitive element and the ferrule, the capacitive element includes at least one recessed areas at the outer diameter of the capacitive element to form a subassembly; and

applying heat to the subassembly assembly.

9. The method of claim 8 wherein a temperature in an oven being about 150°

C. to about 550°

C.

10. The method of claim 8 wherein the first solder perform forms reflowed solder and provides an electrical connection between the capacitive element and the pin.

11. The method of claim 8 wherein the second solder perform forms reflowed solder and provides an electrical connection between the capacitive element and the ferrule.

12. The method of claim 11, wherein the at least one recessed area being formed by a first side, and a second side with an angle theta therebetween, theta being about ≦

88 degrees.

13. The method of claim 12, wherein the at least one recessed area being formed by a first side, and a second side with an angle theta therebetween, theta being about ≦

70 degrees.

15. The method of claim 13, wherein:

the conductive material comprises solder;

applying the solder comprises mounting a solder preform onto the recessed area; and

coupling the capacitive element to the ferrule further comprises heating the solder preform to re-flow the solder.

16. The method of claim 13, further comprising applying a layer of conductive material over the recessed area of the first external surface of the capacitive element, prior to mounting the solder preform.

17. The method of claim 16, wherein applying the layer of conductive material comprises sputtering a noble metal over the recessed area.

18. The method of claim 13, further comprising abutting a second external surface of the capacitive element against a shelf within the ferrule, the second external surface extending laterally outward from a second opening of the bore, and the shelf being spaced apart from the coupled insulator element.

19. The method of claim 18, further comprising mounting a substrate within the ferrule to form the shelf.

20. The method of claim 18, wherein the shelf being an integral part of the ferrule.

14. A method for manufacturing a filtered feedthrough element for an implantable device, the method comprising:

sealing an insulator element to a feedthrough member and to a ferrule, the insulator element extending around the member and within the ferrule;

inserting a capacitive element into the ferrule and around the member such that the member extends into a bore of the capacitive element; and

coupling the capacitive element to the ferrule by applying a conductive material onto a recessed area of a first external surface of the capacitive element, the first external surface extending laterally outward from a first opening of the bore, and the recessed area extending about a perimeter of the first external surface and being adjacent to the ferrule.

21. A method for manufacturing a filtered feedthrough assembly for an implantable medical device, the method comprising:

inserting a feedthrough pin into a bore of a capacitive element, the bore being an approximate line-to-line fit about the pin;

abutting a surface of the capacitive element directly against a shelf within a ferrule through which the pin extends, the shelf being spaced apart from an insulator element, the insulator element extending around the pin and within the ferrule, and being sealed to the pin and the ferrule; and

coupling the capacitive element to the pin and to the ferrule;

wherein the surface of the capacitive element extends outward from an opening of the bore and faces toward the insulator element.

22. The method of claim 21, further comprising mounting a substrate within the ferrule to form the shelf.