Forming a helical inductor
First Claim
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1. An apparatus comprising:
- a substrate having a first surface and a second surface, the substrate having a plurality of vias extending between the first surface and the second surface; and
at least one helical inductor adapted within a corresponding one of the plurality of vias, the helical inductor formed of a conductive material and extending between the first surface and the second surface.
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Abstract
In one embodiment, the present invention includes an apparatus having a substrate with vias extending between first and second surfaces thereof, and at least one helical inductor adapted within a via, which may be formed of a conductive material. Other embodiments are described and claimed.
26 Citations
14 Claims
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1. An apparatus comprising:
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a substrate having a first surface and a second surface, the substrate having a plurality of vias extending between the first surface and the second surface; and at least one helical inductor adapted within a corresponding one of the plurality of vias, the helical inductor formed of a conductive material and extending between the first surface and the second surface. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method comprising:
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forming a substrate having a first surface and a second surface, the substrate having a plurality of vias extending between the first surface and the second surface; forming at least one helical inductor adapted within a corresponding one of the plurality of vias, the helical inductor formed of a conductive material and extending between the first surface and the second surface. - View Dependent Claims (9, 10, 11, 12, 13, 14)
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Specification