Cooling Arrangement to Cool Components on Circuit Board
First Claim
Patent Images
1. A circuit board including:
- a board substrate;
a blower disposed on the board substrate, the blower having an inlet adapted to take in coolant in a inlet direction, and an outlet adapted to blow out coolant in a first outlet direction extending at an angle with respect to the inlet direction;
a heat-generating arrangement disposed on the board substrate such that the blower is adapted to blow out coolant in the first outlet direction to cool the heat generating arrangement.
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Abstract
A circuit board including a blower thereon to cool a heat generating arrangement. The circuit board includes a board substrate; a blower disposed on the board substrate, the blower having an inlet adapted to take in coolant in a inlet direction, and an outlet adapted to blow out coolant in a first outlet direction extending at an angle with respect to the inlet direction; and a heat-generating arrangement disposed on the board substrate such that the blower is adapted to blow out coolant in the first outlet direction to cool the heat generating arrangement.
16 Citations
15 Claims
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1. A circuit board including:
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a board substrate; a blower disposed on the board substrate, the blower having an inlet adapted to take in coolant in a inlet direction, and an outlet adapted to blow out coolant in a first outlet direction extending at an angle with respect to the inlet direction; a heat-generating arrangement disposed on the board substrate such that the blower is adapted to blow out coolant in the first outlet direction to cool the heat generating arrangement. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A system including:
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an electronic assembly comprising; a circuit board including; a board substrate; a blower disposed on the board substrate, the blower having an inlet adapted to take in coolant in a inlet direction, and an outlet adapted to blow out coolant in a first outlet direction extending at an angle with respect to the inlet direction; a heat-generating arrangement disposed on the board substrate such that the blower is adapted to blow out coolant in the first outlet direction to cool the heat generating arrangement; and a main memory coupled to the electronic assembly. - View Dependent Claims (14, 15)
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Specification