Method and Apparatus for Providing an Omni-Directional Lamp Having a Light Emitting Diode Light Engine

• US 20090080187A1
• Filed: 09/24/2008
• Published: 03/26/2009
• Est. Priority Date: 09/25/2007
• Status: Active Grant

• Current Assignee: Enertron, Inc.
• Original Assignee: Enertron, Inc.
• Inventors: Chou, Der Jeou
• Granted Patent: US 8,317,358 B2
• Time in Patent Office: Days
• US Class Current: 362/231
• CPC Class Codes: F21K 9/232 specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
• CPC Class Codes: F21V 29/51 using condensation or evaporation of a fluid, e.g. heat pipes
• CPC Class Codes: F21V 29/767 the planes containing the fins or blades having directions perpendicular to the light emitting axis
• CPC Class Codes: F21V 29/773 the planes containing the fins or blades having the direction of the light emitting axis
• CPC Class Codes: F21V 29/777 the planes containing the fins or blades having directions perpendicular to the light emitting axis
• CPC Class Codes: F21V 29/80 with pins or wires
• CPC Class Codes: F21Y 2107/00 Light sources with three-dimensionally disposed light-generating elements
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]

Abstract

An LED lamp includes a light engine. The light engine includes a substrate including a transparent or translucent thermally conductive material, a plurality of LED semiconductor devices mounted to the substrate, a plurality of conductive traces formed over the substrate to electrically interconnect each of the plurality of LED semiconductor devices, and conductive leads connected to the substrate for supplying electrical energy to the plurality of LED semiconductor devices. The substrate of the light engine may include an aluminum nitride (AlN), or diamond film material. A thermally conductive rod is connected to the light engine. A heatsink is formed by an extrusion or die casting process. The heatsink includes a fin structure for dissipating heat energy into the environment. The thermally conductive rod and the heatsink are thermally connected. An optional optical envelope is mounted to the heatsink. The optional optical envelope is disposed over the light engine.

Claims

1. A method of manufacturing a light emitting diode (LED) lamp, comprising:

providing a light engine, the light engine including;

a substrate including a transparent or translucent thermally conductive material,

a plurality of LED semiconductor devices mounted to the substrate,

a plurality of conductive traces formed over the substrate to electrically interconnect each of the plurality of LED semiconductor devices, and

conductive leads connected to the substrate for supplying electrical energy to the plurality of LED semiconductor devices;

connecting a thermally conductive rod to the light engine;

forming a heatsink by an extrusion, molding, stamping, or die casting process, the heatsink including a fin structure for dissipating heat energy into the environment; and

thermally connecting the thermally conductive rod and the heatsink.

2. The method of claim 1, including mounting an optical envelope to the heatsink, the optical envelope being disposed over the light engine.

3. The method of claim 2, including forming a reflector ring over an interior portion of the optical envelope, the reflector ring being disposed around the plurality of LED semiconductor devices of the light engine.

4. The method of claim 1, wherein the substrate of the light engine includes an aluminum nitride (AlN), aluminum oxide (Al2O3), fiber glass board, metal-clad dielectric board, or diamond film material.

5. The method of claim 1, wherein the fin structure of the heatsink includes flat leaf fins, wave lead fins, pin fins, flat disc fins, or wave disc fins.

6. The method of claim 1, wherein the plurality of LEDS are selected in accordance with a white light emitting method selected from red, green and blue (RGB) LED mixing, red, amber, green and blue (RAGB) LED mixing, blue LEDs coated with phosphor material, or ultra-violet (uV) LEDs coated with phosphor material.

7. The method of claim 1, wherein the substrate of the light engine includes a fluorescent or phosphorous material.

8. A method of manufacturing a light emitting diode (LED) lamp, comprising:

providing a light engine including a substrate and a plurality of LEDS mounted to the substrate;

connecting a thermally conductive structure to the light engine;

providing a heatsink having a fin structure for dissipating heat energy into the environment; and

thermally connecting the thermally conductive structure and the heatsink.

9. The method of claim 8, including mounting an optical envelope to the heatsink, the optical envelope being disposed over the light engine.

10. The method of claim 9, including forming a reflector ring over an interior portion of the optical envelope, the reflector ring being disposed around the plurality of LEDs of the light engine.

11. The method of claim 8, wherein the substrate of the light engine includes an aluminum nitride (AlN), aluminum oxide (Al2O3), fiber glass board, metal-clad dielectric board, or diamond film material.

12. The method of claim 8, wherein the fin structure of the heatsink includes flat leaf fins, wave lead fins, pin fins, flat disc fins, or wave disc fins.

13. The method of claim 8, wherein the plurality of LEDs are selected in accordance with a white light emitting method selected from red, green and blue (RGB) LED mixing, red, amber, green and blue (RAGB) LED mixing, blue LEDs coated with phosphor material, or ultra-violet (uV) LEDs coated with phosphor material.

14. The method of claim 8, wherein the substrate of the light engine includes a fluorescent or phosphorous material.

15. The method of claim 8, wherein the light engine includes:

a plurality of conductive traces formed over the substrate to electrically interconnect each of the plurality of LEDs; and

conductive leads connected to the substrate for supplying electrical energy to the plurality of LEDs.

16. A method of manufacturing a lamp, comprising:

providing a light source;

connecting a thermally conductive structure to the light source;

providing a heatsink for dissipating heat energy into the environment; and

thermally connecting the thermally conductive structure and the heatsink.

17. The method of claim 16, including mounting an optical envelope to the heatsink, the optical envelope being disposed over the light source.

18. The method of claim 16, wherein the light source includes a substrate, the substrate including an aluminum nitride (AlN), aluminum oxide (Al2O3), fiber glass board, metal-clad dielectric board, or diamond film material.

19. The method of claim 16, wherein the heatsink includes a fin structure, the fin structure including flat leaf fins, wave lead fins, pin fins, flat disc fins, or wave disc fins.

20. The method of claim 16, wherein the light source includes a plurality of LED semiconductor devices, the plurality of LEDs being selected in accordance with a white light emitting method selected from red, green and blue (RGB) LED mixing, red, amber, green and blue (RAGB) LED mixing, blue LEDs coated with phosphor material, or ultra-violet (uV) LEDs coated with phosphor material.

21. A light emitting diode (LED) lamp, comprising:

a light engine including a substrate and a plurality of LEDs mounted to the substrate;

a thermally conductive structure connected to the light engine;

a heatsink having a fin structure for dissipating heat energy into the environment, wherein the thermally conductive structure is thermally connected to the heatsink.

22. The LED lamp of claim 21, including an optical envelope mounted to the heatsink, the optical envelope being disposed over the light engine.

23. The LED lamp of claim 21, wherein the substrate of the light engine includes an aluminum nitride (AlN), aluminum oxide (Al2O3), fiber glass board, metal-clad dielectric board, or diamond film material.

24. The LED lamp of claim 21, wherein the fin structure of the heatsink includes flat leaf fins, wave lead fins, pin fins, flat disc fins, or wave disc fins.

25. The LED lamp of claim 21, wherein the plurality of LEDs are selected in accordance with a white light emitting method selected from red, green and blue (RGB) LED mixing, red, amber, green and blue (RAGB) LED mixing, blue LEDs coated with phosphor material, or ultra-violet (uV) LEDs coated with phosphor material.