×

PROCESS FOR FORMING THIN FILM ENCAPSULATION LAYERS

  • US 20090081356A1
  • Filed: 09/26/2007
  • Published: 03/26/2009
  • Est. Priority Date: 09/26/2007
  • Status: Abandoned Application
First Claim
Patent Images

1. A process of making a thin film encapsulation package for an OLED device by atomic layer deposition of a thin film material on an OLED device to be encapsulated, comprising simultaneously directing a series of gas flows along substantially parallel elongated output openings, wherein the series of gas flows comprises, in order, at least a first reactive gaseous material, an inert purge gas, and a second reactive gaseous material, optionally repeated a plurality of times, wherein the first reactive gaseous material is capable of reacting with a substrate treated with the second reactive gaseous material to form an encapsulating thin film, wherein the first reactive gaseous material is a volatile organo-metal precursor compound, wherein the process is carried out substantially at or above atmospheric pressure, and wherein the temperature of the substrate during deposition is under 250°

  • C.

View all claims
  • 2 Assignments
Timeline View
Assignment View
    ×
    ×