Temperature control modules for showerhead electrode assemblies for plasma processing apparatuses
First Claim
1. A temperature control module for a showerhead electrode assembly for a semiconductor material plasma processing chamber, the temperature control module comprising:
- a heater plate having a bottom surface adapted to be secured to a top surface of a top electrode of the showerhead electrode assembly, the top electrode having a plasma-exposed bottom surface, the heater plate including at least one heater adapted to supply heat to the top electrode to control the temperature of the top electrode;
a cooling plate having a top surface adapted to be secured to and thermally isolated from a bottom surface of a top plate forming a top wall of the plasma processing chamber, the cooling plate adapted to control the temperature of the heater plate and control heat conduction between the heater plate and the top electrode; and
at least one electrically and thermally conductive thermal choke located between, and in contact with, a top surface of the heater plate and a bottom surface of the cooling plate, the at least one thermal choke adapted to control heat conduction between the heater plate to the cooling plate.
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Accused Products
Abstract
A temperature control module for a showerhead electrode assembly for a semiconductor material plasma processing chamber includes a heater plate adapted to be secured to a top surface of a top electrode of the showerhead electrode assembly, and which supplies heat to the top electrode to control the temperature of the top electrode; a cooling plate adapted to be secured to and thermally isolated from a surface of a top plate of the showerhead electrode assembly, and to cool the heater plate and control heat conduction between the top electrode and heater plate; and at least one thermal choke adapted to control heat conduction between the heater plate and cooling plate.
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Citations
20 Claims
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1. A temperature control module for a showerhead electrode assembly for a semiconductor material plasma processing chamber, the temperature control module comprising:
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a heater plate having a bottom surface adapted to be secured to a top surface of a top electrode of the showerhead electrode assembly, the top electrode having a plasma-exposed bottom surface, the heater plate including at least one heater adapted to supply heat to the top electrode to control the temperature of the top electrode; a cooling plate having a top surface adapted to be secured to and thermally isolated from a bottom surface of a top plate forming a top wall of the plasma processing chamber, the cooling plate adapted to control the temperature of the heater plate and control heat conduction between the heater plate and the top electrode; and at least one electrically and thermally conductive thermal choke located between, and in contact with, a top surface of the heater plate and a bottom surface of the cooling plate, the at least one thermal choke adapted to control heat conduction between the heater plate to the cooling plate. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A showerhead electrode assembly for a plasma processing chamber, comprising:
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a top plate forming a top wall of the plasma processing chamber; a top electrode including a top surface and a plasma-exposed bottom surface; and a temperature control module comprising; a heater plate having a bottom surface secured to the top surface of the top electrode, the heater plate including at least one heater adapted to supply heat to the top electrode to control the temperature of the top electrode; a cooling plate having a top surface secured to and thermally isolated from a bottom surface of a top plate, the cooling plate adapted to control the temperature of the heater plate and control heat conduction between the heater plate and the top electrode; and at least one electrically and thermal conductive thermal choke located between, and in thermal contact with, a top surface of the heater plate and a bottom surface of the cooling plate, the at least one thermal choke adapted to control heat conduction between the heater plate and the cooling plate. - View Dependent Claims (9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
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19. A method of controlling the temperature of a top electrode of a showerhead electrode assembly in a plasma processing chamber containing a substrate support having a bottom electrode, the showerhead electrode assembly comprising a top plate forming a top wall of the plasma processing chamber, and a temperature control module located between and secured to the top plate and the top electrode, the method comprising:
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generating plasma in the plasma processing chamber in a gap between the top electrode and the substrate support; applying power from at least one power supply to at least one heater of a heater plate of the temperature control module to heat the top electrode; supplying a temperature-controlled liquid from at least one liquid source to liquid channels of a cooling plate of the temperature control module to control the temperature of the cooling plate; and controlling heat conduction (i) between the cooling plate and the top plate by thermally isolating the cooling plate from the top plate, (ii) between the cooling plate and the heater plate with at least one thermal choke located between the cooling plate and heater plate, and (iii) between the heater plate and the top electrode by controlling the temperature of the heater plate, to thereby maintain the top electrode at a desired temperature. - View Dependent Claims (20)
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Specification