CASING AND METHOD FOR MANUFACTURING SAME, AND ELECTRONIC DEVICE

• US 20090082075A1
• Filed: 09/16/2008
• Published: 03/26/2009
• Est. Priority Date: 09/25/2007
• Status: Abandoned Application

• Current Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Original Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Inventors: Takahashi, Fujio, Honda, Tomoko
• Application Number:
  US12/211,273
• Publication Number:
  US 20090082075A1
• Time in Patent Office: Days
• US Class Current: 455/575.700
• CPC Class Codes: H01Q 1/243 with built-in antennas
• CPC Class Codes: H01Q 1/40 Radiating elements coated with or embedded in protective material
• CPC Class Codes: H04M 1/0214 Foldable telephones, i.e. with body parts pivoting to an open position around an axis parallel to the plane they define in closed position combined with translation movement H04M1/0235
• CPC Class Codes: H04M 1/0283 for providing a decorative aspect, e.g. customization of casings, exchangeable faceplate

Abstract

A casing includes a molded body provided with a recess, a conductive layer provided in the recess, and a protection film provided to cover at least a non-recessed region in a surface of the molded body provided with the recess and a surface of the conductive layer. The protection film extends generally evenly over the non-recessed region and the surface of the conductive layer. A method manufacturing the same and an electronic device including the casing are provided.

Claims

1. A casing comprising:

a molded body provided with a recess;

a conductive layer provided in the recess; and

a protection film provided to cover at least a non-recessed region in a surface of the molded body provided with the recess and a surface of the conductive layer,

the protection film extending generally evenly over the non-recessed region and the surface of the conductive layer.

2. The casing according to claim 1, wherein the conductive layer has a thickness generally equal to the depth of the recess.

3. The casing according to claim 1, wherein the conductive layer includes a conductive adhesive layer and a plating layer laminated in this order.

4. The casing according to claim 3, wherein the plating layer contains copper.

5. The casing according to claim 1, wherein the molded body includes:

a first molded body having a generally even surface; and

a second molded body formed on the first molded body and having a penetrating opening which constitutes the recess.

6. The casing according to claim 5, wherein the conductive layer includes a conductive adhesive layer and a plating layer laminated in this order.

7. The casing according to claim 5, wherein adhesion strength between the first molded body and a plating foundation paste is higher than adhesion strength between the second molded body and the plating foundation paste.

8. The casing according to claim 7, wherein the conductive layer is a plating layer formed on the surface of the first molded body.

9. The casing according to claim 8, wherein the plating layer contains copper.

10. The casing according to claim 7, wherein

the first molded body includes an ABS resin, and

the second molded body includes a polycarbonate resin.

11. The casing according to claim 1, wherein the protection film is a coating film.

12. A method for manufacturing a casing, comprising:

forming a conductive layer in a recess provided in a surface of a molded body, the conductive layer having a thickness generally equal to the depth of the recess; and

forming a protection film to generally evenly cover a non-recessed region in the surface of the molded body provided with the recess and a surface of the conductive layer.

13. The method for manufacturing a casing according to claim 12, wherein the protection film is any one of a spray coating film, a pad printing coating film, a resin film, and an opaque film.

14. The method for manufacturing a casing according to claim 12, wherein the conductive layer includes an adhesive layer formed by curing a conductive adhesive dropped into the recess.

15. The method for manufacturing a casing according to claim 12, wherein the conductive layer includes:

an adhesive layer formed by curing a conductive adhesive dropped into the recess; and

a plating layer laminated to a surface of the adhesive layer.

16. The method for manufacturing a casing according to claim 12, wherein

the molded body includes:

a first molded body having a generally even surface; and

a second molded body formed on the first molded body and having a penetrating opening which constitutes the recess, and

the conductive layer is a plating layer selectively formed on a surface of the first molded body exposed to the opening of the second molded body.

17. An electronic device comprising:

a first casing;

a second casing combined with the first casing; and

an electrical circuit provided in an internal space formed between the first casing and the second casing,

at least one of the first casing and the second casing including;

a molded body provided with a recess;

a conductive layer provided in the recess; and

a protection film provided to cover at least a non-recessed region in a surface of the molded body provided with the recess and a surface of the conductive layer,

the protection film extending generally evenly over the non-recessed region and the surface of the conductive layer,

the first and second casing being combined so that the protection film is located on the outer surface side, and

the conductive layer being electrically connected to the electrical circuit.

18. The electronic device according to claim 17, wherein the conductive layer includes an antenna.

19. The electronic device according to claim 18, wherein the antenna is fed through a feed line of the electrical circuit.

20. The electronic device according to claim 18, wherein the antenna is fed through a capacitively coupled device of the electrical circuit.