Method and apparatus for providing temperature sensor module in a data communication system

• US 20090082693A1
• Filed: 12/29/2004
• Published: 03/26/2009
• Est. Priority Date: 12/29/2004
• Status: Abandoned Application

• Current Assignee: Abbott Diabetes Care Incorporated (Abbott Laboratories)
• Original Assignee: Therasense Incorporated (Abbott Laboratories)
• Inventors: Stafford, Gary Ashley
• Application Number:
  US11/026,766
• Publication Number:
  US 20090082693A1
• Time in Patent Office: Days
• US Class Current: 600/549
• CPC Class Codes: A61B 2560/0252 using ambient temperature
• CPC Class Codes: A61B 5/0008 Temperature signals
• CPC Class Codes: A61B 5/14532 for measuring glucose, e.g. by tissue impedance measurement
• CPC Class Codes: G01K 1/14 Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
• CPC Class Codes: G01K 1/16 Special arrangements for conducting heat from the object to the sensitive element

Abstract

Method and apparatus for providing temperature sensor module in a transmitter unit of a continuous glucose monitoring system includes a temperature probe portion provided with thermally conductive material such as thermally conductive epoxy provided in the temperature sensor module that is press fitted, insert molded, heat stacked, or attached by adhesive to the bottom portion of the transmitter housing. The temperature sensor module is substantially in physical contact with the patient'"'"'s skin, and thus is configured to detect the skin temperature corresponding to each measured blood glucose level from the sensor.

Claims

1. An apparatus, comprising:

an analyte data processing unit including a bottom housing configured for placement on a skin layer of a patient;

a temperature module coupled to the bottom housing, a portion of an outer wall of the temperature module configured to contact the skin layer of the patient, the temperature module including an inner cavity defined by an inner wall;

a conductive material provided substantially within the temperature module such that the inner cavity of the temperature module is filled with the conductive material; and

a temperature probe disposed within the conductive material in the inner cavity of the temperature module, the temperature probe positioned within the inner cavity to not contact the inner wall of the temperature module;

wherein a change in temperature on the skin layer of the patient is substantially and contemporaneously translated to the temperature probe; and

further

wherein the analyte data processing unit is configured to selectively modify one or more analyte related signals based on the temperature change.

2. The apparatus of claim 1, wherein the temperature module includes a thermally conductive material including one of stainless steel, aluminum, beryllium copper, gold, silver or plastic or combinations thereof.

3. The apparatus of claim 1 wherein the conductive material includes conductive epoxy.

4. The apparatus of claim 1 wherein the temperature probe includes a thermistor.

5. The apparatus of claim 1 further including a conductive wire having a first end and a second end, the first end of the conductive wire connected to the temperature probe, and the second end of the conductive wire configured to connect to one or more contacts on a circuit board.

6. The apparatus of claim 5 wherein the conductive wire includes one of a copper wire or thermocouple connection.

7. The apparatus of claim 1 wherein the temperature module is configured to one of press fit, insert mold, heat stack, and attach by adhesive, to the bottom surface such that a substantially water tight seal is formed.

8. An apparatus, comprising:

an analyte data processing unit including a bottom housing configured for placement on a skin layer of a patient;

a temperature module coupled to the bottom housing, a portion of an outer wall of the temperature module configured to contact the skin layer of the patient, the temperature module including an inner cavity defined by an inner wall;

a thermally conductive epoxy provided substantially within the temperature module such that the inner cavity of the temperature module is filled with the conductive epoxy;

a temperature probe disposed within the thermally conductive epoxy in the inner cavity of the temperature module, the temperature probe positioned within the inner cavity to not contact the inner wall of the temperature module; and

a conductive wire having a first end and a second end, the first end of the conductive wire connected to the temperature probe, and the second end of the conductive wire configured to connect to one or more contacts on a circuit board disposed in the analyte data processing unit;

wherein a change in temperature on the skin layer of the patient is substantially and contemporaneously translated to the one or more contacts on the circuit board via the conductive wire; and

further

wherein the analyte data processing unit is configured to selectively modify one or more analyte related signals based on the temperature change.

9. The apparatus of claim 8, wherein the temperature module includes a thermally conductive material including one of stainless steel, aluminum, beryllium copper, gold, silver or plastic or combinations thereof.

10. The apparatus of claim 8 wherein the temperature probe includes a thermistor.

11. The apparatus of claim 8 wherein the conductive wire includes one of a copper wire or thermocouple connection.

12. The apparatus of claim 8 wherein the temperature module is configured to one of press fit, insert mold, heat stack, or attach by adhesive, to a transmitter unit such that a substantially water tight seal is formed.

13. A method, comprising:

disposing an analyte data processing unit on a skin surface of a patients

providing a conductive material substantially within an inner cavity of a temperature module defined by an inner wall, the temperature module coupled to the analyte data processing unit; and

disposing a temperature probe substantially within the conductive material in the inner cavity of the temperature module such that the temperature probe does not contact the inner call of the temperature module;

wherein a change in temperature of the temperature module is substantially and contemporaneously translated to the temperature probe such that one or more analyte related signals received by the analyte data processing unit is selectively modified based on the temperature change.

14. The method of claim 13, wherein the temperature module includes a thermally conductive material including one of stainless steel, aluminum, beryllium copper, gold, silver or plastic or combinations thereof.

15. The method of claim 13 wherein the conductive material includes conductive epoxy.

16. The method of claim 13 wherein the temperature probe includes a thermistor.

17. The method of claim 13 further including the steps of:

connecting a first end of a conductive wire to the temperature probe; and

configuring a second end of the conductive wire for connection to one or more contacts on a circuit board.

18. The method of claim 17 wherein the conductive wire includes one of a copper wire or thermocouple connection.

19. The method of claim 13 further including the step of coupling the temperature module to the analyte data processing unit such that a substantially water tight seal is formed.

20. The method of claim 13 wherein the step of coupling the temperature module to the analyte data processing unit includes one of press fitting, insert molding, heat stacking, or attaching by adhesive, the temperature module to the analyte data processing unit.