Thermal Management of Implantable Medical Devices
First Claim
1. An implantable device adapted for implantation in a body, comprising:
- a conductor component that conducts an electrical current in response to the body in which that implantable device is implanted being subjected to an alternating electromagnetic field; and
a thermal management component in thermal contact with the conductor component and configured to manage excess heat generated by the conduction of the electrical current;
wherein the thermal management component comprises a material that undergoes a phase transition at a temperature between zero and ten degrees Celsius above the temperature of the body in which the implantable device is adapted to be implanted.
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Abstract
Systems and techniques for thermal management of implantable medical devices. In one aspect, an implantable device adapted for implantation in a body includes a conductor component that conducts an electrical current in response to the body in which that implantable device is implanted being subjected to an alternating electromagnetic field and a thermal management component in thermal contact with the conductor component and configured to manage excess heat generated by the conduction of the electrical current. The thermal management component comprises a material that undergoes a phase transition at a temperature above the temperature of the body in which the implantable device is adapted to be implanted.
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Citations
33 Claims
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1. An implantable device adapted for implantation in a body, comprising:
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a conductor component that conducts an electrical current in response to the body in which that implantable device is implanted being subjected to an alternating electromagnetic field; and a thermal management component in thermal contact with the conductor component and configured to manage excess heat generated by the conduction of the electrical current; wherein the thermal management component comprises a material that undergoes a phase transition at a temperature between zero and ten degrees Celsius above the temperature of the body in which the implantable device is adapted to be implanted. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29)
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30. An implantable device comprising:
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a first hermetically-sealed housing that houses an active component configured to perform medical activities; a second hermetically-sealed housing that houses a charging component configured to convert energy from outside a body in which the implantable device is implanted into energy that can be consumed by the active component, and a material that undergoes a phase transition at a temperature between zero and twenty degrees Celsius above the temperature of the body in which the implantable device is to be implanted; and an insulated conductor configured to conduct energy from the second hermetically-sealed housing to the active component housed in the first hermetically-sealed housing.
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31. An implantable device comprising:
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an active component configured to perform one or more medical activities; a charging component configured to convert energy from outside a body in which the implantable device is implanted into potential energy; and a thermal management component in thermal contact with the charging component and configured to manage excess heat generated by the charging component in converting energy from outside the body into potential energy, wherein the thermal management component comprises a material that undergoes a phase transition at a temperature between zero and ten degrees above the temperature of the body in which the implantable device is to be implanted. - View Dependent Claims (32, 33)
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Specification