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Thermal Management of Implantable Medical Devices

  • US 20090082832A1
  • Filed: 09/25/2008
  • Published: 03/26/2009
  • Est. Priority Date: 09/25/2007
  • Status: Abandoned Application
First Claim
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1. An implantable device adapted for implantation in a body, comprising:

  • a conductor component that conducts an electrical current in response to the body in which that implantable device is implanted being subjected to an alternating electromagnetic field; and

    a thermal management component in thermal contact with the conductor component and configured to manage excess heat generated by the conduction of the electrical current;

    wherein the thermal management component comprises a material that undergoes a phase transition at a temperature between zero and ten degrees Celsius above the temperature of the body in which the implantable device is adapted to be implanted.

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