Light emitting diode package with large viewing angle

• US 20090085053A1
• Filed: 12/04/2008
• Published: 04/02/2009
• Est. Priority Date: 01/25/2007
• Status: Abandoned Application

• Current Assignee: Solidlite Corp.
• Original Assignee: Solidlite Corp.
• Inventors: Chen, Hsing
• Application Number:
  US12/315,795
• Publication Number:
  US 20090085053A1
• Time in Patent Office: Days
• US Class Current: 257/99
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 33/50 Wavelength conversion elements
• CPC Class Codes: H01L 33/56 Materials, e.g. epoxy or silicone resin
• CPC Class Codes: H01L 33/60 Reflective elements

Abstract

A light emitting diode package with large viewing angle includes a substrate, a LED chip, transparent housing body, and phosphor matrix. The substrate has an upper surface with a first electrode and a second electrode and a lower surface opposite to the upper surface. The LED chip with a positive electrode and an opposite electrode, the LED chip is mounted on the upper surface of the substrate, and connected from the positive electrode to the first electrode of the substrate by wire, and connected from the negative electrode to the second electrode by wire. The transparent housing body is arranged on the upper surface of the substrate, and is formed with a cavity together with the substrate, so that the LED chip is within the cavity. And the phosphor matrix is inserted in the cavity to coat the LED chip, so that the light emitted from the LED chip may turn into white light through the phosphor matrix, and the white light from the LED chip may penetrate the laterals of the transparent housing body.

Claims

1. A light emitting diode package with large viewing angle, the light emitting diode package comprising:

a substrate having an upper surface with a first electrode and an second electrode and a lower surface opposite to the upper surface;

a LED chip with a positive electrode and a negative electrode, the LED chip mounted on the upper surface of the substrate, and connected from the positive electrode to the first electrode of the substrate by wire, and connected from the negative electrode to the second electrode by wire;

a transparent housing body arranged on the upper surface of the substrate, and formed with a cavity together with the substrate, so that the LED chip is within the cavity; and

a phosphor matrix inserted in the cavity to coat the LED chip, so that the light emitted from the LED chip may turn into white light through the phosphor matrix, and the white light from the LED chip may penetrate the laterals of the transparent housing body.