Semiconductor device and method for manufacturing the same
First Claim
1. A semiconductor device comprising:
- an integrated circuit;
a first antenna connected to the integrated circuit;
a pair of structure bodies,wherein the integrated circuit and the first antenna are interposed between the pair of structure bodies,wherein at least one first antistatic film is formed on at least one surface of one of the pair of structure bodies, andwherein at least one second antistatic film is formed on at least one surface of the other of the pair of structure bodies;
a second antenna provided so that one of the pair of structure bodies is interposed between the first antenna and the second antenna,wherein each of the pair of structure bodies is formed by impregnating a fiber body with a resin.
1 Assignment
0 Petitions
Accused Products
Abstract
A semiconductor device capable of wireless communication, which has high reliability in terms of resistance to external force, in particular, pressing force and can prevent electrostatic discharge in an integrated circuit without preventing reception of an electric wave. The semiconductor device includes an on-chip antenna connected to the integrated circuit and a booster antenna which transmits a signal or power included in a received electric wave to the on-chip antenna without contact. In the semiconductor device, the integrated circuit and the on-chip antenna are interposed between a pair of structure bodies formed by impregnating a fiber body with a resin. One of the structure bodies is provided between the on-chip antenna and the booster antenna. A conductive film having a surface resistance value of approximately 106 to 1014 Ω/cm2 is formed on at least one surface of each structure body.
-
Citations
33 Claims
-
1. A semiconductor device comprising:
-
an integrated circuit; a first antenna connected to the integrated circuit; a pair of structure bodies, wherein the integrated circuit and the first antenna are interposed between the pair of structure bodies, wherein at least one first antistatic film is formed on at least one surface of one of the pair of structure bodies, and wherein at least one second antistatic film is formed on at least one surface of the other of the pair of structure bodies; a second antenna provided so that one of the pair of structure bodies is interposed between the first antenna and the second antenna, wherein each of the pair of structure bodies is formed by impregnating a fiber body with a resin. - View Dependent Claims (3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
-
-
2. A semiconductor device comprising:
-
an integrated circuit; a first antenna connected to the integrated circuit; a pair of structure bodies, wherein the integrated circuit and the first antenna are interposed between the pair of structure bodies; and a second antenna provided so that one of the pair of structure bodies is interposed between the first antenna and the second antenna, wherein each of the pair of structure bodies is formed by impregnating a fiber body with a resin, and wherein when alternating current flows through one of the first antenna and the second antenna, induced electromotive force is generated by electromagnetic induction in the other of the first antenna and the second antenna. - View Dependent Claims (18, 19, 20, 21, 22, 23, 24, 25, 26)
-
-
27. A method of manufacturing a semiconductor device, comprising the steps of:
-
interposing an integrated circuit and a first antenna connected to the integrated circuit between a pair of structure bodies, wherein at least one first antistatic film is formed on at least one surface of one of the pair of structure bodies, and wherein at least one second antistatic film is formed on at least one surface of the other of the pair of structure bodies; and attaching a second antenna to one of the pair of structure bodies so that the one of the pair of structure bodies is interposed between the first antenna and the second antenna, wherein each of the pair of structure bodies is formed by impregnating a fiber body with a resin. - View Dependent Claims (28, 29, 30, 31, 32, 33)
-
Specification