GRAY LEVEL METHOD FOR SLM-BASED OPTICAL LITHOGRAPHY

• US 20090086307A1
• Filed: 10/24/2007
• Published: 04/02/2009
• Est. Priority Date: 08/24/2002
• Status: Active Grant

• Current Assignee: Chime Ball Technology Co., Ltd.
• Original Assignee: Maskless Lithography, Inc.
• Inventors: Meisburger, William Daniel
• Granted Patent: US 7,508,570 B1
• Time in Patent Office: Days
• US Class Current: 359/292
• CPC Class Codes: G03F 7/70216 Mask projection systems
• CPC Class Codes: G03F 7/70275 Multiple projection paths, e.g. array of projection systems, microlens projection systems or tandem projection systems
• CPC Class Codes: G03F 7/70283 Mask effects on the imaging process
• CPC Class Codes: G03F 7/70291 Addressable masks, e.g. spatial light modulators [SLMs], digital micro-mirror devices [DMDs] or liquid crystal display [LCD] patterning devices
• CPC Class Codes: G03F 7/70383 Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams maskless lithography using a programmable mask G03F7/70291
• CPC Class Codes: G03F 7/70466 Multiple exposures, e.g. combination of fine and coarse exposures, double patterning or multiple exposures for printing a single feature stitching G03F7/70475
• CPC Class Codes: G03F 7/70508 Data handling in all parts of the microlithographic apparatus, e.g. handling pattern data for addressable masks or data transfer to or from different components within the exposure apparatus
• CPC Class Codes: G03F 7/70558 Dose control, i.e. achievement of a desired dose

Abstract

An optical lithography system comprises a light source, a spatial light modulator, imaging optics and means for continuously moving a photosensitive substrate relative to the spatial light modulator. The spatial light modulator comprises at least one array of individually switchable elements. The spatial light modulator is continuously illuminated and an image of the spatial light modulator is continuously projected on the substrate; consequently, the image is constantly moving across the surface of the substrate. While the image is moving across the surface, elements of the spatial light modulator are switched such that a pixel on the surface of the substrate receives, in serial, doses of energy from multiple elements of the spatial light modulator, thus forming a latent image on the substrate surface. The imaging optics is configured to project a blurred image of the spatial light modulator on the substrate, enabling sub-pixel resolution feature edge placement.

Claims

1-79. -79. (canceled)

80. A lithographic method, comprising the steps of:

continuously illuminating a spatial light modulator, said spatial light modulator comprising an area array of individually switchable elements, wherein said elements of said spatial light modulator are arranged in rows and columns on a rectangular grid;

moving a substrate relative to said spatial light modulator, said substrate having a photosensitive coating, wherein the direction of movement of said substrate is neither parallel nor orthogonal to said columns of said elements of said spatial light modulator;

while said substrate is moving, projecting an image of said spatial light modulator on said photosensitive coating, said photosensitive coating comprising an area array of pixels, the size and configuration of said pixels corresponding to the projected spacing and configuration of individually switchable elements in said spatial light modulator; and

while said substrate is moving, switching said elements of said spatial light modulator, said switching being between at least two states, wherein a first state allows light to reach said substrate and a second state stops light from reaching said substrate, said switching being controlled to define features in said photosensitive coating, whereby, relative to said photosensitive coating, said image of said spatial light modulator moves across said photosensitive coating and a pixel in said photosensitive coating receives, in serial, doses of energy from multiple elements of said spatial light modulator;

wherein switching of said elements of said spatial light modulator is controlled to vary the number of elements of said spatial light modulator that serially contribute to the total dose of energy received by any pixel in said photosensitive coating, whereby some pixels in said photosensitive coating receive different, non-zero, total doses of energy.

81. A lithographic method as in claim 80, wherein said direction of movement of said substrate is at 45 degrees to said columns of said elements of said spatial light modulator.

82. A lithographic method as in claim 81, wherein said moving is controlled so that feature edges in said photosensitive coating are shifted by a sub-pixel distance from the pixel edges defined by said area array in said photosensitive coating.

83. A lithographic method as in claim 80, wherein said illuminating step is implemented by a lamp system comprising an arc lamp.

84. A lithographic method as in claim 83, further comprising the step of improving illumination uniformity.

85. A lithographic method as in claim 84, wherein said improving step is implemented by a light pipe positioned between said arc lamp and said spatial light modulator.

86. A lithographic method as in claim 84, wherein said improving step is implemented by a fly'"'"'s eye lens array positioned between said arc lamp and said spatial light modulator.

87. A lithographic method as in claim 80, wherein said illuminating step is implemented by a quasi-continuous laser.

88. A lithographic method as in claim 80, further comprising, while said stage is moving, keeping the distance between said photosensitive coating and said projection optics constant, whereby said image is focused on said photosensitive coating.

89. A lithographic method as in claim 80, wherein said switching of said elements of said spatial light modulator is controlled to compensate for non-uniform illumination of said spatial light modulator.

90. A lithographic method as in claim 80, wherein said projecting step is implemented by projection optics and wherein said switching of said elements of said spatial light modulator is controlled to compensate for distortion and aberrations in said projection optics.

91. A lithographic method as in claim 80, wherein said switching of said elements of said spatial light modulator is controlled to compensate for misalignment and distortion of said substrate.

92. A lithographic method as in claim 80, wherein said correspondence of said pixels to said individually switchable elements in said spatial light modulator is one-to-one.

93. A method as in claim 80, further comprising, prior to said projecting step:

measuring the distortion of said substrate; and

modifying a design data file to account for said substrate distortion;

wherein said design data file determines the position of said features defined in said photosensitive coating.

94. A method as in claim 80, further comprising, before said projecting step, aligning said substrate to projection optics, wherein said projecting of said image is implemented by said projection optics.

95. A method as in claim 94, wherein said aligning step comprises comparing arbitrary features on said substrate to images previously stored in a memory device.

96. A method as in claim 94, wherein said aligning step comprises comparing arbitrary features on said substrate to idealized images previously stored in a memory device.

97. A method as in claim 96, wherein said idealized images are selected from the group consisting of a cross and a circle.

98. A lithographic method, comprising the steps of:

continuously illuminating a spatial light modulator, said spatial light modulator comprising an area array of individually switchable elements;

moving a substrate relative to said spatial light modulator, said substrate having a photosensitive coating;

while said substrate is moving, projecting an image of said spatial light modulator on said photosensitive coating, said photosensitive coating comprising an area array of pixels, the size and configuration of said pixels corresponding to the projected spacing and configuration of individually switchable elements in said spatial light modulator;

while said substrate is moving, switching said elements of said spatial light modulator, said switching being between at least two states, wherein a first state allows light to reach said substrate and a second state stops light from reaching said substrate, said switching being controlled to define features in said photosensitive coating, whereby, relative to said photosensitive coating, said image of said spatial light modulator moves across said photosensitive coating and a pixel in said photosensitive coating receives, in serial, doses of energy from multiple elements of said spatial light modulator; and

blurring said image;

wherein switching of said elements of said spatial light modulator is controlled to vary the number of elements of said spatial light modulator that serially contribute to the total dose of energy received by any pixel in said photosensitive coating, whereby some pixels in said photosensitive coating receive different, non-zero, total doses of energy.

99. A lithographic method as in claim 98, wherein said projecting step is implemented by projection optics and wherein said blurring step is implemented by moving said photosensitive coating to a point of desired defocus along the optic axis of said projection optics.

100. A lithographic method as in claim 99, further comprising, while said stage is moving, keeping the distance between said photosensitive coating and said projection optics constant, whereby said desired defocus is maintained.

101. A lithographic method as in claim 98, wherein said blurring step is implemented by a diffuser positioned between said spatial light modulator and said photosensitive coating.

102. A lithographic method as in claim 98, wherein the widths of the instantaneous edge dose profiles of said features in said photosensitive coating are approximately equal to the widths of the corresponding resultant edge dose profiles.

103. A lithographic method as in claim 102, wherein the widths of said instantaneous edge dose profiles and said resultant edge dose profiles are measured from the 75% light intensity to the 25% light intensity points.

104. A lithographic method as in claim 98, wherein the instantaneous edge dose profiles of said features in said photosensitive coating are approximately Gaussian in shape.