CIRCUIT DEVICE, CIRCUIT MODULE, AND OUTDOOR UNIT

• US 20090086431A1
• Filed: 09/26/2008
• Published: 04/02/2009
• Est. Priority Date: 09/27/2007
• Status: Active Grant

• Current Assignee: Semiconductor Components Industries LLC (ON Semiconductor Corporation)
• Original Assignee: Sanyo Semiconductor Company Limited (ON Semiconductor Corporation), Sanyo Electric Company Limited (Panasonic Holdings Corporation)
• Inventors: Koike, Yasuhiro, Sakamoto, Hideyuki, Tsukizawa, Masao, Saito, Hidefumi
• Granted Patent: US 7,751,194 B2
• Time in Patent Office: Days
• US Class Current: 361/695
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/1305 Bipolar Junction Transistor [BJT]
• CPC Class Codes: H01L 2924/13055 Insulated gate bipolar transistor [IGBT]
• CPC Class Codes: H01L 2924/19105 in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H05K 1/144 Stacked arrangements of planar printed circuit boards
• CPC Class Codes: H05K 7/20009 using a gaseous coolant in electronic enclosures in cabinets of standardized dimensions H05K7/20536; in server cabinets H05K7/20709; in vehicle electronic casings H05K7/20845; in power control electronics H05K7/2089; in displays H05K7/20954

Abstract

Provided is a circuit device capable of increasing the packaging density and also suppressing the thermal interference between incorporated circuit elements. In a hybrid integrated circuit device, a first circuit board and a second circuit board are incorporated into a case member being arranged in a way that the first circuit board is overlaid with the second circuit board. A first circuit element is arranged on the upper face of the first circuit board and a second circuit element is arranged on the upper face of the second circuit board. In addition, inside the case member, a hollow portion (internal space) which is not filled with a sealing resin is provided, and this hollow portion communicates with the outside through a communicating opening, which is provided by partially opening the case member.

Claims

1. A circuit device, comprising:

a case member;

a first circuit board and a second circuit board incorporated into the case member and arranged in a way that the first circuit board is overlaid with the second circuit board;

a first circuit element fixedly secured to a principal face of the first circuit board; and

a second circuit element fixedly secured to a principal face of the second circuit board, wherein

a communicating opening for allowing an internal space of the case member to communicate with an outside is provided in the case member.

2. A circuit device, comprising:

a case member;

a first circuit board and a second circuit board incorporated into the case member and arranged in a way that the first circuit board is overlaid with the second circuit board;

a first circuit element, which is a power transistor, fixedly secured to a principal face of the first circuit board;

a second circuit element which is fixedly secured to a principal face of the second circuit board and controls an operation of the first circuit element;

a first sealing resin for sealing the first circuit element in the case member, the first circuit element being fixedly secured to the first circuit board; and

a second sealing resin for sealing the second circuit element which is fixedly secured to the second circuit board, wherein

a communicating opening for allowing an internal space of the case member to communicate with an outside is provided in the case member.

3. The circuit device according to claim 2, wherein the communicating opening is provided by partially opening a side wall part of the case member.

4. The circuit device according to claim 3, wherein the communicating opening is provided in each of two side walls of the case member, the two side walls facing each other.

5. The circuit device according to claim 2, wherein the second circuit element is an element having a lower operating temperature than the first circuit element.

6. A circuit device, comprising:

a case member;

a first circuit board and a second circuit board incorporated into the case member and arranged in a way that the first circuit board is overlaid with the second circuit board;

a first circuit element fixedly secured to a principal face of the first circuit board;

a second circuit element fixedly secured to a principal face of the second circuit board; and

an opening for allowing an internal space to communicate with the outside, the internal space being surrounded by the case member, the first circuit board, and the second circuit board, wherein

an inner wall of the case member is an inclined plane, the inner wall being provided with the opening.

7. The circuit device according to claim 6, further comprising

a sealing resin for covering the principal face of the first circuit board so as to seal the first circuit element, wherein

a hollow portion in which the sealing resin is not filled is provided in the internal space of the case member, and the hollow portion communicates with the outside through the opening.

8. The circuit device according to claim 7, wherein a plurality of openings each equivalent to the openings are provided.

9. A circuit module, comprising:

a case member formed of a pair of first side walls facing each other and a pair of second side walls united with the pair of first side walls, the case member having an upper opening and a lower opening;

a first module substrate which is fitted into the lower opening and on which a circuit element is mounted;

a second module substrate which is supported by a step portion provided on an inner wall of the case member and on which a circuit element is mounted; and

a cutout portion provided on a side wall of the case member above the second module substrate, wherein

the first module substrate is vertically installed,

the cutout portion is provided in each of a side wall positioned on the lower side and a side wall positioned on the upper side, and

a heat inside the circuit module is released to the outside from the cutout portion positioned on the upper side with an air flow path entering from the lower cutout portion.

10. The circuit module according to claim 9, wherein the first module board is made of a conductive material, while the second module board is made of a resin.

11. An outdoor unit comprising at least:

a chassis;

a fan secured to the chassis;

a compressor installed inside the chassis;

a frame provided in the chassis; and

a circuit module provided to the frame, wherein

the circuit module includes;

a case member formed of a pair of first side walls facing each other and a pair of second side walls united with the pair of first side walls, the case member having an upper opening and a lower opening;

a first module substrate which is fitted into the lower opening and on which a circuit element is mounted;

a second module substrate which is supported by a step portion provided in an inner wall of the case member and on which a circuit element is mounted; and

a cutout portion provided in a side wall of the case member above the second module substrate, wherein,

the first module substrate is vertically installed in the circuit modules,

the cutout portion is provided in each of a side wall positioned on the lower side and a side wall positioned on the upper side in the circuit modules, and

a heat inside the circuit module is released to the outside from the cutout portion positioned on the upper side with an air flow path entering from the lower cutout portion.

12. The outdoor unit according to claim 11, wherein the first module substrate is made of a metal substrate containing any one of Al and Cu as a primary material, while the second module substrate is a glass epoxy substrate.