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CIRCUIT MODULE

  • US 20090086442A1
  • Filed: 09/26/2008
  • Published: 04/02/2009
  • Est. Priority Date: 09/27/2007
  • Status: Active Grant
First Claim
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1. A circuit module comprising:

  • a first module substrate including a first substrate of metal, at least a top surface of the first substrate being electrically insulated, a plurality of first conductive patterns made of electrically-conductive material provided on the top surface of the first substrate, and a power semiconductor device electrically connected with the first conductive patterns and mounted on the first substrate;

    a second module substrate including a resin substrate, a plurality of second conductive patterns made of electrically-conductive material provided on a top surface of the resin substrate, and a drive device electrically connected with the second conductive patterns and controlling the power semiconductor device; and

    a casing member of resin holding opposed sides of the first module substrate and opposed sides of the second module substrate that is located above the first module substrate with a space in between, whereinthe drive device is positioned off the center of the resin substrate.

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