CIRCUIT MODULE
First Claim
Patent Images
1. A circuit module comprising:
- a first module substrate including a first substrate of metal, at least a top surface of the first substrate being electrically insulated, a plurality of first conductive patterns made of electrically-conductive material provided on the top surface of the first substrate, and a power semiconductor device electrically connected with the first conductive patterns and mounted on the first substrate;
a second module substrate including a resin substrate, a plurality of second conductive patterns made of electrically-conductive material provided on a top surface of the resin substrate, and a drive device electrically connected with the second conductive patterns and controlling the power semiconductor device; and
a casing member of resin holding opposed sides of the first module substrate and opposed sides of the second module substrate that is located above the first module substrate with a space in between, whereinthe drive device is positioned off the center of the resin substrate.
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Abstract
To improve reliability of a circuit module by improving heat release performance and minimizing thermal influence on a device to be mounted, a base substrate having a first substrate mounted thereon is fitted into a lower portion of casing member, and a second substrate is installed in the upper portion of the casing member so that a spaced area can be provided. In addition, a drive device to be installed on the second substrate is positioned off the center of the second substrate.
61 Citations
6 Claims
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1. A circuit module comprising:
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a first module substrate including a first substrate of metal, at least a top surface of the first substrate being electrically insulated, a plurality of first conductive patterns made of electrically-conductive material provided on the top surface of the first substrate, and a power semiconductor device electrically connected with the first conductive patterns and mounted on the first substrate; a second module substrate including a resin substrate, a plurality of second conductive patterns made of electrically-conductive material provided on a top surface of the resin substrate, and a drive device electrically connected with the second conductive patterns and controlling the power semiconductor device; and a casing member of resin holding opposed sides of the first module substrate and opposed sides of the second module substrate that is located above the first module substrate with a space in between, wherein the drive device is positioned off the center of the resin substrate.
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2. A circuit module comprising:
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a first module substrate including a base substrate of metal, at least a top surface of the base substrate being electrically insulated, a first substrate fixed on the base substrate with electric insulation, at least a top surface of the first substrate being electrically insulated, a plurality of first conductive patterns made of electrically-conductive material provided on the top surface of the first substrate, and a power semiconductor device electrically connected with the first conductive patterns and mounted on the first substrate; a second module substrate including a second substrate of resin, a plurality of second conductive patterns made of electrically-conductive material provided on a top surface of the second substrate, and a drive device electrically connected with the second conductive patterns and controlling the power semiconductor device; and a casing member of resin holding opposed sides of the first module substrate and opposed sides of the second module substrate that is located above the first module substrate with a space in between, wherein the drive device is positioned off the center of the second substrate. - View Dependent Claims (3)
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4. A circuit module comprising:
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a first module substrate including a Al base substrate with a rectangular shape, at least a top surface of the Al base substrate being electrically insulated, a first substrate of Al with a rectangular shape fixed onto the Al base substrate by an insulating adhesive and located inside a periphery of the base substrate, at least a top surface of the first substrate being electrically insulated, a plurality of first conductive patterns made of electrically-conductive material provided on the top surface of the first substrate, and a switching semiconductor device for an inverter, the switching semiconductor device electrically connected with the first conductive patterns and mounted on the first module substrate; a second module substrate including a second substrate of resin, a plurality of second conductive patterns made of electrically-conductive material provided on a top surface of the second substrate, and a microcomputer electrically connected with the second conductive patterns and controlling the switching semiconductor device; and a casing member of resin being shaped like a quadrangular prism having a hollow penetrating from an upper surface to a lower surface thereof with an opening portion, on the lower surface, abutting four sides of the base substrate, the casing member having a holding unit for holding a back surface of the second substrate inserted from an opening portion on the upper surface and located above the first module substrate with a space in between, wherein the microcomputer is positioned off the center of the second substrate. - View Dependent Claims (5, 6)
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Specification