CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME

• US 20090086455A1
• Filed: 09/26/2008
• Published: 04/02/2009
• Est. Priority Date: 09/27/2007
• Status: Active Grant

• Current Assignee: Semiconductor Components Industries LLC (ON Semiconductor Corporation)
• Original Assignee: Sanyo Semiconductor Company Limited (ON Semiconductor Corporation), Sanyo Electric Company Limited (Panasonic Holdings Corporation)
• Inventors: SAKAMOTO, Hideyuki, Koike, Yasuhiro, Tsukizawa, Masao, Saito, Hidefumi
• Granted Patent: US 8,102,670 B2
• Time in Patent Office: Days
• US Class Current: 361/796
• CPC Class Codes: H01L 2224/2612 Auxiliary members for layer connectors, e.g. spacers
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/1305 Bipolar Junction Transistor [BJT]
• CPC Class Codes: H01L 2924/13055 Insulated gate bipolar transistor [IGBT]
• CPC Class Codes: H01L 2924/19107 off-chip wires
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H05K 1/144 Stacked arrangements of planar printed circuit boards
• CPC Class Codes: H05K 2201/042 Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
• CPC Class Codes: H05K 2201/10166 Transistor
• CPC Class Codes: H05K 2201/10303 Pin-in-hole mounted pins
• CPC Class Codes: H05K 2201/10318 Surface mounted metallic pins
• CPC Class Codes: H05K 2201/10689 Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
• CPC Class Codes: H05K 2201/2018 Presence of a frame in a printed circuit or printed circuit assembly
• CPC Class Codes: H05K 3/284 for encapsulating mounted components H05K1/185 takes precedence
• CPC Class Codes: H05K 3/3447 Lead-in-hole components H05K3/3415 takes precedence
• CPC Class Codes: H05K 7/1432 specially adapted for power drive units or power converters
• CPC Class Codes: H05K 7/14322 wherein the control and power circuits of a power converter are arranged within the same casing
• CPC Class Codes: Y10T 29/49126 : Assembling bases

Abstract

Provided is a circuit device, in which circuit elements incorporated are electrically connected to each other via a lead so as to achieve both of the enhanced functionality and miniaturization. In a hybrid integrated circuit device, a first circuit board and a second circuit board are incorporated into a case member in a way that a first circuit board is overlaid with a second circuit board. A first circuit element is arranged on the upper face of the first circuit board and a second circuit element is arranged on the upper face of the second circuit board. Leads provided in the hybrid integrated circuit device include a lead connected only to the first circuit element mounted on the first circuit board, a lead connected only to the second circuit element mounted on the second circuit board, and a lead connected to both of the first circuit element and the second circuit element.

Claims

1. A circuit device, comprising:

a case member;

a first circuit board incorporated into the case member, the first circuit board having a first conductive pattern formed on a surface thereof;

a second circuit board arranged over the first circuit board and incorporated into the case member, the second circuit board having a second conductive pattern formed on a surface thereof;

a first circuit element mounted on the first circuit board and electrically connected to the first conductive pattern;

a second circuit element mounted on the second circuit board and electrically connected to the second conductive pattern; and

a lead fixedly secured to either one of the first circuit board and the second circuit board, wherein

the lead includes a lead connected to both of the first circuit element mounted on the first circuit board and the second circuit element mounted on the second circuit board.

2. The circuit device according to claim 1, wherein the lead includes

a first lead connected only to the first circuit element mounted on the first circuit board,

a second lead connected only to the second circuit element mounted on the second circuit board, and

a third lead connected to both of the first circuit element mounted on the first circuit board and the second circuit element mounted on the second circuit board.

3. The circuit device according to claim 2, further comprising

a sealing resin which is formed on an upper face of the second circuit board so as to cover the second circuit element, wherein

end portions of the first lead and the second lead penetrate the sealing resin to be guided to the outside, and an end portion of the third lead is positioned inside the sealing resin.

4. The circuit device according to claim 2, wherein

the first circuit element mounted on the first circuit board includes a power transistor,

the second circuit element mounted on the second circuit board includes a controlling element which generates a control signal for controlling the power transistor, and

the control signal is supplied to the power transistor via the third lead.

5. A circuit device, comprising:

a case member;

a first circuit board incorporated into the case member, the first circuit board having a first conductive pattern formed on a surface thereof;

a second circuit board arranged over the first circuit board and incorporated into the case member, the second circuit board having a second conductive pattern formed on a surface thereof;

a first circuit element mounted on the first circuit board and electrically connected to the first conductive pattern;

a second circuit element mounted on the second circuit board and electrically connected to the second conductive pattern;

a sealing resin which is formed on a surface of the second circuit board so as to seal the second circuit element; and

a lead having one end thereof being connected to the first conductive pattern on the surface of the first circuit board and having the other end thereof passing through a through-hole provided in the second circuit board to be guided to the outside, wherein

the lead includes a first lead electrically connected to the second circuit element mounted on an upper face of the second circuit board, and a second lead not electrically connected to the second circuit element mounted on the second circuit board, and

a bonding agent is filled in a gap between the first lead and the through-hole of the second circuit board, and a bonding agent is also filled in a gap between the second lead and the through-hole.

6. The circuit device according to claim 5, wherein both of the bonding agent filled in the gap between the first lead and the through-hole and the bonding agent filled in the gap between the second lead and the through-hole are solder.

7. The circuit device according to claim 5, wherein a pad formed of the second conductive pattern is provided in the periphery of the through-hole of the second circuit board.

8. A method of manufacturing a circuit device, comprising the steps of:

incorporating, into a case member, a first circuit board having a first conductive pattern and a first circuit element mounted on a surface thereof, the first circuit board having a lead fixedly secured to a pad formed of the first conductive pattern;

incorporating, into the case member, a second circuit board having a second conductive pattern and a second circuit element mounted on a surface thereof, and a through-hole formed therein, while causing the lead to pass through the through-hole in the second circuit board; and

forming a sealing resin on a surface of the second circuit board so as to cover the second conductive pattern and the second circuit element, wherein

the lead includes a first lead electrically connected to the second circuit element mounted on an upper face of the second circuit board, and a second lead not electrically connected to the second circuit element mounted on the second circuit board, and

in the step of fixedly securing the lead, a bonding agent is applied to both of a through-hole which the first lead penetrates, and a through-hole which the second lead penetrates, to cover both of the through-holes.

9. The method of manufacturing a circuit device according to claim 8, wherein in the step of forming the sealing resin, the sealing resin is applied, in a liquid or semi-solid state, to the surface of the second circuit board and is then cured.