DEPOSITION PROCESSES FOR TITANIUM NITRIDE BARRIER AND ALUMINUM
First Claim
1. A method for forming a conductive material on a substrate, comprising:
- positioning a substrate within a process chamber, wherein the substrate comprises a dielectric material disposed thereon, the dielectric material comprises an upper surface and apertures formed therein, and each aperture comprises a lower surface and sidewalls;
depositing a metallic titanium nitride layer on the upper surface of the dielectric material and on the lower surfaces and the sidewalls of the apertures during a first PVD process, wherein the first PVD process comprises generating a first plasma and flowing nitrogen gas at a flow rate of less than about 80 sccm during; and
depositing a titanium nitride retarding layer on the metallic titanium nitride layer during a second PVD process, wherein the second PVD process comprises generating a second plasma and flowing the nitrogen gas at a flow rate of about 80 sccm or greater, and depositing the titanium nitride retarding layer on the lower surfaces and sidewalls of the apertures at about 10% or less of the thickness as the titanium nitride retarding layer deposited across the field of the substrate.
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Accused Products
Abstract
Embodiments described herein provide a method for forming two titanium nitride materials by different PVD processes, such that a metallic titanium nitride layer is initially formed by a PVD process in a metallic mode and a titanium nitride retarding layer is formed over a portion of the metallic titanium nitride layer by a PVD process in a poison mode. Subsequently, a first aluminum layer, such as an aluminum seed layer, may be selectively deposited on exposed portions of the metallic titanium nitride layer by a CVD process. Thereafter, a second aluminum layer, such as an aluminum bulk layer, may be deposited on exposed portions of the first aluminum layer and the titanium nitride retarding layer during an aluminum PVD process.
382 Citations
45 Claims
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1. A method for forming a conductive material on a substrate, comprising:
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positioning a substrate within a process chamber, wherein the substrate comprises a dielectric material disposed thereon, the dielectric material comprises an upper surface and apertures formed therein, and each aperture comprises a lower surface and sidewalls; depositing a metallic titanium nitride layer on the upper surface of the dielectric material and on the lower surfaces and the sidewalls of the apertures during a first PVD process, wherein the first PVD process comprises generating a first plasma and flowing nitrogen gas at a flow rate of less than about 80 sccm during; and depositing a titanium nitride retarding layer on the metallic titanium nitride layer during a second PVD process, wherein the second PVD process comprises generating a second plasma and flowing the nitrogen gas at a flow rate of about 80 sccm or greater, and depositing the titanium nitride retarding layer on the lower surfaces and sidewalls of the apertures at about 10% or less of the thickness as the titanium nitride retarding layer deposited across the field of the substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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16. A method for forming a conductive material on a substrate, comprising:
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positioning a substrate within a process chamber, wherein the substrate comprises a dielectric material disposed thereon, the dielectric material comprises an upper surface and apertures formed therein, and each aperture comprises a lower surface and sidewalls; depositing a metallic titanium nitride layer on the upper surface of the dielectric material and on the lower surfaces and the sidewalls of the apertures during a first PVD process, wherein the metallic titanium nitride layer comprises a metallic titanium nitride material having the chemical formula of TixNy, where x is within a range from about 1.5 to about 2 and y is about 1; and depositing a titanium nitride retarding layer on the metallic titanium nitride layer deposited on the upper surface of the dielectric material during a second PVD process, wherein the titanium nitride retarding layer comprises a titanium nitride retarding material having the chemical formula of TixNy, where x is about 1 and y is within a range from about 1 to about 1.2. - View Dependent Claims (17, 18, 19, 20, 21, 22)
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23. A method for forming a conductive material on a substrate, comprising:
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positioning a substrate within a PVD chamber, wherein the substrate comprises a dielectric material disposed thereon, the dielectric material comprises an upper surface and apertures formed therein, and each aperture comprises a lower surface and sidewalls; depositing a metallic titanium nitride layer on the upper surface of the dielectric material and on the lower surfaces and the sidewalls of the apertures during a first PVD process within the PVD chamber, the first PVD process comprises; flowing nitrogen gas into the PVD chamber at a flow rate of less than about 80 sccm; applying a RF bias to the substrate; and applying a first DC power to a titanium target at a power level within a range from about 20 kW to about 40 kW to ignite a first plasma; and depositing a titanium nitride retarding layer on the metallic titanium nitride layer deposited on the upper surface of the dielectric material during a second PVD process within the PVD chamber, the second PVD process comprises; flowing the nitrogen gas into the PVD chamber at a flow rate of about 80 sccm or greater; removing the RF bias from the substrate; and applying a second first DC power to the titanium target at a power level within a range from about 5 kW to about 25 kW to ignite a second plasma. - View Dependent Claims (24, 25, 26)
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27. A method for forming a conductive material on a substrate, comprising:
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positioning a substrate within a process chamber, wherein the substrate comprises a dielectric material disposed thereon, the dielectric material comprises an upper surface and apertures formed therein, and each aperture comprises a lower surface and sidewalls; depositing a metallic titanium nitride layer on the upper surface of the dielectric material and on the lower surfaces and the sidewalls of the apertures during a first PVD process; depositing a titanium nitride retarding layer on the metallic titanium nitride layer deposited over the upper surface of the dielectric material while maintaining the lower surface of the apertures substantially free of the titanium nitride retarding layer during a second PVD process; depositing a first aluminum layer selectively on exposed portions of the metallic titanium nitride layer while maintaining the titanium nitride retarding layer free of the first aluminum layer during a CVD process; and depositing a second aluminum layer on the titanium nitride retarding layer and on the exposed portions of the first aluminum layer during another PVD process. - View Dependent Claims (28, 29, 30, 31, 32, 33, 34, 35)
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36. A method for forming a conductive material on a substrate, comprising:
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positioning a substrate within a PVD chamber, wherein the substrate comprises a dielectric material disposed thereon, the dielectric material comprises an upper surface and apertures formed therein, and each aperture comprises a lower surface and sidewalls; depositing a metallic titanium nitride layer on the upper surface of the dielectric material and on the lower surfaces and the sidewalls of the apertures during a PVD process, wherein the metallic titanium nitride material has the chemical formula of TixNy, where x is within a range from about 1.5 to about 2 and y is about 1, and the PVD process comprises; flowing nitrogen gas into the PVD chamber at a flow rate of less than about 80 sccm; applying a RF bias to the substrate; and applying a first DC power to a titanium target at a power level within a range from about 20 kW to about 40 kW to ignite a plasma; transferring the substrate into a CVD chamber; and depositing an aluminum layer on the metallic titanium nitride layer during a CVD process. - View Dependent Claims (37, 38, 39, 40, 41, 42, 43, 44, 45)
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Specification