INTRAVASCULAR PRESSURE DEVICES INCORPORATING SENSORS MANUFACTURED USING DEEP REACTIVE ION ETCHING

• US 20090088650A1
• Filed: 09/28/2007
• Published: 04/02/2009
• Est. Priority Date: 09/28/2007
• Status: Active Grant

• Current Assignee: Volcano Corporation (Koninklijke Philips N.V.)
• Original Assignee: Volcano Corporation (Koninklijke Philips N.V.)
• Inventors: Corl, Paul Douglas
• Granted Patent: US 9,289,137 B2
• Time in Patent Office: Days
• US Class Current: 600/486
• CPC Class Codes: A61B 5/0215 by means inserted into the body catheters A61M25/00
• CPC Class Codes: A61B 5/026 Measuring blood flow A61B3/1233, A61B3/1241 take precedence
• CPC Class Codes: A61B 5/6851 Guide wires
• CPC Class Codes: G01L 19/143 Two part housings
• CPC Class Codes: G01L 9/0054 integral with a semiconducting diaphragm

Abstract

An intravascular pressure sensor assembly is disclosed herein that is produced in part using photolithography and DRIE solid-state device production processes. Using DRIE production processes facilitates a number of features that could not be readily incorporated in sensor chips fabricated using mechanical saws. In accordance with a first feature, sensor chips are created with non-rectangular outlines. The sensor chip includes a widened portion that substantially abuts an inner wall of a sensor housing, and a cantilevered portion that is relatively narrow in relation to the widened portion. The non-rectangular outline of the sensor chip is formed using photolithography in combination with DRIE processing. In accordance with another feature, the sensor chip is positioned width-wise in the housing, thereby reducing a required length for the housing. In accordance with yet another feature, the sensor chip comprises one or more cutouts for receiving signal wires for connection to signal lead lines on the sensor chip. The outline of the sensor chip and the cutouts are formed using photolithography in combination with DRIE processing.

Claims

1. An intravascular pressure sensor assembly comprising:

a flexible elongate member including a proximal and a distal end;

a housing mounted at the distal end of the flexible elongate member; and

a sensor chip, contained within the housing, comprising;

a widened portion that substantially abuts an inner wall of the housing, and

a cantilevered portion that is relatively narrow in relation to the widened portion, the cantilevered portion including a diaphragm comprising at least one piezoresistive element; and

wherein one or more physical features of the sensor chip are formed using photolithography in combination with DRIE processing.

2. The intravascular pressure sensor of claim 1 wherein the one or more physical features comprises:

a transition between a relatively wide width of the widened portion and a relatively narrow width of the cantilevered portion thereby providing strain relief for the cantilevered portion with regard to the inner wall of the housing.

3. The intravascular pressure sensor of claim 2 wherein the transition includes a curved section.

4. The intravascular pressure sensor of claim 1 wherein the widened portion includes one or more notches.

5. The intravascular pressure sensor of claim 1 wherein the widened portion includes a textured edge.

6. The intravascular pressure sensor of claim 1 wherein the flexible elongate member is a guidewire.

7. An intravascular pressure sensor assembly comprising:

a flexible elongate member including a proximal and a distal end;

a housing mounted at the distal end of the flexible elongate member; and

a sensor chip, contained by the housing, including a diaphragm including at least one piezoresistive element, wherein the sensor chip is positioned width-wise in the housing, thereby reducing a required length for the housing, and wherein an outline of the sensor chip is formed using photolithography in combination with DRIE processing.

8. The intravascular pressure sensor of claim 7 wherein the one or more physical features comprises:

one or more cutouts for receiving signal wires for connection to signal lead lines on the sensor chip.

9. The intravascular pressure sensor of claim 8 wherein the one or more cutouts comprises a single slot cutout which receives a set of signal lines.

10. The intravascular pressure sensor of claim 8 wherein the one or more cutouts comprises a set of cutouts wherein each cutout is provided for each one of a set of distinct signal lines.

11. The intravascular pressure sensor of claim 10 wherein ones of the set of cutouts are positioned proximate a perimeter of the sensor chip.

12. The intravascular pressure sensor of claim 10 wherein ones of the set of cutouts are positioned in close proximity to one another.

13. The intravascular pressure sensor of claim 7 wherein the sensor chip outline is circular, and sized to substantially abut an inner wall of the housing.

14. The intravascular pressure sensor of claim 7 wherein the housing is mounted at a distal tip of the flexible elongate member.

15. The intravascular pressure sensor of claim 14 wherein the diaphragm faces outwardly from the housing.

16. The intravascular pressure sensor of claim 14 wherein the diaphragm faces inwardly from the housing.

17. The intravascular pressure sensor of claim 7 wherein the one or more physical features comprises:

one or more cutouts for receiving signal wires for connection to signal lead lines on the sensor chip.

18. An intravascular pressure sensor assembly comprising:

a flexible elongate member including a proximal and a distal end;

a housing mounted at the distal end of the flexible elongate member; and

a sensor chip, contained by the housing, including a diaphragm including at least one piezoresistive element, wherein the sensor chip comprises one or more cutouts for receiving signal wires for connection to signal lead lines on the sensor chip, and wherein the cutouts are formed using photolithography in combination with DRIE processing.

19. The intravascular pressure sensor of claim 18 wherein the one or more cutouts comprises a single slot cutout which receives a set of signal lines.

20. The intravascular pressure sensor of claim 18 wherein the one or more cutouts comprises a set of cutouts wherein each cutout is provided for each one of a set of distinct signal lines.

21. The intravascular pressure sensor of claim 20 wherein ones of the set of cutouts are positioned proximate a perimeter of the sensor chip.

22. The intravascular pressure sensor of claim 20 wherein ones of the set of cutouts are positioned in close proximity to one another.