In-mould molding touch module and method for manufacturing the same

• US 20090090000A1
• Filed: 12/22/2007
• Published: 04/09/2009
• Est. Priority Date: 10/09/2007
• Status: Abandoned Application

• Current Assignee: TPK Touch Solutions (Xiamen) Inc. (TPK Holding Co., Ltd.)
• Original Assignee: TPK Touch Solutions (Xiamen) Inc. (TPK Holding Co., Ltd.)
• Inventors: Lee, Min-Yi, SU, Sheng-Pin
• Application Number:
  US11/963,793
• Publication Number:
  US 20090090000A1
• Time in Patent Office: Days
• US Class Current: 29/832
• CPC Class Codes: H01H 2009/0285 Casings overmoulded over assembled switch or relay
• CPC Class Codes: H05K 5/0017 with operator interface units
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49156 with selective destruction of conductive paths

Abstract

An in-mould molding touch module includes a transparent conducting substrate and a molding rind. The transparent conducting substrate has an inner surface and an outer surface. The inner surface has a capacitive electrode layer formed thereon. The capacitive electrode layer is a touch sense circuit made of ITO, and the outer surface is configured for touching the touch sense circuit. The molding rind is integrated to contain a periphery of the transparent conducting substrate by an in-mould injecting mode.

Claims

1. An in-mould molding touch module comprising:

a transparent conducting substrate having an inner surface and an outer surface, the inner surface having a capacitive electrode layer formed thereon, the capacitive electrode layer being a touch sense circuit made of ITO, and the outer surface being configured for touching the touch sense circuit; and

a molding rind integrated to contain a periphery of the transparent conducting substrate by an in-mould injecting mode.

2. The in-mould molding touch module as claimed in claim 1, wherein the substrate is comprised of a transparent glass thin film.

3. The in-mould molding touch module as claimed in claim 1, wherein the ITO is coated on the inner surface of the substrate by a vacuum sputtering mode.

4. The in-mould molding touch module as claimed in claim 1, wherein the rind has a display unit arranged therein.

5. The in-mould molding touch module as claimed in claim 1, wherein the rind touch sense circuit is made of ITO.

6. A method for manufacturing an in-mould molding touch module, comprising:

(1) selecting a transparent substrate having an outer surface for being touched, and an inner surface;

(2) coating a transparent ITO layer on the inner surface of the substrate by a vacuum sputtering mode;

(3) exposuring, developing and etching the ITO layer to form a touch sense circuit on the substrate for being served as a touch electrode layer of the substrate; and

(4) inserting the substrate having the electrode layer coated thereon into a cavity of an injecting device, and injecting a molding material into the cavity to form a molding rind integrated to contain a periphery of the substrate having the electrode layer coated thereon.

7. The method as claimed in claim 6, wherein the substrate is comprised of a transparent glass thin film.

8. The method as claimed in claim 6, wherein the rind includes a display unit configured for displaying images through transparent electrode layer and the substrate.