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Bandage type sensor arrangement and carrier assembly therefore, and method of manufacture

  • US 20090090193A1
  • Filed: 10/04/2007
  • Published: 04/09/2009
  • Est. Priority Date: 10/04/2007
  • Status: Active Grant
First Claim
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1. A bandage type sensor for application to a flexible substrate for monitoring deformation of the substrate comprisinga sensor having at least two movable parts relative to each other to provide indications of displacements there between;

  • a carrier assembly comprising a thin flexible material including at least first and second pads having a readily detachable connection to the substrate, each pad being adapted to receive an adhesive for attachment of the pads to separate sensor parts, anda cover extending over the sensor and portions of the carrier assembly, and secured to parts of the carrier assembly.

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