System and Method for Assembling a Microthermoelectric Device
First Claim
1. A method for creating an array of thermoelectric elements, comprising:
- providing a rigid block including P-type material layers and N-type material layers stacked in an alternating relationship and bonded together by an adhesive;
forming first channels in the block parallel to the P-type material layers and the N-type material layers, the first channels partially extending through a depth of the block leaving an uncut bottom on the block;
filling the first channels with an electrically and thermally insulating material;
forming second channels in the block transverse to the first channels, the second channels partially extending through the depth of the block;
filling the second channels with the electrically and thermally insulating material; and
removing the uncut bottom from the block.
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Accused Products
Abstract
A method for creating an array of thermoelectric elements may include providing a rigid block including P-type material layers and N-type material layers stacked in an alternating relationship and bonded together by an adhesive. First channels may be formed in the block parallel to the P-type material layers and the N-type material layers and may partially extend through a depth of the block leaving an uncut bottom on the block. The first channels may be filled with an electrically and thermally insulating material and second channels may be formed in the block, transverse to the first channels. The second channels may partially extend through the depth of the block. The second channels may be filled with the electrically and thermally insulating material and the uncut bottom may be removed from the block.
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Citations
20 Claims
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1. A method for creating an array of thermoelectric elements, comprising:
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providing a rigid block including P-type material layers and N-type material layers stacked in an alternating relationship and bonded together by an adhesive; forming first channels in the block parallel to the P-type material layers and the N-type material layers, the first channels partially extending through a depth of the block leaving an uncut bottom on the block; filling the first channels with an electrically and thermally insulating material; forming second channels in the block transverse to the first channels, the second channels partially extending through the depth of the block; filling the second channels with the electrically and thermally insulating material; and removing the uncut bottom from the block. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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16. A method for creating an array of thermoelectric elements, comprising:
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providing P-type wafers and N-type wafers; applying the adhesive to the P-type wafers and N-type wafers; stacking the P-type wafers and N-type wafers in an alternating relationship; pressing the P-type wafers and N-type wafers together to decrease widths of the bond lines between the P-type wafers and N-type wafers; curing the adhesive to form a P/N-type ingot; cutting a rigid block from the P/N-type ingot including P-type material layers and N-type material layers stacked in an alternating relationship and bonded together by the adhesive; and creating an array P-type elements and N-type elements from the rigid block. - View Dependent Claims (17, 18, 19)
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20. A method for creating an array of thermoelectric elements, comprising:
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first, providing a rigid block including P-type material layers and N-type material layers stacked in an alternating relationship and bonded together by an adhesive; second, forming first channels in the block parallel to the P-type material layers and the N-type material layers, the first channels partially extending through a depth of the block leaving an uncut bottom on the block; third, filling the first channels with an electrically and thermally insulating material; fourth, curing the electrically and thermally insulating material applied in the third step; fifth, forming second channels in the block transverse to the first channels, the second channels partially extending through the depth of the block; sixth, filling the second channels with the electrically and thermally insulating material; seventh curing the electrically and thermally insulating material applied in the sixth step; and eighth, removing the uncut bottom from the block, wherein the steps are performed in the order in which they are numbered.
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Specification