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Methods for Fabricating Contacts to Pillar Structures in Integrated Circuits

  • US 20090091037A1
  • Filed: 10/03/2007
  • Published: 04/09/2009
  • Est. Priority Date: 10/03/2007
  • Status: Active Grant
First Claim
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1. A method of forming a pillar structure that is contacted by a vertical contact in an integrated circuit, the method comprising the steps of:

  • forming a hard mask, the hard mask comprising carbon;

    utilizing the hard mask to pattern at least a portion of the pillar structure;

    removing the hard mask; and

    depositing a conductive material into a region previously occupied by the hard mask to form the vertical contact.

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