Solution Of Power Consumption Reduction For Inverter Covered By Metal Case

• US 20090091415A1
• Filed: 12/15/2008
• Published: 04/09/2009
• Est. Priority Date: 04/25/2006
• Status: Active Grant

• Current Assignee: Dell Products LP (Dell Technologies Inc.)
• Original Assignee: Dell Products LP (Dell Technologies Inc.)
• Inventors: Huang, Wen-Hung, Lin, Hsien Tsung, Kuo, Ming-Chu
• Granted Patent: US 8,080,864 B2
• Time in Patent Office: Days
• US Class Current: 336/84.00M
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 1/18 Printed circuits structurally associated with non-printed electric components H05K1/0201, H05K1/023, H05K1/0243, and H05K1/16 take precedence
• CPC Class Codes: H05K 2201/086 for inductive purposes, e.g. printed inductor with ferrite core
• CPC Class Codes: H05K 2201/1003 Non-printed inductor
• CPC Class Codes: H05K 2201/10371 Shields or metal cases
• CPC Class Codes: Y10T 29/4902 Electromagnet, transformer or inductor

Abstract

For improving efficiency of a power device having an exposed surface capable of radiating energy, a shielding layer is disposed in between the exposed surface and a conductive layer. The shielding layer causes at least a portion of the energy to be directed back into the power device, thereby substantially preventing the energy from inducing eddy currents in the conductive layer. The conductive layer is fabricated from a metal foil for compliance with electromagnetic energy leakage regulations.

Claims

1. A method for improving efficiency of a power device in an information handling system (IHS), the method comprising:

providing a processor and a power supply system operable to provide power to the processor;

providing the power device having an exposed surface, the exposed surface being capable of radiating energy;

placing a shielding layer above the exposed surface; and

placing a conductive layer above the shielding layer, wherein the shielding layer causes at least a portion of the energy to be directed back into the power device thereby improving the efficiency.

2. The method of claim 1, wherein the conductive layer is fabricated from a metal foil, wherein the metal foil is an aluminum foil.

3. The method of claim 1, wherein the conductive layer is fabricated from an alloy of aluminum (AL) and magnesium (MG).

4. The method of claim 1, wherein the shielding layer is a magnetic shield.

5. The method of claim 1, wherein the shielding layer is fabricated from at least one of a ferrite sheet and a ferrite core.

6. The method of claim 5, wherein the ferrite sheet is approximately 0.25 millimeters thick.

7. The method of claim 1, wherein the energy that is directed back is magnetic.

8. The method of claim 1, wherein the shielding layer substantially limits the energy from inducing eddy currents in the conductive layer.

9. The method of claim 1, wherein the power device is a transformer, the transformer being included in an inverter, the inverter providing power to a liquid crystal display (LCD) panel.

10. A power supply system comprising:

a power device having an exposed surface capable of radiating energy;

a shielding layer disposed above the exposed surface, wherein the shielding layer causes at least a portion of the energy to be directed back into the power device; and

a conductive layer disposed above the shielding layer.

11. The power supply system of claim 10, wherein the conductive layer is fabricated from a metal foil, wherein the metal foil is an aluminum foil.

12. The power supply system of claim 10, wherein the shielding layer substantially limits the energy from inducing eddy currents in the conductive layer.

13. The power supply system of claim 10, wherein the shielding layer is a magnetic shield.

14. The power supply system of claim 10, wherein the shielding layer is fabricated from at least one of a ferrite sheet and a ferrite core.

15. The power supply system of claim 14, wherein the ferrite sheet is approximately 0.25 millimeters thick.