ELECTRONIC DEVICE PACKAGING AND CURABLE RESIN COMPOSITION
First Claim
1. A process for packaging an electronic device comprising the steps of:
- preparing a printed wiring board which has wiring copper layers coated with a metal layer comprising a metal other than copper;
coating the metal layer with an insulating protective resin layer, keeping an area for mounting an electronic device exposed;
mounting the electronic device on the exposed area via an electroconductive material; and
coating the mounted electronic device and a portion of the insulating protective resin layer with an encapsulant;
wherein the insulating protective resin layer is produced by employing at least one of the following resin compositions (1) to (3);
(1) a resin composition comprising 100 weight parts of an organic solvent-soluble resin having a polysiloxane skeleton and a polar group, 0.5 to 30 weight parts of an epoxy compound having an epoxy equivalent of more than 800, and an organic solvent;
(2) a resin composition comprising 100 weight parts of an organic solvent-soluble resin having a polysiloxane skeleton and a polar group, 0.1 to 10 weight parts of an epoxy compound having an epoxy equivalent of 100 to 800, 2 to 30 weight parts of a polyvalent isocyanate compound, and an organic solvent; and
(3) a resin composition comprising 100 weight parts of an organic solvent-soluble resin having a polysiloxane skeleton and a polar group, 0.1 to 20 weight parts of an epoxy compound having an epoxy equivalent of more than 800, 2 to 30 weight parts of a polyvalent isocyanate compound, and an organic solvent.
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Accused Products
Abstract
A process for packaging an electronic device employs an insulating protective resin layer produced from one or more of the resin compositions: (1) 100 parts of an organic solvent-soluble resin having a polysiloxane skeleton and a polar group, 0.5 to 30 parts of an epoxy compound having an epoxy equivalent of more than 800, and an organic solvent, (2) 100 parts of an organic solvent-soluble resin having a polysiloxane skeleton and a polar group, 0.1 to 10 parts of an epoxy compound having an epoxy equivalent of 100 to 800, 2 to 30 weight parts of a polyvalent isocyanate compound, and an organic solvent; and (3) 100 parts of an organic solvent-soluble resin having a polysiloxane skeleton and a polar group, 0.1 to 20 parts of an epoxy compound having an epoxy equivalent of more than 800, 2 to 30 parts of a polyvalent isocyanate compound, and an organic solvent.
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Citations
7 Claims
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1. A process for packaging an electronic device comprising the steps of:
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preparing a printed wiring board which has wiring copper layers coated with a metal layer comprising a metal other than copper; coating the metal layer with an insulating protective resin layer, keeping an area for mounting an electronic device exposed; mounting the electronic device on the exposed area via an electroconductive material; and coating the mounted electronic device and a portion of the insulating protective resin layer with an encapsulant; wherein the insulating protective resin layer is produced by employing at least one of the following resin compositions (1) to (3); (1) a resin composition comprising 100 weight parts of an organic solvent-soluble resin having a polysiloxane skeleton and a polar group, 0.5 to 30 weight parts of an epoxy compound having an epoxy equivalent of more than 800, and an organic solvent; (2) a resin composition comprising 100 weight parts of an organic solvent-soluble resin having a polysiloxane skeleton and a polar group, 0.1 to 10 weight parts of an epoxy compound having an epoxy equivalent of 100 to 800, 2 to 30 weight parts of a polyvalent isocyanate compound, and an organic solvent; and (3) a resin composition comprising 100 weight parts of an organic solvent-soluble resin having a polysiloxane skeleton and a polar group, 0.1 to 20 weight parts of an epoxy compound having an epoxy equivalent of more than 800, 2 to 30 weight parts of a polyvalent isocyanate compound, and an organic solvent. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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Specification