DISC RESONATOR GYROSCOPE WITH IMPROVED FREQUENCY COINCIDENCE AND METHOD OF MANUFACTURE
First Claim
1. A method of manufacturing a disc resonator gyroscope (DRG) that produces improved geometric symmetry of the gyroscope, comprising:
- forming a resonator device wafer,forming a substrate base wafer having a patterned metal bonding layer on one surface thereof, the patterned metal bonding layer having a first symmetry;
bonding said resonator device wafer to said patterned metal bonding layer;
etching said resonator device wafer in accordance with a pattern having a second symmetry to remove regions of material from said resonator device wafer, said second symmetry having a relationship to said first symmetry; and
said first and second symmetries enhancing thermal symmetry in said resonator device wafer during said etching operation to reduce geometric asymmetry in said resonator device wafer during said etching operation.
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Accused Products
Abstract
A disc resonator gyroscope (DRG) and method of manufacture. The DRG has a surrounding pattern of bond metal having a symmetry related to the symmetry of a resonator device wafer that enables more even dissipation of heat from a resonator device wafer of the DRG during an etching operation. The metal bond frame eliminates or substantially reduces the thermal asymmetry that the resonator device wafer normally experiences when a conventional, square bond frame is used, which in turn can cause geometric asymmetry in the widths of the beams that are etched into the resonator device wafer of the DRG.
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Citations
22 Claims
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1. A method of manufacturing a disc resonator gyroscope (DRG) that produces improved geometric symmetry of the gyroscope, comprising:
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forming a resonator device wafer, forming a substrate base wafer having a patterned metal bonding layer on one surface thereof, the patterned metal bonding layer having a first symmetry; bonding said resonator device wafer to said patterned metal bonding layer; etching said resonator device wafer in accordance with a pattern having a second symmetry to remove regions of material from said resonator device wafer, said second symmetry having a relationship to said first symmetry; and said first and second symmetries enhancing thermal symmetry in said resonator device wafer during said etching operation to reduce geometric asymmetry in said resonator device wafer during said etching operation. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. A method of manufacturing a disc resonator gyroscope (DRG) that produces improved geometric symmetry of the gyroscope, comprising:
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forming a resonator device wafer; forming a substrate base wafer on one surface thereof having a circumferential metal bonding layer, the circumferential metal bonding layer further being formed about a peripheral area where said resonator device wafer will be attached to said substrate base wafer in a subsequent manufacturing operation; bonding said resonator device wafer to said substrate base wafer; forming a pattern that defines areas of material that need to be removed from said resonator device wafer to form resonator elements that are responsive to mechanical vibration energy; using said pattern to etch said resonator device wafer so that said resonator device wafer has a symmetry related to said circumferential metal bonding layer, and such that regions of material of said resonator device wafer are removed from said resonator device wafer to form said resonator elements; and said symmetry of said resonator device wafer relative to said circumferential metal bonding layer reducing thermal asymmetry in said resonator device wafer during said etching to reduce geometric asymmetry of said resonator device wafer. - View Dependent Claims (16, 17, 18, 19)
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20. A disc resonator gyroscope (DRG) comprising:
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a substrate base wafer having a patterned metal bonding layer on one surface about a peripheral area thereof;
said patterned metal bonding layer having a first symmetry;a resonator device wafer bonded to said patterned metal bonding layer within an area circumscribed by said patterned metal bonding layer, the resonator device wafer having etched areas where material thereof has been removed to form vibratory structure, and said etched areas having a second symmetry; said first and second symmetries having a relation to enable generally uniform thermal conductivity in said resonator device wafer during etching of said resonator device wafer to reduce a geometric asymmetry of said vibratory structure formed by said etched areas. - View Dependent Claims (21, 22)
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Specification