Method and apparatus for PCB finishing processes

• US 20090095176A1
• Filed: 10/11/2007
• Published: 04/16/2009
• Est. Priority Date: 10/11/2007
• Status: Abandoned Application

• Current Assignee: Printar Ltd.
• Original Assignee: Printar Ltd.
• Inventors: Noy, Amir, Yafe, Albert
• Application Number:
  US11/907,346
• Publication Number:
  US 20090095176A1
• Time in Patent Office: Days
• US Class Current: 101/126
• CPC Class Codes: H05K 1/0266 Marks, test patterns or identification means
• CPC Class Codes: H05K 3/0091 Apparatus for coating printed circuits using liquid non-metallic coating compositions
• CPC Class Codes: H05K 3/12 using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
• CPC Class Codes: H05K 3/227 Drying of printed circuits
• CPC Class Codes: H05K 3/28 Applying non-metallic protective coatings H05K3/0091 takes precedence; methods for intermediate insulating layers for build-up multilayer circuits H05K3/4673
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base

Abstract

An apparatus for printing PCBs includes both solder mask ink and notation ink printing subsystems within the same unit. Notation ink and solder mask ink may be applied by a single apparatus or by separate apparatuses, such as an ink jet printer, and may be dried by a single drying mechanism or by separate drying mechanisms. The apparatus may also be equipped with a flipping station to allow dual-sided printing and/or a curing station to complete the PCB printing process.

Claims

1. An apparatus for printing printed circuit boards (PCBs) comprising:

a solder mask printing susbystem;

a legend printing susbystem;

at least one drying mechanism;

a PCB handling mechanism for handling the position, orientation, and movement of PCBs within said apparatus; and

a housing enclosing at least said solder mask printing susbystem, said legend printing susbystem, said at least one drying mechanism and said handling mechanism.

2. The apparatus of claim 1, wherein said apparatus has exactly one drying mechanism capable of drying both solder mask and legend ink.

3. The apparatus of claim 1, further comprising a first pass detector for determining whether additional printing on the reverse side of a PCB is required, and a flipping station capable of flipping a PCB in response to said first pass detector.

4. The apparatus of claim 1, further comprising a drying mechanism for drying the solder mask ink.

5. The apparatus of claim 1, wherein either or both of said solder mask printing susbystem and said legend printing susbystem are inkjet printers.

6. The apparatus of claim 1, wherein said solder mask printing susbystem and said legend printing susbystem are capable of motion relative to a PCB.

7. The apparatus of claim 1, further comprising a mechanism for loading and unloading PCBs.

8. An apparatus for printing printed circuit boards (PCBs) comprising:

solder mask printing susbystem;

legend printing susbystem;

a first drying mechanism for drying solder mask ink;

a second drying mechanism for drying legend ink;

a mechanism for handling the position, orientation, and movement of PCBs within said apparatus, and from said first printing station to a second printing station; and

a housing enclosing at least said solder mask printing susbystem, said legend printing susbystem, said first and second drying mechanisms and said handling mechanism.

9. The apparatus of claim 8, further comprising a first pass detector for determining whether additional printing on the reverse side of a PCB is required, and a flipping station capable of flipping a PCB in response to said first pass detector.

10. The apparatus of claim 8, further comprising a drying mechanism for drying the solder mask ink.

11. The apparatus of claim 8, wherein either or both of said solder mask printing susbystem and said legend printing susbystem are inkjet printers.

12. The apparatus of claim 8, wherein said solder mask printing susbystem and said legend printing subsystem are capable of motion relative to a PCB.

13. The apparatus of claim 8, further comprising a mechanism for loading PCBs into said solder mask printing subsystem or said legend printing subsystem.

14. The apparatus of claim 13, further comprising a mechanism for unloading PCBs from said solder mask printing subsystem or said legend printing subsystem.

15. A method for printing solder mask and legend ink on printed circuit boards (PCBs) comprising:

loading a PCB into a housing enclosing at least a solder mask printing subsystem, a legend printing subsystem and at least one drying mechanism,

applying solder mask using said solder mask printing subsystem;

applying legend ink using said legend printing subsystem;

drying said PCB using said drying mechanism; and

unloading said PCB from said housing.

16. The method of claim 15, wherein said housing encloses exactly one drying mechanism capable of drying both solder mask and legend ink.

17. The method of claim 15, wherein said housing encloses a first drying mechanism for drying solder mask ink and a second drying mechanism for drying legend ink, and said step of drying said PCB comprises a first step of drying said solder mask ink and a second step of drying said legend ink.

18. The method of claim 15, wherein said housing further encloses a first pass detector for determining whether additional printing on the reverse side of said PCB is required and a flipping station capable of flipping said PCB in response to said first pass detector,

said method further comprising the steps of determining whether additional printing on the reverse side of said PCB is required and flipping said PCB in response to said determining step.

19. The method of claim 15, wherein either or both of said steps of applying solder mask ink and legend ink are performed though inkjet printing.

20. The method of claim 15, wherein said housing further encloses a drying mechanism for drying the solder mask ink, said method further comprising the step of drying said PCB.