Etch amount detection method, etching method, and etching system

• US 20090095421A1
• Filed: 12/03/2008
• Published: 04/16/2009
• Est. Priority Date: 06/05/2003
• Status: Abandoned Application

• Current Assignee: Tokyo Electron Limited
• Original Assignee: Tokyo Electron Limited
• Inventors: Nishimaki, Katsuhiro, Nozawa, Syuji
• Application Number:
  US12/314,083
• Publication Number:
  US 20090095421A1
• Time in Patent Office: Days
• US Class Current: 156/345.24
• CPC Class Codes: G01B 11/0675 using interferometry
• CPC Class Codes: H01J 37/32935 Monitoring and controlling tubes by information coming from the object and/or discharge
• CPC Class Codes: H01J 37/32972 Spectral analysis
• CPC Class Codes: H01L 21/32137 of silicon-containing layers

Abstract

This invention accurately detects an etch amount of an etching target layer irrespective of a type of a mask layer. A light La is reflected by an upper surface of a photoresist mask layer 316 and a bottom of a hole H. Thereby a reflected light La1 and a reflected light La2 are obtained. The reflected lights La1 and La2 interfere with each other, thereby generating an interference light Lai. A light Lb is reflected by an interface between the photoresist mask layer 316 and a polysilicon film 304, and the upper surface of the photoresist mask layer 316. Thereby a reflected light Lb1 and a reflected light Lb2 are obtained. The reflected lights Lb1 and Lb2 interfere with each other, thereby generating an interference light Lbi. Using the interference lights Lai and Lbi, an etch amount of the polysilicon film 304 is calculated.

Claims

1-12. -12. (canceled)

13. An etching system for carrying out an etching process to an etching target layer on an object to be processed while using a patterned mask layer as a mask, the system comprising:

a light source which irradiates a first light having a first wavelength, which does not propagate the mask layer, and a second light having a second wavelength, which is different from said first wavelength and propagates the mask layer, onto said object to be processed;

a light detection section which detects a first interference light generated by interference of a first reflected light obtained when said first light is reflected by a surface of said mask layer with a second reflected light obtained when said first light is reflected by a bottom of an etching target portion etched of said etching target layer, and which detects a second interference light generated by interference of a third reflected light obtained when said second light is reflected by the surface of said mask layer with a fourth reflected light obtained when said second light is reflected by an interface between said mask layer and said etching target layer; and

an operation section which calculates an etch amount of said etching target portion based on said first interference light and said second interference light.

14. The etching system according to claim 13, wherein

said mask layer consists of a photosensitive material,

said first wavelength is smaller than a photosensitive wavelength of said photosensitive material, and

said second wavelength is larger than the photosensitive wavelength of said photosensitive material.

15. The etching system according to claim 14, wherein

said photosensitive material is a type photosensitive to a light having a wavelength of 365 nm,

said first wavelength is 261 nm, and

said second wavelength is 387 nm.

16. The etching system according to claim 13, wherein

said operation section calculates the etch amount of said etching target portion by:

calculating a difference in height between the surface of said mask layer and the bottom of said etching target portion based on said first interference light,

calculating an etch amount of said mask layer based on said second interference light, and

adding the etch amount of said mask layer to the difference in height between the surface of said mask layer and the bottom of said etching target portion.

17. The etching system according to claim 16, wherein

said etching target layer consists of a silicon-containing film.

18. The etching system according to claim 17, wherein

said silicon-containing film is a polysilicon film.