SUPPORT ASSEMBLY

• US 20090095621A1
• Filed: 10/23/2008
• Published: 04/16/2009
• Est. Priority Date: 02/26/2004
• Status: Abandoned Application

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: Kao, Chien-Teh, Huston, Joel M., Chang, Mei, Yuan, Xiaoxiong (John)
• Application Number:
  US12/257,093
• Publication Number:
  US 20090095621A1
• Time in Patent Office: Days
• US Class Current: 204/298.32
• CPC Class Codes: C23C 14/022 by means of bombardment with energetic particles or radiation
• CPC Class Codes: C23C 14/50 Substrate holders
• CPC Class Codes: C23C 14/541 Heating or cooling of the substrates
• CPC Class Codes: H01J 2237/2001 Maintaining constant desired temperature
• CPC Class Codes: H01J 37/32082 Radio frequency generated discharge H01J37/32357, H01J37/32366, H01J37/32394 and H01J37/32403 take precedence
• CPC Class Codes: H01J 37/32357 Generation remote from the workpiece, e.g. down-stream
• CPC Class Codes: H01J 37/3244 Gas supply means
• CPC Class Codes: H01J 37/32522 Temperature
• CPC Class Codes: H01J 37/32541 Shape
• CPC Class Codes: H01J 37/32568 Relative arrangement or disposition of electrodes; moving means
• CPC Class Codes: H01J 37/32862 In situ cleaning of vessels and/or internal parts
• CPC Class Codes: H01L 21/02104 Forming layers deposition in general C23C; crystal growth in general C30B
• CPC Class Codes: H01L 21/67069 for drying etching
• CPC Class Codes: H01L 21/67109 mainly by convection
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A method and apparatus for removing native oxides from a substrate surface is provided. In one aspect, the apparatus comprises a support assembly. In one embodiment, the support assembly includes a shaft coupled to a disk-shaped body. The shaft has a vacuum conduit, a heat transfer fluid conduit and a gas conduit formed therein. The disk-shaped body includes an upper surface, a lower surface and a cylindrical outer surface. A thermocouple is embedded in the disk-shaped body. A flange extends radially outward from the cylindrical outer surface, wherein the lower surface of the disk-shaped body comprises one side of the flange. A fluid channel is formed in the disk-shaped body proximate the flange and lower surface. The fluid channel is coupled to the heat transfer fluid conduit of the shaft. A plurality of grooves are formed in the upper surface of the disk-shaped body, and are coupled by a hole in the disk-shaped body to the vacuum conduit of the shaft. A gas conduit is formed through the disk-shaped body and couples the gas conduit of the shaft to the cylindrical outer surface of the disk-shaped body. The gas conduit in the disk-shaped body has an orientation substantially perpendicular to a centerline of the disk-shaped body.

Claims

1. A support assembly, comprising:

a substantially disk-shaped body;

a shaft coupled to the disk-shaped body, the shaft having a vacuum conduit, a heat transfer fluid conduit and a gas conduit; and

wherein the disk-shaped body comprises;

an upper surface, a lower surface and a cylindrical outer surface;

a thermocouple embedded in the disk-shaped body;

a flange extending radially outward from the cylindrical outer surface, the lower surface comprising one side of the flange;

a fluid channel formed in the disk-shaped body proximate the flange and the lower surface, the fluid channel coupled to the heat transfer fluid conduit of the shaft;

a plurality of grooves formed in the upper surface;

a hole coupling at least one of the grooves to the vacuum conduit of the shaft; and

a body gas conduit formed through the disk-shaped body and coupling the gas conduit of the shaft to the cylindrical outer surface, the body gas conduit having an orientation substantially perpendicular to a centerline of the disk-shaped body.

2. The support assembly of claim 1 further comprising a top plate disposed on the upper surface of the disk-shaped body, the top plate having a plurality of holes aligning with the grooves of the disk-shaped body.

3. The support assembly of claim 2, wherein the top plate is a detachable member that rests on the upper surface of the disk-shaped body.

4. The support assembly of claim 2, wherein the top plate includes a plurality of raised dimples disposed on an upper surface thereof to minimize contact with a substrate supported thereon.

5. The support assembly of claim 4, wherein the top plate is ceramic.

6. The support assembly of claim 5, wherein the top plate has one or more vertical bores aligned with a bore in the disk-shaped body for housing a moveable support pin therethrough, the support pin being comprised of ceramic material.

7. The support assembly of claim 6, wherein the one or more vertical bores are lined with a ceramic sleeve to reduce friction with the moveable support pin.

8. The support assembly of claim 1, further comprising an annular aluminum ring disposed about the cylindrical outer surface of the disk-shaped body, such that a passage created about the disk-shaped body is in fluid communication with the body gas conduit formed in the disk-shaped body, the annular ring comprising:

a cylindrical ring body having an inner wall sized to maintain a gap between the cylindrical outer surface of the disk-shaped body;

a top lip extending radially inward from the ring body over the top surface of the disk-shaped body; and

a bottom lip extending downward from of the ring body and circumscribing the flange, the bottom lip having an inner wall and ring body having a concentric orientation.

9. The support assembly of claim 1, wherein the disk-shaped body is fabricated from aluminum.

10. The support assembly of claim 1 further comprising:

a detachable ceramic top plate disposed on the upper surface of the disk-shaped body, the top plate having a plurality of holes aligning with the grooves of the body, the top plate comprising a plurality of raised dimples disposed on an upper surface thereof to minimize contact with a substrate supported thereon, the top plate having one or more vertical bores aligned with a bore in the disk-shaped body;

a moveable ceramic support pin disposed in the aligned bores;

a ceramic sleeve disposed in each of the vertical bores to reduce friction with the moveable support pin;

an annular ring disposed about the cylindrical outer surface of the disk-shaped body, such that a passage created about the disk-shaped body is in fluid communication with the body gas conduit formed in the disk-shaped body, the annular ring comprising;

a cylindrical ring body having an inner wall sized to maintain a gap between the cylindrical outer surface of the disk-shaped body;

a top lip extending radially inward from the ring body over the top surface of the disk-shaped body; and

a bottom lip extending downward from of the ring body and circumscribing the flange, the bottom lip having an inner wall and ring body having a concentric orientation.

11. An edge ring for a support assembly configured to engage a substrate support member having a flange extending from a cylindrical outer surface of a disk-shaped body, the edge ring comprising:

a cylindrical aluminum ring body having an inner wall, the inner wall sized to maintain a gap between the cylindrical outer surface of the disk-shaped body;

a top lip extending radially inward from the ring body over a top surface of the disk-shaped body; and

a bottom lip extending downward from of the ring body and circumscribing the flange, the bottom lip having an inner wall and ring body having a concentric orientation.

12. An electrode for a plasma processing chamber, the electrode comprising:

a nickel plated body having a gas inlet formed therethrough, the body comprising;

an upper section having a lower disk surface, an upper disk surface and an outer disk diameter; and

a expanding section extending from the lower disk surface to a lower body surface, the expanding section having an outer body diameter that has a diameter less than a diameter of the outer disk diameter, the expanding section having a conical inner diameter wall extending into the expanding section from the lower disk surface, the inner diameter wall tapering towards the upper section, the gas inlet opening to a cavity defined by the inner diameter wall.

13. The electrode of claim 12, wherein the inner diameter wall has a slope of at least 1:

1.

14. The electrode of claim 12, wherein the inner diameter wall has a slope of at least 5:

1.

15. The electrode of claim 12, wherein the inner diameter wall has a slope in the range of 1:

1 to 20;

1.

16. The electrode of claim 12, wherein the gas inlet extends from the outer disk diameter of the upper section to the cavity defined by the inner diameter wall.

17. The electrode of claim 12 further comprising:

an o-ring gland formed on the lower surface of the upper section.

18. The electrode of claim 12, wherein the upper section is configured to be coupled to an RF power source.