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HEAT DISSIPATION DEVICE FOR LED CHIPS

  • US 20090095959A1
  • Filed: 12/27/2007
  • Published: 04/16/2009
  • Est. Priority Date: 10/10/2007
  • Status: Active Grant
First Claim
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1. A heat dissipation device adapted for removing heat from LED chips, comprising:

  • a heat sink comprising a base plate which defines a first surface and a second surface opposite to the first surface, and a plurality of fins formed on the second surface of the base plate; and

    a plurality of substrates of unidirectional heat transfer being attached to the first surface of the heat sink, each of the substrates defining a first wall on which the LED chips are mounted and a second wall coupled to the heat sink, the substrates only transferring heat from the first wall to the second wall and restricting heat transfer in a reversed direction;

    wherein when the LED chips generate heat, the heat is transferred to the fins via the unidirectional substrates to lower temperature of the LED chips.

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