HEAT DISSIPATION MEMBER, SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR LIGHT EMITTING APPARATUS

• US 20090095960A1
• Filed: 12/12/2008
• Published: 04/16/2009
• Est. Priority Date: 10/15/2003
• Status: Active Grant

• Current Assignee: Nichia Corporation
• Original Assignee: Nichia Corporation
• Inventors: MURAYAMA, Takashi
• Granted Patent: US 7,812,365 B2
• Time in Patent Office: Days
• US Class Current: 257/79
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01322 Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H01L 33/507 the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
• CPC Class Codes: H01L 33/644 in intimate contact or integrated with parts of the device other than the semiconductor body
• CPC Class Codes: H01L 33/648 the elements comprising fluids, e.g. heat-pipes

Abstract

A heat dissipation member includes a first plate-shaped member and a second plate-shaped member. The first plate-shaped member has a first surface thermally connectable with a heat generating element and a second surface. The second plate-shaped member is thermally connected with the second surface of the first plate-shaped member. The first plate-shaped member and the second plate-shaped member form a laminated-plate-shaped member. The laminated-plate-shaped member defines an inlet for admission of a fluid and an outlet communicating with the inlet for ejection of the fluid. The second surface of the first plate-shaped member forms asperities thereon.

Claims

1. A heat dissipation member comprising:

a first plate-shaped member having a first surface thermally connectable with a heat generating element and a second surface; and

a second plate-shaped member being thermally connected with the second surface of the first plate-shaped member,

wherein the first and second plate-shaped member forms a laminated-plate-shaped member, and the laminated-plate-shaped member defines an inlet for admission of a fluid and an outlet communicating with the inlet for ejection of the fluid, and

wherein the second surface of the first plate-shaped member forms asperities thereon.

2. The heat dissipation member according to claim 1, wherein the asperities are formed on a opposing region in the second surface of the first plate-shaped member, the opposing region being opposed to a connection region of the heat generating element.

3. The heat dissipation member according to claim 1, wherein each of the asperities has a stepped part with height of not less than 10 μ

m to not more than 500 μ

m.

6. The heat dissipation member according to claim 1, wherein the first surface of the first plate-shaped member is connected to the heat generating element so as to sandwich a eutectic material between them.

7. The heat dissipation member according to claim 1, wherein the second surface of the first plate-shaped member is connected to the second plate-shaped member so as to also sandwich a eutectic material between them.

8. A semiconductor apparatus comprising:

the heat dissipation member according to claim 1; and

the heat generating element formed of a semiconductor.

9. The semiconductor apparatus according to claim 8, wherein the first surface of the first plate-shaped member is provided with one or more of the semiconductor device mounted thereon.

10. The semiconductor apparatus according to claim 8, wherein the heat generating element is a semiconductor light emitting element.

4. A heat dissipation member comprising:

a first plate-shaped member having a first surface thermally connectable with a heat generating element and a second surface; and

a second plate-shaped member being thermally connected with the second surface of the first plate-shaped member,

wherein the first and second plate-shaped member forms a laminated-plate-shaped member, and the laminated-plate-shaped member defines an inlet for admission of a fluid and an outlet communicating with the inlet for ejection of the fluid, and

wherein the first plate-shaped member has a surface area (b) of the second surface being opposed to a contact region of the heat generating element, the surface area (b) being larger than a contact area (a) of the heat generating element in the first surface.

5. The heat dissipation member according to claim 4, wherein the ratio between the contact area (a) of the heat generating element in the first surface and the surface area (b) of the second surface that is opposed to the contact region of the heat generating element is 0.2≦

(a/b)<

1.

11. A semiconductor light emitting apparatus comprising:

a heat dissipation member to dissipate heat generated by a heat generating element, the heat dissipation member being formed of two plate-shaped members that form a flow path for flowing cooling fluid between them; and

a plurality of light emitting elements that are mounted to be two-dimensionally arranged on a main surface of the heat dissipation member.

12. The semiconductor light emitting apparatus according to claim 11, wherein said plurality of protruding portions are arranged apart from each other in a bent manner such that line segments that successively connect the protruding portions closest to each other repeatedly change their direction from a inlet part to a outlet part of said flow path.

13. The semiconductor light emitting apparatus according to claim 11, wherein at least some of said plurality of protruding portions are formed between said light emitting elements.

14. The semiconductor light emitting apparatus according to claim 11, wherein at least some of said plurality of protruding portions are formed such that their centers are located between said light emitting elements and a substantially central part of said light emitting element.

15. The semiconductor light emitting apparatus according to claim 11, wherein said plurality of protruding portions are located at a substantially central part of and in the peripheries of the corners of the light emitting element.

16. The semiconductor light emitting apparatus according to claim 11, wherein an upper surfaces of the protruding portions is bonded with the surface of the second plate-shaped member.

17. The semiconductor light emitting apparatus according to claim 11, wherein a flow path is formed in a substantially circular or oval cross section.

18. The semiconductor light emitting apparatus according to claim 11, wherein an inlet and/or outlet part of the flow path is formed in an arc-shape.

19. The semiconductor light emitting apparatus according to claim 11, wherein a metal material containing Au coats an attachment surface of said plate-shaped members.