PACKAGING A SEMICONDUCTOR WAFER
First Claim
1. A method for packaging a wafer, the method comprising:
- filling a mold with a solder, wherein the mold comprises at least one integrated Radio Frequency Identification (RFID) tag;
loading the mold with the wafer into a solder transfer tool in response to filling the mold with the solder;
heating the wafer and the mold to transfer the solder from the mold to the wafer; and
detecting, by the RFID tag, characteristic data during transference of the solder from the mold to the wafer to control packaging the wafer.
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Accused Products
Abstract
Embodiments embed at least one Radio Frequency Identification (RFID) tag into the mold. The mold may comprise a cavity adapted to the geometrical form of the RFID tag. In some embodiments, the cavity is marginally bigger than the RFID tag. In many embodiments, the cavity with the embedded the RFID tag is covered by glue. Thus, the mold, the RFID tag and the glue may be suitable for temperatures up to, e.g., 400° C. Further the mold and the glue may be resistant to concentrated sulfuric acid and formic acid. The serial number of the mold may be stored in the RFID tag. The RFID tag may detect characteristic data during the transfer of the solder from the mold to the wafer. In one embodiment, the RFID tag may detect the temperature. In another embodiment, a plurality of RFID tags may detect various temperatures for controlling the packaging process.
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Citations
20 Claims
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1. A method for packaging a wafer, the method comprising:
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filling a mold with a solder, wherein the mold comprises at least one integrated Radio Frequency Identification (RFID) tag; loading the mold with the wafer into a solder transfer tool in response to filling the mold with the solder; heating the wafer and the mold to transfer the solder from the mold to the wafer; and detecting, by the RFID tag, characteristic data during transference of the solder from the mold to the wafer to control packaging the wafer. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A system for packaging a wafer, the system comprising:
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a mold for receiving a solder and a wafer; an Radio Frequency Identification (RFID) tag inserted in a cavity within the mold, wherein the RFID tag is provided to detect characteristic data during transference of the solder from the mold to the wafer to control packaging the wafer; and a glue coupled with the mold and the RFID tag. - View Dependent Claims (9, 10, 11, 12, 13, 14, 15, 16)
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17. A computer program product for packaging a wafer, the computer program product comprising;
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a computer usable medium having computer usable program code embodied therewith, the computer usable program code comprising; computer usable program code configured to perform operations comprising; filling a mold with a solder, wherein the mold comprises at least one integrated Radio Frequency Identification (RFID) tag; loading the mold with the wafer into a solder transfer tool in response to filling the mold with the solder; heating the wafer and the mold to transfer the solder from the mold to the wafer; and recording characteristic data, detected by the RFID tag during transference of the solder from the mold to the wafer, to control packaging the wafer. - View Dependent Claims (18, 19, 20)
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Specification