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PACKAGING A SEMICONDUCTOR WAFER

  • US 20090096589A1
  • Filed: 10/09/2008
  • Published: 04/16/2009
  • Est. Priority Date: 10/10/2007
  • Status: Active Grant
First Claim
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1. A method for packaging a wafer, the method comprising:

  • filling a mold with a solder, wherein the mold comprises at least one integrated Radio Frequency Identification (RFID) tag;

    loading the mold with the wafer into a solder transfer tool in response to filling the mold with the solder;

    heating the wafer and the mold to transfer the solder from the mold to the wafer; and

    detecting, by the RFID tag, characteristic data during transference of the solder from the mold to the wafer to control packaging the wafer.

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