Capacitor-embedded printed wiring board and method of manufacturing the same

• US 20090097218A1
• Filed: 10/06/2008
• Published: 04/16/2009
• Est. Priority Date: 10/10/2007
• Status: Abandoned Application

• Current Assignee: Nippon Mektron Limited (NOK Corporation)
• Original Assignee: Nippon Mektron Limited (NOK Corporation)
• Inventors: Miyamoto, Garo
• Application Number:
  US12/285,447
• Publication Number:
  US 20090097218A1
• Time in Patent Office: Days
• US Class Current: 361/761
• CPC Class Codes: H05K 1/162 incorporating printed capacitors
• CPC Class Codes: H05K 2201/09509 Blind vias, i.e. vias having one side closed
• CPC Class Codes: H05K 2201/09763 Printed component having superposed conductors, but integrated in one circuit layer
• CPC Class Codes: H05K 3/4652 Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern H05K3/4647 takes precedence
• CPC Class Codes: Y10T 29/49172 by molding of insulating material

Abstract

There is provided a capacitor-embedded printed wiring board incorporating therein a capacitor having stabilized electrical characteristics. The capacitor-embedded printed wiring board includes: a capacitor having a first electrode 5, a high dielectric constant layer 7 and a second electrode 9 which are sequentially laminated on an insulating substrate 1, the second electrode being electrically connected to a land 6 for electrode contact formed in a wiring layer in which the first electrode is formed; a member 12 having at least one insulating layer and laminated over the capacitor and the wiring layer; and a via 18 having an opening extending through the member and the second electrode to reach the land, the via electrically interconnecting the second electrode and the land in the opening. A method of manufacturing the same is also provided.

Claims

1. A capacitor-embedded printed wiring board comprising:

a capacitor having a first electrode, a high dielectric constant layer and a second electrode which are sequentially laminated on one surface of an insulating substrate, the second electrode being electrically connected to a land for electrode contact formed in a wiring layer in which the first electrode is formed;

a member having at least one insulating layer and laminated over the capacitor; and

a via having an opening extending through the member and the second electrode to reach the land, the via electrically interconnecting the second electrode and the land in the opening.

2. A method of manufacturing a capacitor-embedded printed wiring board, comprising:

providing a wiring board having a land for electrode contact which is formed on one surface of an insulating substrate for connection with first and second electrodes;

printing a high dielectric constant paste in such a manner as to cover the first electrode and then thermally curing the high dielectric constant paste to form a high dielectric constant layer;

forming the second electrode by printing a conductive paste on the high dielectric constant layer in such a manner as to reach the land, thereby forming a capacitor;

laminating over the capacitor a member having at least one insulating layer;

making an opening extending through the member and the second electrode to reach the land by using a laser; and

plating the opening after cleaning to form a via electrically interconnecting the second electrode and the land.