MULTILAYER CIRCUIT DEVICES AND MANUFACTURING METHODS USING ELECTROPLATED SACRIFICIAL STRUCTURES

• US 20090098643A1
• Filed: 11/14/2008
• Published: 04/16/2009
• Est. Priority Date: 09/27/2002
• Status: Abandoned Application

• Current Assignee: Medtronic Minimed Incorporated (Medtronic Plc)
• Original Assignee: Medtronic Minimed Incorporated (Medtronic Plc)
• Inventors: Shah, Rajiv, Mastrototaro, John J., Holker, James D.
• Application Number:
  US12/271,134
• Publication Number:
  US 20090098643A1
• Time in Patent Office: Days
• US Class Current: 435/287.1
• CPC Class Codes: H01L 21/4857 Multilayer substrates multilayer metallisation on monolayer substrate H01L21/4846
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 1/092 Dispersed materials, e.g. conductive pastes or inks
• CPC Class Codes: H05K 2201/0179 Thin film deposited insulating layer, e.g. inorganic layer for printed capacitor
• CPC Class Codes: H05K 2203/0278 Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
• CPC Class Codes: H05K 3/4061 for via connections in inorganic insulating substrates
• CPC Class Codes: H05K 3/4647 by applying an insulating layer around previously made via studs
• CPC Class Codes: H05K 3/4667 characterized by using an inorganic intermediate insulating layer
• CPC Class Codes: H05K 3/467 Adding a circuit layer by thin film methods H05K3/4647 takes precedence

Abstract

A multilayer circuit includes a dielectric base substrate, conductors formed on the base substrate and a vacuum deposited dielectric thin film formed over the conductors and the base substrate. The vacuum deposited dielectric thin film is patterned using sacrificial structures formed by electroplating techniques. Substrates formed in this manner enable significant increases in circuit pattern miniaturization, circuit pattern reliability, interconnect density and significant reduction of over-all substrate thickness.

Claims

1-31. -31. (canceled)

32. A device comprising:

a tube having a wall defining an outer peripheral surface of the tube; and

a sensor supported by the wall.

33. The device of claim 32, wherein the sensor is supported on the outer peripheral surface of the tube.

34. The device of claim 33, wherein the sensor is supported on a first radial portion of the outer peripheral surface of the tube.

35. The device of claim 34, wherein a second radial portion of the outer peripheral surface of the tube is configured to engage with a slotted needle.

36. The device of claim 34,

wherein the sensor comprises a substrate having a first surface, and

wherein the first surface of the substrate is in contact with the first radial portion of the outer peripheral surface of the tube.

37. The device of claim 36, wherein the substrate is a flexible substrate.

38. The device of claim 36, wherein the substrate is a rigid substrate.

39. The device of claim 36, wherein the substrate is formed of a dielectric material.

40. The device of claim 36,

wherein the substrate has a second surface opposite the first surface of the substrate, and

wherein the sensor further comprises a sensor electrode located on the second surface of the substrate.

41. The device of claim 32, wherein the tube is formed of a liquid polymer.

42. The device of claim 41, wherein the liquid polymer is biocompatible.

43. The device of claim 41, wherein the liquid polymer comprises at least one of polyurethane, polycarbonate, silicone and acrylic.

44. The device of claim 32, wherein the sensor is for sensing blood glucose.

45. The device of claim 32, wherein the sensor comprises a sensor enzyme for sensing blood glucose.