MOBILE WIRELESS COMMUNICATIONS DEVICE HAVING IMPROVED ANTENNA IMPEDANCE MATCH AND ANTENNA GAIN FROM RF ENERGY

• US 20090098917A1
• Filed: 12/17/2008
• Published: 04/16/2009
• Est. Priority Date: 04/04/2005
• Status: Active Grant

• Current Assignee: Malikie Innovations Limited (Key Patent Innovations Limited)
• Original Assignee: Research In Motion Limited (Blackberry Limited)
• Inventors: Qi, Yihong, Bandurska, Krystyna, Man, Ying Tong, ZHU, Lizhong, Corrigan, Michael
• Granted Patent: US 8,359,076 B2
• Time in Patent Office: Days
• US Class Current: 455/575.5
• CPC Class Codes: H04M 1/0202 Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets constructional features of telephone transmitters or receivers, e.g. of speakers or microphones H04M1/03
• CPC Class Codes: H04M 1/026 Details of the structure or mounting of specific components
• CPC Class Codes: H04M 1/6008 in the transmitter circuit
• CPC Class Codes: H04M 1/6016 in the receiver circuit

Abstract

A mobile wireless communications device and associated method of making same includes a housing and circuit board having a ground plane. Radio frequency (RF) circuitry and a processor are carried by the circuit board and operative with each other. An antenna is carried by the housing and operative with the RF circuitry. Audio circuitry is carried by the circuit board and operative with the RF circuitry and processor. An audio transducer assembly such as a receiver is carried by the circuit board and engages audio circuitry for carrying audio signals between the audio circuitry and speaker. A filter is mounted at the speaker for blocking RF energy from the antenna through the speaker to the ground plane and decoupling the antenna from the speaker and any other components on the circuit board to minimize any detuning of antenna impedance match and degradation in antenna gain.

Claims

1-28. -28. (canceled)

29. A mobile wireless communications device comprising:

a housing;

a plurality of circuit boards carried by the housing, wherein at least one of said circuit boards has a ground plane;

radio frequency (RF) circuitry and a processor operative with each other and carried by at least one of the circuit boards;

an antenna carried by the housing and operative with the RF circuitry;

audio circuitry carried by at least one of the circuit boards and operative with the RF circuitry and processor;

an audio transducer assembly comprising an audio transducer housing and carried by a circuit board having a ground plane and having electrical contact pads that electrically engage audio circuitry for carrying audio signals between the audio circuitry and the audio transducer assembly; and

at least one filter mounted at the audio transducer assembly and configured for blocking RF energy from the antenna through the audio transducer assembly to the ground plane and decoupling the antenna from the audio transducer assembly and any other components on the at least one circuit board to minimize any detuning of antenna impedance match and degradation in antenna gain, wherein said at least one filter is at least one of serially connected within the audio transducer housing and connected between the audio transducer housing and the contact pads.

30. The mobile wireless communications device according to claim 29, wherein at least one of said plurality of circuit boards comprises an antenna circuit board.

31. The mobile wireless communications device according to claim 29, wherein said antenna, RF circuitry and audio transducer assembly are carried by the same circuit board.

32. The mobile wireless communications device according to claim 31, wherein said processor is carried by the same circuit board as the antenna, RE circuitry and audio transducer assembly.

33. The mobile wireless communications device according to claim 29, wherein said antenna, RF circuitry and audio transducer assembly are supported on different circuit boards.

34. The mobile wireless communications device according to claim 29, wherein said filter is operative for low DC resistance and high impedance from 500 MHz to 3 GHz.

35. The mobile wireless communications device according to claim 29, wherein at least one filter is serially connected within said audio circuitry.

36. The mobile wireless communications device according to claim 29, wherein said electrical contacts comprise resilient contact pads that engage the audio circuitry.

37. The mobile wireless communications device according to claim 29, wherein said filter is located adjacent the electrical contacts of said audio transducer assembly.

38. The mobile wireless communications device according to claim 29, wherein said filter comprises a ferrite bead.

39. The mobile wireless communications device according to claim 29, wherein said filter comprises a serial inductor or shunt capacitor.

40. The mobile wireless communications device according to claim 29, wherein said filter comprises a RF shield that surrounds the audio transducer assembly.

41. A method of making a mobile wireless communications device, which comprises:

providing a housing, a plurality of circuit boards carried by the housing, wherein at least one said circuit boards has a ground plane, radio frequency (RF) circuitry and a processor operative with each other and carried by at least one of the circuit boards, an antenna carried by the housing and operative with the RF circuitry, audio circuitry carried by at least one of the circuit boards and operative with the RF circuitry and processor, and an audio transducer assembly as an audio transducer housing and carried by a circuit board having a ground plane and having electrical contact pads that electrically engage audio circuitry for carrying audio signals between the audio circuitry and the audio transducer assembly; and

mounting at least one filter at the audio transducer assembly for blocking RF energy from the antenna through the audio transducer housing to the ground plane and decoupling the antenna from the speaker and any other components on the circuit board to minimize any detuning of antenna impedance match and degradation in antenna gain, wherein the at least one filter is at least one of serially connected within the audio transducer housing and connected between the audio transducer housing and the contact pads.

42. The method according to claim 41, which further comprises supporting the antenna on an antenna circuit board.

43. The method according to claim 41, which further comprises supporting the antenna, RF circuitry and audio transducer assembly on the same circuit board.

44. The method according to claim 43, which further comprises supporting the processor on the same circuit board as the antenna, RF circuitry and audio transducer assembly.

45. The method according to claim 41, which further comprises supporting the antenna, RF circuitry and audio transducer assembly on different circuit boards.

46. The method according to claim 41, which further comprises mounting a filter that is operative for low DC resistance and high impedance over 500 MHz to 3 GHz.

47. The method according to claim 41, which further comprises serially connecting the filter within audio circuitry.

48. The method according to claim 41, which further comprises positioning the filter adjacent the electrical contacts.

49. The method according to claim 41, which further comprises forming the filter as a ferrite bead, shunt capacitor or serial inductor.

50. The method according to claim 41, which further comprises forming a RF shield around the audio transducer assembly.