METHOD FOR BONDING A WIRE CONDUCTOR LAID ON A SUBSTRATE

• US 20090100667A1
• Filed: 09/18/2008
• Published: 04/23/2009
• Est. Priority Date: 09/18/2007
• Status: Active Grant

• Current Assignee: Hid Global Ireland Teoranta (Assa Abloy AB)
• Original Assignee: Aontec Teoranta (Assa Abloy AB)
• Inventors: Morley, Brendan, O'Keeffe, Seamus
• Granted Patent: US 8,413,316 B2
• Time in Patent Office: Days
• US Class Current: 29/600
• CPC Class Codes: G06K 19/0723 the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs
• CPC Class Codes: G06K 19/0775 arrangements for connecting the integrated circuit to the antenna
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device
• CPC Class Codes: H01L 2224/05553 being rectangular
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45147 Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/4809 Loop shape
• CPC Class Codes: H01L 2224/4813 Connecting within a semiconductor or solid-state body, i.e. fly wire, bridge wire
• CPC Class Codes: H01L 2224/4847 the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
• CPC Class Codes: H01L 2224/78 Apparatus for connecting with wire connectors
• CPC Class Codes: H01L 2224/78301 Capillary
• CPC Class Codes: H01L 2224/85205 Ultrasonic bonding
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 23/48 Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/78 Apparatus for connecting with wire connectors
• CPC Class Codes: H01L 24/85 using a wire connector wire bonding in general B23K20/004
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/00015 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed as prior art
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01023 : Vanadium [V]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01075 : Rhenium [Re]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01Q 1/2225 : used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
• CPC Class Codes: H01Q 7/00 : Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
• CPC Class Codes: Y10T 29/49005 : Acoustic transducer
• CPC Class Codes: Y10T 29/49016 : Antenna or wave energy "plumbing" making
• CPC Class Codes: Y10T 29/49073 : by assembling coil and core
• CPC Class Codes: Y10T 29/49117 : Conductor or circuit manufacturing
• CPC Class Codes: Y10T 29/4913 : Assembling to base an electrical component, e.g., capacitor, etc.

Abstract

Method for bonding a wire conductor arranged on a preferably card-like substrate during the manufacture of a transponder unit having a wire coil and a chip module, comprising a first phase, wherein the coil is permanently joined with the substrate, and a second phase, wherein the wire conductor and the chip module are bonded, whereas in the first phase at least one of the end portions of the wire conductor intended for later bonding with the chip module is attached to the substrate with a free loop being formed, and that the loop thus formed is gripped in a second phase and a section of the loop is then bonded with a bonding area of the chip module and attached to it in an electronically conductive manner.

Claims

1. A method for bonding a wire conductor arranged on a preferably card-like substrate during the manufacture of a transponder unit having a wire coil and a chip module, comprising a first phase, wherein the coil is permanently joined with the substrate, and a second phase, wherein the wire conductor and the chip module are bonded, wherein in the first phase at least one of the end portions of the wire conductor intended for later bonding with the chip module is attached to the substrate with a free loop being formed, and that the loop thus formed is gripped in a second phase and a section of the loop is then bonded with a bonding area of the chip module and attached to it in an electrically conductive manner.

2. Method according to claim 1, wherein the loop protrudes in such a way from the substrate that it can be gripped without the organ gripping it touching the substrate and that it preferably protrudes such that the plane in which the loop lies includes an angle of between 25 and 90 degrees with the substrate surface.

3. Method according to claim 1, wherein the loop is formed such in the first phase that it lies next to the chip module.

4. Method according to claim 3, wherein the loop is formed such in a first phase that one of its sides is followed by a section of wire conductor which is laid onto the substrate aligned in such a way that the imagined extension of said section of the wire conductor covers a terminal area of the chip module.

5. Method according to claim 1, wherein the second phase the loop is gripped by two grippers that take up a section of the loop between them and that are moved in such a manner, relative to the chip module and relative to each other, that said section of the loop finally at least substantially forms a straight line that covers a terminal area of a chip module.

8. Method according to claim 1, wherein, subsequent to the gripping of the loop, the loop is pulled in such a way so that an end portion of the loop detaches from the substrate or tears open the loop and the end portion of the wire conductor exists as a free end.

9. Method according to claim 1, wherein the loop is dimensioned such that the loop can be tilted or folded onto the chip module in the direction of the substrate surface and hits the terminal area of the chip module allocated to it.

10. Method according to claim 1, wherein the method is carried out by a gripper which in the second phase grips a section of the loop, guides the gripped section to a terminal area of the chip module and then aligns the loop with the terminal area of the chip module.

14. Method according to claim 1, wherein the end portion of the wire conductor is drawn over the terminal area so that it traverses the terminal area and is only then connected to the terminal area in an electrically conductive manner.

15. Method according to claim 1, wherein the first phase is carried out in a first processing station and the second phase in a second processing station which is spatially separated from the first processing station.

6. Method according to claim 6, wherein the clamping force of at least one of the two grippers with which it grips the wire conductor is at least temporarily limited, namely in such a way that the wire conductor is be pulled through said gripper in a gliding manner as soon as the wire conductor is subjected to tensile stress;

7. Method according to claim 7, wherein the gripper whose clamping force is limited is the gripper closest to the free end of the wire conductor.

11. Method according to claim 11, wherein the gripper is a suction gripper adapted to suck the wire conductor of the loop into a centring device, which forces the wire conductor into a defined position, the location of which relative to the allocated terminal area of the chip module is known.

12. Method according to claim 11, wherein the gripper is provided with a pressure organ that is separately movable in relation to the gripper which presses the wire conductor out of its defined position at the gripper against the terminal area as soon as the gripper has positioned the wire conductor above the terminal area.

13. Method according to claim 13, wherein the pressure organ is coupled to an ultrasonic source for the purpose of ultrasonic friction welding.