PRINTED CIRCUIT BOARD HAVING IMPROVED SOLDER PAD LAYOUT

• US 20090101397A1
• Filed: 07/07/2008
• Published: 04/23/2009
• Est. Priority Date: 10/22/2007
• Status: Abandoned Application

• Current Assignee: Hon Hai Precision Industry Co., Ltd.
• Original Assignee: Hon Hai Precision Industry Co., Ltd.
• Inventors: Chung, Jung-Kuei, Kuo, Nan-Sheng, Chien, Chu-Lung
• Application Number:
  US12/168,841
• Publication Number:
  US 20090101397A1
• Time in Patent Office: Days
• US Class Current: 174/260
• CPC Class Codes: H05K 1/116 Lands, clearance holes or other lay-out details concerning the surrounding of a via
• CPC Class Codes: H05K 2201/09381 Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component notches in edge pads H05K2201/09181
• CPC Class Codes: H05K 2201/09781 Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
• CPC Class Codes: H05K 2203/046 Means for drawing solder, e.g. for removing excess solder from pads
• CPC Class Codes: H05K 3/3447 Lead-in-hole components H05K3/3415 takes precedence
• CPC Class Codes: H05K 3/3468 Applying molten solder

Abstract

A printed circuit board (100) includes a plurality of through-holes (140) defined therein, a plurality of first solder pads (110) defined to surround the through-holes respectively, and a second solder pad (190). Each of the first solder pads includes a first soldering zone (112) for accommodating solder used in a soldering process and a second soldering zone (114) for receiving excess solder overflowing from the first soldering zone. The second soldering zone is in communication with and extends outward from the first soldering zone. The second solder pad is located on a tail end of the printed circuit board for receiving excess solder of the tail end during the soldering process.

Claims

1. A printed circuit board, comprising:

a plurality of through-holes defined therein;

a plurality of first solder pads configured to surround the through-holes respectively, each of the first solder pads comprising a first soldering zone for accommodating solder used in a soldering process and a second soldering zone for receiving excess solder overflowing from the first soldering zone, the second soldering zone in communication with and extending outward from the first soldering zone; and

a second solder pad located on a tail end thereof for receiving excess solder of the tail end during the soldering process.

2. The printed circuit board of claim 1, wherein an axis of each of the first solder pads and a direction opposite to a movement direction of the printed circuit board in the soldering process defines a predetermined angle.

3. The printed circuit board of claim 2, wherein each of the first solder pads defines a same angle ranging from 15 degrees to 90 degrees.

4. The printed circuit board of claim 1, wherein the first solder pads are arranged in rows, the second soldering zone of each of the first solder pads arranged in one row adjacent to one end side of the printed circuit board defines a same first extending direction, and each of the first solder pads arranged in another row adjacent to another end side of the printed circuit board opposite to said end side defines a same second extending direction different from the first extending direction.

5. The printed circuit board of claim 1, wherein the second soldering zone of each of the first solder pads is arcuate shaped.

6. The printed circuit board of claim 1, wherein the second solder pad is fan-shaped.

7. The printed circuit board of claim 5, wherein a central angle of the second solder pad ranges from 120 degrees to 180 degrees.

8. The printed circuit board of claim 1, wherein an area of the second solder pad is greater than any one of the first solder pads.

9. An assembly comprising:

a component with a plurality of pins symmetrically distributed at one side of said component with respect to a central line of said side;

a circuit board configured to electrically mount said component thereon and abut against said side of said component, a plurality of through-holes defined in said circuit board to allow said plurality of pins correspondingly passing therethrough, a plurality of first solder pads defined on a side of said circuit board facing away from said component to respectively surround said plurality of through-holes, each of said plurality of first solder pads comprising a first soldering zone surrounding a corresponding one of said plurality of through-holes for accommodating a desired amount of solder thereon in a soldering process, and a second soldering zone extending out of said first soldering zone along a direction perpendicular to said central line of said side of said component for accommodating excess solder from said first soldering zone thereon in said soldering process.

10. The assembly of claim 9, wherein said circuit board further comprises a second solder pad located beside said plurality of first solder pads so as to accommodate excess solder during said soldering process, said second solder pad occupies an area on said circuit board wider than an occupied area of at least two of said plurality of first solder pads.

11. The assembly of claim 9, wherein said first solder pads are arranged in rows, said second soldering zone of each of said first solder pads arranged in one row adjacent to one end of said side of said printed circuit board defines a same first extending direction, and each of said first solder pads arranged in another row adjacent to another end of said side of said printed circuit board opposite to said end defines a same second extending direction different from said first extending direction.

12. A printed circuit board, comprising:

a plurality of through-holes defined therein;

a plurality of first solder pads symmetrically distributed at a side of the printed circuit board about a central line of the side to surround the through-holes respectively, each of the first solder pads comprising a first soldering zone for accommodating a desired amount of solder thereon in a soldering process and a second soldering zone for receiving excess solder during the soldering process, the second soldering zone in communication with and extending outward from the first soldering zone, an axis of each of the second soldering zone and the central line cooperatively defining an angle; and

a second solder pad located on a tail end thereof for receiving excess solder of the tail end during the soldering process;

wherein the angle of the second sildering zone of each of the first solder pads arranged in one column adjacent to the second solder pad is different from the angle of the second sildering zone of each of the first solder pads arranged in other columns.

13. The printed circuit board of claim 12, wherein the angle of the second sildering zone of each of the first solder pads arranged in one column adjacent to the second solder pad is 45 degrees.

14. The printed circuit board of claim 13, wherein the angle of the second sildering zone of each of the first solder pads arranged in other columns is 90 degrees.