WIRELESS ILLUMINATION SENSING ASSEMBLY

• US 20090101792A1
• Filed: 10/14/2008
• Published: 04/23/2009
• Est. Priority Date: 10/22/2007
• Status: Abandoned Application

• Current Assignee: CyberOptics Semiconductor, Inc. (Nordson Corporation)
• Original Assignee: CyberOptics Semiconductor, Inc. (Nordson Corporation)
• Inventors: Bonciolini, Dennis J., Schuda, Felix J.
• Application Number:
  US12/250,692
• Publication Number:
  US 20090101792A1
• Time in Patent Office: Days
• US Class Current: 250/201.100
• CPC Class Codes: G01J 1/02 Details
• CPC Class Codes: G01J 1/0219 Electrical interface; User interface
• CPC Class Codes: G01J 1/0233 Handheld
• CPC Class Codes: G01J 1/0247 using a charging unit
• CPC Class Codes: G01J 1/0252 Constructional arrangements for compensating for fluctuations caused by, e.g. temperature, or using cooling or temperature stabilization of parts of the device; Controlling the atmosphere inside a photometer; Purge systems, cleaning devices protection against electromagnetic interferences G01J2001/0276
• CPC Class Codes: G01J 1/32 adapted for automatic variation of the measured or reference value regulation of light intensity G05D25/00
• CPC Class Codes: G03F 7/70558 Dose control, i.e. achievement of a desired dose
• CPC Class Codes: H01L 21/67253 Process monitoring, e.g. flow or thickness monitoring

Abstract

A wireless illumination sensing assembly for sensing a property of illumination within a semiconductor processing environment is provided. The sensing assembly has a power source and a wireless communication module coupled to the power source. Measurement circuitry is also provided. At least one illumination sensor having an electrical characteristic that varies with the property of illumination. The illumination sensor(s) is/are coupled to the measurement circuitry.

Claims

1. A wireless illumination sensing assembly for sensing a property of illumination within a semiconductor processing environment, the assembly comprising:

a power source;

a wireless communication module coupled to the power source;

measurement circuitry operably coupled to the wireless communication module; and

at least one illumination sensor having an electrical characteristic that varies with the property of illumination, the at least one illumination sensor being coupled to the measurement circuitry.

2. The assembly of claim 1, and further comprising a controller coupled to the power source and the wireless communication module.

3. The assembly of claim 1, wherein the assembly is embodied in the form of a wafer.

4. The assembly of claim 1, wherein the assembly is embodied in the form of a reticle.

5. The assembly of claim 1, wherein the at least one illumination sensor includes a photodetector.

6. The assembly of claim 5, wherein the photodetector is a solid state photodetector.

7. The assembly of claim 6, wherein the solid state photodetector is a modified silicon p-n diode.

8. The assembly of claim 6, wherein the solid state photodetector is a GaN photodiode.

9. The assembly of claim 6, wherein the solid state photodetector is a SiC photodiode.

10. The assembly of claim 6, wherein the solid state photodetector is a diamond photodiode.

11. The assembly of claim 1, wherein the at least one illumination sensor includes a plurality of illumination sensors spaced from one another.

12. The assembly of claim 11, wherein the at least one illumination sensor is sensitive to a different aspect of the illumination than another illumination sensor.

13. The assembly of claim 2, wherein the controller is configured to store multiple measurements relative to each respective illumination sensor.

14. The assembly of claim 1, wherein the power source is a rechargeable power source.

15. The assembly of claim 1, wherein the wireless communication module is configured to provide bi-directional radio-frequency communication.

16. A method of adjusting illumination of an illumination source in a semiconductor processing environment, the method comprising:

placing a wireless illumination sensor within a semiconductor processing environment to receive at least some of the illumination;

measuring the illumination with the wireless illumination sensor;

communicating information regarding the illumination to an illumination controller wirelessly; and

adjusting a control signal to an illuminator in the semiconductor processing environment based upon the wirelessly-communicated information.