CONNECTION STRUCTURE AND METHOD OF PRODUCING THE SAME

• US 20090102064A1
• Filed: 04/18/2007
• Published: 04/23/2009
• Est. Priority Date: 04/27/2006
• Status: Active Grant

• Current Assignee: Panasonic Corporation (Panasonic Holdings Corporation)
• Original Assignee: Panasonic Corporation (Panasonic Holdings Corporation)
• Inventors: Nakatani, Seiichi, Kitae, Takashi, Karashima, Seiji, Sawada, Susumu
• Granted Patent: US 8,097,958 B2
• Time in Patent Office: Days
• US Class Current: 257/778
• CPC Class Codes: H01L 2224/13099 Material
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16501 at the bonding interface
• CPC Class Codes: H01L 2224/29101 the principal constituent melting at a temperature of less than 400°C
• CPC Class Codes: H01L 2224/29111 Tin [Sn] as principal constituent
• CPC Class Codes: H01L 2224/2929 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/293 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/29311 Tin [Sn] as principal constituent
• CPC Class Codes: H01L 2224/29339 Silver [Ag] as principal constituent
• CPC Class Codes: H01L 2224/29347 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/81193 wherein the bump connectors are disposed on both the semiconductor or solid-state body and another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/81801 Soldering or alloying
• CPC Class Codes: H01L 2224/8192 Applying permanent coating, e.g. protective coating
• CPC Class Codes: H01L 2224/83192 wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/83851 being an anisotropic conductive adhesive
• CPC Class Codes: H01L 2224/83855 Hardening the adhesive by curing, i.e. thermosetting
• CPC Class Codes: H01L 2224/83886 Involving a self-assembly process, e.g. self-agglomeration of a material dispersed in a fluid
• CPC Class Codes: H01L 24/11 Manufacturing methods for bumps on insulating substrates H01L21/4853
• CPC Class Codes: H01L 24/12 Structure, shape, material or disposition of the bump connectors prior to the connecting process
• CPC Class Codes: H01L 24/16 of an individual bump connector
• CPC Class Codes: H01L 24/29 : of an individual layer connector
• CPC Class Codes: H01L 24/31 : Structure, shape, material or disposition of the layer connectors after the connecting process
• CPC Class Codes: H01L 24/81 : using a bump connector
• CPC Class Codes: H01L 24/83 : using a layer connector
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/00015 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed as prior art
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01009 : Fluorine [F]
• CPC Class Codes: H01L 2924/01011 : Sodium [Na]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01019 : Potassium [K]
• CPC Class Codes: H01L 2924/01023 : Vanadium [V]
• CPC Class Codes: H01L 2924/01027 : Cobalt [Co]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/0105 : Tin [Sn]
• CPC Class Codes: H01L 2924/01056 : Barium [Ba]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/01083 : Bismuth [Bi]
• CPC Class Codes: H01L 2924/0132 : Binary Alloys
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/0665 : Epoxy resin
• CPC Class Codes: H01L 2924/0781 : being an ohmic electrical conductor
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/1579 : with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2924/351 : Thermal stress
• CPC Class Codes: H05K 2203/083 : Evaporation or sublimation of a compound, e.g. gas bubble generating agent
• CPC Class Codes: H05K 2203/087 : Using a reactive gas
• CPC Class Codes: H05K 3/323 : by applying an anisotropic conductive adhesive layer over an array of pads
• CPC Class Codes: H05K 3/3436 : having an array of bottom contacts, e.g. pad grid array or ball grid array components
• CPC Class Codes: H05K 3/3485 : Applying solder paste, slurry or powder thick film methods for applying conductive paste or ink patterns H05K3/12
• CPC Class Codes: H05K 3/361 : Assembling flexible printed circuits with other printed circuits
• CPC Class Codes: H05K 3/363 : by soldering
• CPC Class Codes: Y02P 70/50 : Manufacturing or production processes characterised by the final manufactured product

Abstract

A connection structure (package 10) has a first plate body 101 and a second plate body; in the first plate body 101, a wiring pattern having a plurality of connection terminals 102 is formed, and the second plate body has at least two connection terminals (electrode terminals 104) arranged facing the connection terminals of the first plate body 101. The connection terminals of the first and second plate bodies are connection terminals formed as projections on the surfaces of the first and second plate bodies. A conductive substance 108 is accumulated to cover at least a part of each side face of the connection terminals opposed to each other of the first and second plate bodies, and the connection terminals thus opposed are connected to each other via the conductive substance. The package thus formed is ready for a high-pin-count, narrow-pitch configuration of a next-generation semiconductor chip, and exhibits excellent productivity and reliability. The present invention is advantageous for such a package, for a connection structure applicable to the production of the package, and for a method of producing the connection structure.

Claims

1. A connection structure, comprising:

a first plate body on which a wiring pattern having a plurality of connection terminals is formed; and

a second plate body having at least two connection terminals arranged so as to be opposed to the connection terminals of the first plate body,

wherein

the connection terminals of the first plate body and the connection terminals of the second plate body each are formed in a projection form, on a surface of the first plate body and a surface of the second plate body, respectively;

a conductive substance is accumulated so as to cover at least a part of each side face of the opposed connection terminals of the first and second plate bodies, whereby the opposed connection terminals are connected electrically with each other via the conductive substance, and

the opposed connection terminals of the first and second plate bodies are in either a state (a) such that top faces of the connection terminals of the first and second plate bodies at least partially are in direct contact with each other, or a state (b) such that the conductive substance further is interposed at least partially between opposed top faces of the connection terminals of the first and second plate bodies.

2. The connection structure according to claim 1, wherein the conductive substance accumulated so as to cover at least a part of each side face of the opposed connection terminals of the first and second plate bodies is made of a powder-like conductive substance, so that the opposed connection terminals are connected electrically by contact of particles of the powder-like conductive substance.

3. The connection structure according to claim 1, wherein the conductive substance accumulated so as to cover at least a part of each side face of the opposed connection terminals of the first and second plate bodies is molten and solidified thereby forming connection bodies, so that the opposed connection terminals are connected electrically by the connection bodies.

4. The connection structure according to claim 1, wherein the conductive substance interposed between the opposed top faces of the connection terminals of the first and second plate bodies is embedded in parts of the top faces of the connection terminals of the first and second plate bodies.

5. The connection structure according to claim 1, wherein the conductive substance interposed between the opposed top faces of the connection terminals of the first and second plate bodies is sandwiched in parts of gaps between the top faces of the connection terminals of the first and second plate bodies.

6. The connection structure according to claim 4, wherein at least a part of the conductive substance interposed between the opposed top faces of the connection terminals of the first and second plate bodies is molten and solidified, thereby wetting at least parts of the top faces of the connection terminals of the first and second plate bodies.

7. The connection structure according to claim 1, wherein entire side faces of the opposed connection terminals of the first and second plate bodies are covered with the conductive substance.

8. The connection structure according to claim 1, wherein entire side faces of the opposed connection terminals of the first and second plate bodies are covered with connection bodies formed with the molten and solidified conductive substance.

9. The connection structure according to claim 1, wherein the first plate body is a plate body containing an inorganic filler and a thermosetting resin.

10. The connection structure according to claim 1, wherein the first plate body is a plate body containing

at least one reinforcing material selected from a woven fabric of a glass fiber, a nonwoven fabric of a glass fiber, a woven fabric of a heat-resistant organic fiber, and a nonwoven fabric of a heat-resistant organic fiber, and

a thermosetting resin composition impregnated in the reinforcing material.

11. The connection structure according to claim 1, wherein the first plate body is a plate body including a flexible board comprising a film and a wiring pattern.

12. The connection structure according to claim 1, wherein the second plate body is an active element.

13. The connection structure according to claim 1, wherein the second plate body is a semiconductor chip.

14. The connection structure according to claim 1, wherein the second plate body is either

a plate body containing at least one reinforcing material selected from a woven fabric of a glass fiber, a nonwoven fabric of a glass fiber, a woven fabric of a heat-resistant organic fiber, and a nonwoven fabric of a heat-resistant organic fiber;

and a thermosetting resin composition impregnated in the reinforcing material, or

a plate body containing the inorganic filler and a thermosetting resin.

15. The connection structure according to claim 1, wherein the second plate body is a plate body including a flexible board comprising a film and a wiring pattern.

16. The connection structure according to claim 1, wherein the conductive substance contains at least one of metal particles made of a single metal composition, solder particles, metal particles plated with solder or metal, and resin particles plated with solder or metal.

17. The connection structure according to claim 1, wherein the conductive substance comprises two types of conductive substances.

18. The connection structure according to claim 1, wherein a resin or a resin composition is filled between the first plate body and the second plate body.

19. The connection structure according to claim 18, wherein the resin or the resin composition is made of a resin or a resin composition in a sheet form or a paste form.

20. A method of producing a connection structure in which a second plate body having, on its surface, at least two connection terminals each formed in a projection form is arranged so as to be opposed to a first plate body having, on its surface, a wiring pattern having a plurality of connection terminals each in a projection form, and the connection terminals of the first plate body and the connection terminals of the second plate body are connected electrically, the method comprising the steps of:

(i) aligning the connection terminals of the first plate body and the connection terminals of the second plate body so that they are opposed to each other, so that opposed top faces of the connection terminals of the first plate body and the connection terminals of the second plate body are brought into contact with each other at least partially;

(ii) supplying a resin composition containing the conductive substance and the convective additive into a gap between the first plate body and the second plate body; and

(iii) heating the resin composition,

wherein in the heating step (iii), convection occurs in the resin composition owing to bubbles generated mainly from the convective additive, thereby causing at least a part of the conductive substance in the resin composition interposed between the adjacent connection terminals to accumulate in a self-assembly manner so as to cover at least a part of each side face of the opposed connection terminals, whereby the opposed connection terminals of the first and second plate bodies are connected electrically.

21. The method of producing a connection structure according to claim 20, wherein in the step (iii), the conductive substance accumulated so as to cover at least a part of each side face of the opposed connection terminals of the first and second plate bodies further is molten and solidified so as to form connection bodies, whereby the connection bodies electrically connect the connection terminals of the first plate body and the connection terminals of the second plate body with each other.

22. The method of producing the connection structure according to claim 20, wherein in the step (iii), the conductive substance accumulated so as to cover at least a part of each side face of the opposed connection terminals of the first and second plate bodies is a powder-like conductive substance, so that contact of particles of the powder-like conductive substance electrically connects the connection terminals of the first plate body and the connection terminals of the second plate body with each other.

27. The method of producing a connection structure according to claim 20, wherein the first plate body is either

a plate body containing at least one reinforcing material selected from a woven fabric of a glass fiber, a nonwoven fabric of a glass fiber, a woven fabric of a heat-resistant organic fiber, and a nonwoven fabric of a heat-resistant organic fiber, and a thermosetting resin composition impregnated in the reinforcing material, or

a plate body containing an inorganic filler and a thermosetting resin.

28. The method of producing a connection structure according to claim 20, wherein the first plate body is a plate body including a flexible board comprising a film and a wiring pattern.

29. The method of producing a connection structure according to claim 20, wherein the second plate body is an active element.

30. The method of producing a connection structure according to claim 20, wherein the second plate body is a semiconductor chip.

31. The method of producing a connection structure according to claim 20, wherein the second plate body is either

a plate body containing at least one reinforcing material selected from a woven fabric of a glass fiber, a nonwoven fabric of a glass fiber, a woven fabric of a heat-resistant organic fiber, and a nonwoven fabric of a heat-resistant organic fiber, and a thermosetting resin composition impregnated in the reinforcing material, or

a plate body containing an inorganic filler and a thermosetting resin.

32. The method of producing a connection structure according to claim 20, wherein the second plate body is a plate body including a flexible board comprising a film and a wiring pattern.

33. The method of producing a connection structure according to claim 20, wherein the convective additive is an additive that generates bubbles so as to cause convection in the resin composition when the resin composition is heated in the step (iii) or the step (vi).

34. The method of producing a connection structure according to claim 20, wherein the conductive substance contains at least one of metal particles made of a single metal composition, solder particles, metal particles plated with solder or metal, and resin particles plated with solder or metal.

35. The method of producing a connection structure according to claim 20, further comprising, prior to the step (i), the step of supplying a second conductive substance to the opposed top faces of either the connection terminals of the first plate body or the connection terminals of the second plate body preliminarily.

36. The method of producing a connection structure according to claim 35, wherein the second conductive substance is a conductive substance having a melting point different from that of the conductive substance used in the step (ii).

23. A method of producing a connection structure in which a second plate body having, on its surface, at least two connection terminals each formed in a projection form is arranged so as to be opposed to a first plate body having, on its surface, a wiring pattern having a plurality of connection terminals each in a projection form, and the connection terminals of the first plate body and the connection terminals of the second plate body are connected electrically, the method comprising the steps of:

(iv) supplying a resin composition containing the conductive substance and the convective additive over the first plate body;

(v) aligning the connection terminals of the first plate body and the connection terminals of the second plate body so as to sandwich the resin composition between the connection terminals of the first plate body and the connection terminals of the second plate body, and pressing the same so as to provide electric connection; and

(vi) heating the resin composition,

wherein in the heating step (vi), convection occurs in the resin composition owing to bubbles generated mainly from the convective additive, thereby causing at least a part of the conductive substance in the resin composition interposed between the adjacent connection terminals to accumulate in a self-assembly manner so as to cover at least a part of each side face of the opposed connection terminals, whereby the opposed connection terminals of the first and second plate bodies are connected electrically.

24. The method of producing a connection structure according to claim 23, wherein in the step (v), the conductive substance sandwiched between the opposed connection terminals of the first and second plate bodies is caused to be embedded in parts of the connection terminals of the first and second plate bodies.

25. The method of producing a connection structure according to claim 23, wherein in the step (vi), the conductive substance sandwiched between the opposed connection terminals of the first and second plate bodies is molten and solidified, thereby wetting at least parts of the top faces of the connection terminals of the first and second plate bodies.

26. The method of producing a connection structure according to claim 23, wherein in the step (vi),

the conductive substance sandwiched between the opposed top faces of the connection terminals of the first and second plate bodies is molten and solidified, thereby wetting at least parts of the top faces of the connection terminals of the first and second plate bodies, and

the conductive substance accumulated so as to cover at least a part of each side face of the connection terminals of the first and second plate bodies is molten and solidified thereby forming connection bodies, so that the connection terminals of the first plate body and the connection terminals of the second plate body are connected electrically with each other by the connection bodies.