TOUCH PANEL AND FABRICATING METHOD THEREOF

• US 20090102808A1
• Filed: 10/14/2008
• Published: 04/23/2009
• Est. Priority Date: 10/17/2007
• Status: Abandoned Application

• Current Assignee: Wintek Corporation
• Original Assignee: Wintek Corporation
• Inventors: Hwang, Chin-Pei, Huang, Ping-Wen, Kuo, Chien-Chung
• Application Number:
  US12/251,421
• Publication Number:
  US 20090102808A1
• Time in Patent Office: Days
• US Class Current: 345/173
• CPC Class Codes: G06F 3/041 Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
• CPC Class Codes: G06F 3/0445 using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer

Abstract

A method of fabricating a touch panel is provided. First, a first substrate having a first electrode layer is provided. Then, a sealant is formed on the first substrate, and the sealant surrounds a periphery of the first substrate to define a closed area. Next, a dielectric material is dripped in the closed area. Then, a second substrate having, a second electrode layer is provided. The first substrate and the second substrate are assembled and joined by the sealant, such that the dielectric material fills the closed area to form a dielectric layer between the first substrate and the second substrate. The touch panel has good quality, and the yield rate of the method of fabricating the touch panel is high.

Claims

1. A method of fabricating a touch panel, comprising:

providing a first substrate having a first electrode layer;

forming a sealant on the first substrate, wherein the sealant surrounds a periphery of the first substrate to define a closed area;

dripping a dielectric material into the closed area; and

providing a second substrate having a second electrode layer, wherein the first substrate and the second substrate are assembled and joined by the sealant, and the dielectric material fills the closed area to form a dielectric layer between the first substrate and the second substrate.

2. The method of fabricating a touch panel as claimed in claim 1, wherein a method of forming the sealant comprises a printing process.

3. The method of fabricating a touch panel as claimed in claim 2, wherein the printing process comprises screen printing, ink jet printing, offset printing, relief printing, or gravure printing.

4. The method of fabricating a touch panel as claimed in claim 1, wherein a method of forming the sealant comprises a dispensing process.

5. The method of fabricating a touch panel as claimed in claim 1, after the first substrate and the second substrate are assembled and joined, further comprising a curing process for curing the sealant.

6. The method of fabricating a touch panel as claimed in claim 5, wherein the curing process comprises thermal curing, light curing, UV curing, or a combination thereof.

7. The method of fabricating a touch panel as claimed in claim 1, wherein a method of forming the dielectric layer comprises curing the dielectric material in the closed area.

8. The method of fabricating a touch panel as claimed in claim 1, further comprising forming a plurality of supports on at least one of the first substrate and the second substrate, wherein the supports are disposed in the closed area.

9. The method of fabricating a touch panel as claimed in claim 8, wherein the sealant and the supports are simultaneously formed.

10. The method of fabricating a touch panel as claimed in claim 8, wherein a method of forming the supports comprises a spraying process for spraying a plurality of ball supports in the closed area.

11. The method of fabricating a touch panel as claimed in claim 8, wherein a method of forming the supports comprises a photolithography process.

12. The method of fabricating a touch panel as claimed in claim 8, wherein a method of forming the supports comprises a dispensing process.

13. The method of fabricating a touch panel as claimed in claim 8, wherein a method of forming the supports comprises a printing process.

14. The method of fabricating a touch panel as claimed in claim 13, wherein the printing process comprises screen printing, ink jet printing, offset printing, relief printing, or gravure printing.

15. A touch panel, comprising:

a first substrate, having a first electrode layer;

a second substrate, having a second electrode layer;

a sealant, disposed between the first substrate and the second substrate, and defining a closed area with the first substrate and the second substrate; and

a dielectric layer, disposed in the closed area.

16. The touch panel as claimed in claim 15, wherein the first electrode layer comprises a plurality of strip electrodes.

17. The touch panel as claimed in claim 15, wherein the second electrode layer comprises a plurality of strip electrodes.

18. The touch panel as claimed in claim 15, further comprising a plurality of supports disposed in the closed area.

19. The touch panel as claimed in claim 18, wherein the supports are a plurality of pillar supports.

20. The touch panel as claimed in claim 19, wherein a material of the pillar supports is one selected from among a photoresist material, a light curable material, and a thermally curable material.

21. The touch panel as claimed in claim 18, wherein the supports are a plurality of ball supports.

22. The touch panel as claimed in claim 21, wherein a material of the ball supports comprises silicon dioxide or glass.

23. The touch panel as claimed in claim 15, wherein the first substrate is disposed between the first electrode layer and the dielectric layer.

24. The touch panel as claimed in claim 15, wherein the first electrode layer is disposed between the first substrate and the dielectric layer.

25. The touch panel as claimed in claim 15, wherein the second substrate is disposed between the second electrode layer and the dielectric layer.

26. The touch panel as claimed in claim 15, wherein the second electrode layer is disposed between the second substrate and the dielectric layer.

27. The touch panel as claimed in claim 15, wherein a material of the dielectric layer is one selected from among a thermal curable material, a light curable material, and a UV-thermal curable material.