CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME

• US 20090103276A1
• Filed: 09/26/2008
• Published: 04/23/2009
• Est. Priority Date: 09/27/2007
• Status: Active Grant

• Current Assignee: Semiconductor Components Industries LLC (ON Semiconductor Corporation)
• Original Assignee: Sanyo Semiconductor Company Limited (ON Semiconductor Corporation), Sanyo Electric Company Limited (Panasonic Holdings Corporation)
• Inventors: Koike, Yasuhiro, Tsukizawa, Masao, Saito, Hidefumi, SAKAMOTO, Hideyuki
• Granted Patent: US 8,107,255 B2
• Time in Patent Office: Days
• US Class Current: 361/792
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48472 the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01004 Beryllium [Be]
• CPC Class Codes: H01L 2924/1305 Bipolar Junction Transistor [BJT]
• CPC Class Codes: H01L 2924/13055 Insulated gate bipolar transistor [IGBT]
• CPC Class Codes: H01L 2924/19041 being a capacitor
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H05K 1/144 Stacked arrangements of planar printed circuit boards
• CPC Class Codes: H05K 2201/042 Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
• CPC Class Codes: H05K 2201/10318 Surface mounted metallic pins
• CPC Class Codes: H05K 3/284 for encapsulating mounted components H05K1/185 takes precedence
• CPC Class Codes: H05K 3/3447 Lead-in-hole components H05K3/3415 takes precedence
• CPC Class Codes: H05K 5/065 sealed by encapsulation, e.g. waterproof resin forming an integral casing, injection moulding
• CPC Class Codes: Y10T 29/49146 with encapsulating, e.g., potting, etc.

Abstract

Provided is a circuit device that allows a plurality of circuit boards, which are stacked each other and arranged in a case member, to be sealed with a resin effectively, and a method of manufacturing the same. In a hybrid integrated circuit device, a first circuit board is overlaid with the second circuit board and both of the boards are fitted into the case member. A first circuit element is arranged on the upper surface of the first circuit board and a second circuit element is arranged on the upper surface of the second circuit board. Furthermore, an opening is provided in a side wall part of the case member, and an internal space of the case member communicates with the outside through this opening. Accordingly, in the resin sealing step, a sealing resin can be injected into the internal space of the case member from the outside through this opening.

Claims

1. A circuit device, comprising:

a case member;

a first circuit board and a second circuit board fitted into the case member and arranged in a way that the first circuit board is overlaid with the second circuit board;

a first circuit element fixedly secured to a principal surface of the first circuit board;

a second circuit element fixedly secured to a principal surface of the second circuit board; and

a sealing resin covering at least the principal surface of the first circuit board and the first circuit element, wherein

the case member is provided therein with an opening for allowing the sealing resin to be injected into an internal space of the case member.

2. The circuit device according to claim 1, wherein a side wall of the case member facing the opening has an inclined surface.

3. The circuit device according to claim 1, wherein the sealing resin is filled in the internal space, and is formed so as to cover the principal surface of the second circuit board and the second circuit element.

4. The circuit device according to claim 1, wherein the case member is provided, in the internal space thereof, with a hollow portion which is not filled with the sealing resin.

5. A method of manufacturing a circuit device, comprising the steps of:

fitting, into a case member, a first circuit board having a first circuit element fixedly secured to a principal surface thereof;

fitting, into the case member, a second circuit board having a second circuit element fixedly secured to a principal surface thereof; and

injecting a sealing resin into an internal space surrounded by the case member, the first circuit board, and the second circuit board, to seal the principal surface of the first circuit board and the first circuit element, wherein

in the injecting step, the sealing resin is injected into the internal space from an opening provided in the case member.

6. The method of manufacturing a circuit device according to claim 5, wherein in the injecting step, the sealing resin is filled in the internal space of the case member, while integrally covering an upper surface of the second circuit board and the second circuit element.

7. The method of manufacturing a circuit device according to claim 5, wherein in the injecting step, the sealing resin covers an upper surface of the first circuit board and the first circuit element, and a hollow portion which is not filled with the sealing resin is formed in the internal space of the case member.

8. The method of manufacturing a circuit device according to claim 5, wherein in the injecting step, the sealing resin in liquid or semi-solid form is injected from above toward an inclined part provided in an inner wall of the case member.