FILM FORMING APPARATUS AND METHOD, GAS SUPPLY DEVICE AND STORAGE MEDIUM

• US 20090104351A1
• Filed: 12/19/2008
• Published: 04/23/2009
• Est. Priority Date: 06/20/2006
• Status: Active Grant

• Current Assignee: Tokyo Electron Limited
• Original Assignee: Tokyo Electron Limited
• Inventors: KAKEGAWA, Takashi
• Granted Patent: US 8,133,323 B2
• Time in Patent Office: Days
• US Class Current: 427/248.100
• CPC Class Codes: C23C 16/34 Nitrides C23C16/303 takes precedence
• CPC Class Codes: C23C 16/45523 Pulsed gas flow or change of composition over time
• CPC Class Codes: C23C 16/4557 Heated nozzles
• CPC Class Codes: C23C 16/45572 Cooled nozzles
• CPC Class Codes: C23C 16/45574 Nozzles for more than one gas
• CPC Class Codes: H01L 21/28562 Selective deposition
• CPC Class Codes: H01L 21/67109 mainly by convection
• CPC Class Codes: H01L 21/76841 Barrier, adhesion or liner layers

Abstract

A film forming apparatus is provided with a chamber which defines a processing space for performing a film forming process to a substrate a stage arranged in the chamber for mounting the substrate thereon; a substrate heating unit arranged on the stage for heating the substrate; a shower head which is arranged to face the stage and has many gas injecting holes; a gas supply unit for supplying cooling unit arranged above the shower head for cooling the shower head; and a shower head heating unit arranged above the cooling unit for heating the shower head through the cooling unit.

Claims

1. A film forming apparatus comprising:

a chamber which defines a processing space for performing a film forming process to a substrate;

a stage arranged in the chamber for mounting the substrate thereon;

a substrate heating unit arranged on the stage for heating the substrate;

a shower head which is arranged to face the stage and has a plurality of gas injecting holes;

a gas supply unit for supplying a processing gas into the chamber through the shower head;

a cooling unit arranged above the shower head for cooling the shower head; and

a shower head heating unit arranged above the cooling unit for heating the shower head through the cooling unit.

2. The film forming apparatus of claim 1, wherein the cooling unit includes a plurality of cooling fins and a cooling gas supply channel for supplying cooling gas to the corresponding cooling fins.

3. The film forming apparatus of claim 2, wherein each of the cooling fins is raised and has a horizontally elongated plate shape;

the cooling fins are arranged in parallel; and

the cooling gas supply channel has a gas discharge holes which open to allow cooling gas to pass from one end to the other end of a horizontally extending gap between the cooling fins.

4. The film forming apparatus of claim 1, wherein the cooling unit and the shower head heating unit are accommodated in a housing having a gas exhaust port.

5. The film forming apparatus of claim 1, wherein the shower head includes a gas diffusion space communicating with the gas injecting holes, and a plurality of post portions for transferring heat between an upper side and a lower side of the shower head are disposed in the gas diffusion space.

6. The film forming apparatus of claim 1, further comprising:

a temperature detecting unit for detecting a temperature of a bottom surface of the shower head; and

a control unit for controlling the shower head heating unit based on a detected temperature value of the temperature detecting unit.

7. The film forming apparatus of claim 1, wherein the gas supply unit supplies a first and a second processing gas into the processing space simultaneously or separately in a plurality of cycles.

8. The film forming apparatus of claim 7, wherein the first processing gas is titanium compound gas, and the second processing gas is ammonia gas.

9. A gas supply device for use in a film forming apparatus including a chamber which defines a processing space for performing film forming process to a substrate and a stage arranged in the chamber for mounting the substrate thereon, the gas supply device comprising:

a shower head which is arranged to face the stage and has a plurality of gas injecting holes;

a cooling unit arranged above the shower head for cooling the shower head; and

a shower head heating unit arranged above the cooling unit for heating the shower head through the cooling unit.

10. The gas supply device of claim 9, wherein the cooling unit includes a plurality of cooling fins and a cooling gas supply channel for supplying cooling gas to the corresponding cooling fins.

11. The gas supply unit of claim 10, wherein each of the cooling fins is raised and has a horizontally elongated plate shape;

the cooling fins are arranged in parallel; and

the cooling gas supply channel has gas discharge holes which open to allow cooling gas to pass from one end to the other end of a horizontally extending gap between the cooling fins.

12. The gas supply device of claim 9, wherein the cooling unit and the shower head heating unit are accommodated in a housing having a gas exhaust port.

13. The gas supply device of claim 9, wherein the shower head includes a gas diffusion space communicating with the gas injecting holes, and a plurality of post portions for transferring heat between an upper side and a lower side of the shower head are disposed in the gas diffusion space.

14. The gas supply device of claim 9, further comprising:

a temperature detecting unit for detecting a temperature of a bottom surface of the shower head; and

a control unit for controlling the shower head heating unit based on a detected temperature value of the temperature detecting unit.

15. A film forming method for performing a film forming process on a substrate by using a film forming apparatus including a chamber which defines a processing space for performing film forming process to a substrate, a stage arranged in the chamber for mounting the substrate thereon, a substrate heating unit arranged on the stage for heating the substrate, a shower head which is arranged to face the stage and has a plurality of gas injecting holes, a gas supply unit for supplying a processing gas into the chamber through the shower head, a cooling unit arranged above the shower head for cooling the shower head, and a shower head heating unit arranged above the cooling unit for heating the shower head through the cooling unit, the film forming method comprising:

mounting the substrate on the stage;

heating the substrate by the substrate heating unit;

supplying the processing gas into the chamber via the shower head by the gas supply unit;

cooling the shower head by the cooling unit provided above the shower head; and

heating the shower head via the cooling unit by the shower head heating unit provided above the cooling unit.

16. The film forming method of claim 15, wherein the cooling unit has a plurality of cooling fins and a cooling gas supply channel for supplying cooling gas to the corresponding cooling fins, and the step of cooling the shower head by the cooling unit includes supplying the cooling gas to the cooling fins.

17. The film forming method of claim 15, wherein the film forming apparatus further includes a temperature detecting unit for detecting a temperature of a bottom surface of the shower head, and a control unit for controlling the shower head heating unit based on a detected temperature value of the temperature detecting unit, and the film forming method further comprises detecting a temperature of a bottom surface of the shower head by the temperature detecting unit, and controlling the shower head heating unit based on a detected temperature value of the temperature detecting unit by the control unit.

18. The film forming method of claim 15, wherein the step of supplying the processing gas into the chamber via the shower head by the gas supply unit includes laminating a thin film component layer on the substrate by supplying a first and a second processing gas into the processing space simultaneously or separately in a plurality of cycles.

19. The film forming method of claim 18, wherein the first processing gas is titanium compound gas, and the second processing gas is ammonia gas.

20. A computer-readable storage medium which stores therein a computer program for executing the film forming method of any one of claims 15 to 19 described in a computer, wherein the film forming method performs a film forming process on a substrate by using a film forming apparatus including a chamber which defines a processing space for performing film forming process to a substrate, a stage arranged in the chamber for mounting the substrate thereon, a substrate heating unit arranged on the stage for heating the substrate, a shower head which is arranged to face the stage and has a plurality of gas injecting holes, a gas supply unit for supplying a processing gas into the chamber through the shower head, a cooling unit arranged above the shower head for cooling the shower head, and a shower head heating unit arranged above the cooling unit for heating the shower head through the cooling unit.