FUNCTIONALIZED SUBSTRATES AND METHODS OF MAKING SAME

• US 20090104474A1
• Filed: 10/17/2008
• Published: 04/23/2009
• Est. Priority Date: 10/17/2007
• Status: Abandoned Application

• Current Assignee: Princeton University
• Original Assignee: Princeton University
• Inventors: Schwartz, Jeffrey, Dennes, Thomas J.
• Application Number:
  US12/253,462
• Publication Number:
  US 20090104474A1
• Time in Patent Office: Days
• US Class Current: 428/704
• CPC Class Codes: A61L 27/14 Macromolecular materials
• CPC Class Codes: A61L 27/18 obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
• CPC Class Codes: A61L 27/306 Other specific inorganic materials not covered by A61L27/303 - A61L27/32
• CPC Class Codes: C23C 18/06 Coating on selected surface areas, e.g. using masks
• CPC Class Codes: C23C 18/1216 Metal oxides C23C18/1212 takes precedence
• CPC Class Codes: C23C 18/122 Inorganic polymers, e.g. silanes, polysilazanes, polysiloxanes
• CPC Class Codes: C23C 18/1225 Deposition of multilayers of inorganic material
• CPC Class Codes: C23C 18/1233 Organic substrates
• CPC Class Codes: C23C 18/1237 Composite substrates, e.g. laminated, premixed
• CPC Class Codes: C23C 18/1295 with after-treatment of the deposited inorganic material
• CPC Class Codes: C23C 18/1658 with two steps starting with metal deposition followed by addition of reducing agent
• CPC Class Codes: C23C 18/2066 Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers
• CPC Class Codes: C23C 18/2086 with use of organic or inorganic compounds other than metals, first
• CPC Class Codes: C23C 18/40 using reducing agents
• CPC Class Codes: Y10T 428/24802 Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
• CPC Class Codes: Y10T 428/31786 Of polyester [e.g., alkyd, etc.]
• CPC Class Codes: Y10T 428/31942 Of aldehyde or ketone condensation product

Abstract

Polymer substrates including adhesion layers for activating the surface of the substrate are provided, thereby allowing the substrate to react with organic, inorganic, metallic and/or organometallic materials. The surface of the polymer substrate is coated with a metal oxide layer that is subjected to conditions adequate to form an oxide adhesion layer. Combining deposition techniques for formation of functionalized polymer surfaces with photolithographic techniques enables spatial control of RGD presentation at the polymer surfaces are achieved with sub-cellular resolution. Surface patterning enables control of cell adhesion location at the surface of the polymer and influences cell shape. Metallization of polymers as described herein provides a means to prepare metal-based electrical circuitry on a variety of flexible substrates.

Claims

1. A process for activating a polymer surface comprising the steps of a) contacting a metal alkoxide with the surface;

and b) subjecting the metal alkoxide to conditions adequate to form an oxide adhesion layer on the surface, the conditions selected from one or more of the group consisting of pyrolysis, microwaving, complete hydrolysis and partial hydrolysis.

2. The process according to claim 1, wherein step a) comprises vapor deposition or immersion deposition.

3. The method of claim 1, wherein step b) comprises heating the metal alkoxide to between about 50°

C. and the melting point of the polymer.

4. The method of claim 1, wherein the metal alkoxide is zirconium tetra(tert-butoxide).

5. The method of claim 1, wherein the metal is a Group 3-6 or Group 13-14 transition metal.

6. The method of claim 1, wherein the alkoxide is selected from the group consisting of ethoxide, propoxide, iso-propoxide, butoxide, iso-butoxide, tert-butoxide and fluorinated alkoxide.

7. The method of claim 1, further comprising reacting the oxide adhesion layer with an additional material selected from an organic, metallic, organometallic or inorganic compound to bind the additional material to the polymer surface via the oxide adhesion layer.

8. The method according to claim 7 wherein the additional material comprises an organic compound sufficiently acidic to react with a metal oxide or alkoxide.

9. The method according to claim 8 wherein the additional material comprises an organic compound selected from the group consisting of a carboxylic, phosphonic, phosphoric, phosphinic, sulfinic, sulfonic and hydroxamic compound.

10. The method according to claim 7 wherein the additional material comprises a metallic compound.

11. The method according to claim 10 wherein the metallic compound comprises Cu, Ag, Au, Al, Ni, Rh, Pd, Pt.

12. The method according to claim 10 wherein the metallic compound is copper sulfate.

13. The method according to claim 10 wherein the metallic compound is silver nitrate.

14. The method according to claim 7 wherein the additional material comprises an organometallic compound that can react with an oxide, alkoxide, hydroxide or hydroxyl or π

-bond.

15. The method according to claim 7 wherein the additional material comprises an inorganic compound.

16. The method according to claim 7 wherein the additional material is selected from the group consisting of silanes, siloxanes, carboxylates, phosphonates, alkenes, alkynes, alkyl halides, epoxides, carboxylic esters, amides, phosphonate esters and imides.

17. The method according to claim 7 wherein the additional material is introduced to the oxide adhesion layer by evaporative or sputter deposition.

18. The method according to claim 7 wherein the additional material is introduced to the oxide adhesion layer by immersion or extractive deposition.

19. The method according to claim 7, comprising optionally subjecting the oxide adhesion layer to complete or partial hydrolysis prior to deposition of the additional material.

20. The method according to claim 7, further comprising subjecting a deposited additional material to heat or microwave treatment.

21. The method according to claim 20 wherein the additional material is a metal.

22. The method according to claim 20 wherein the additional material is an inorganic compound with a high dielectric constant.

23. The method according to claim 20 wherein the additional material comprises a flexible circuit device.

24. The method according to claim 7 wherein the additional material comprises one or more polymers.

25. The method according to claim 1 comprising functionalizing the adhesion layer to elicit a biological response.

26. The method according to claim 25 wherein the biological response is cell attraction and the adhesion layer comprises a material selected from an organic acid, nucleic acid, protein, and peptide.

27. The method according to claim 1, wherein the adhesion layer is continuous.

28. The method of claim 1, wherein the polymer surface contains a surface coordinating group that is capable of coordinating with the metal atom of the metal alkoxide.

29. The method of claim 1, wherein the polymer is selected from the group consisting of polyamides, polyurethanes, polyureas, polyesters, polyketones, polyimides, polysulfides, polysulfoxides, polysulfones, polythiophenes, polypyridines, polypyrroles, polyethers, silicones, polyamides, polysaccharides, fluoropolymers, amides, imides, polypeptides, polyethylene, polystyrene and polypropylene.

30. The method of claim 1, wherein the polymer is selected from the group consisting of polyethylene terephthalate (PET), polyetheretherketones (PEEK), and nylon.

31. A composition comprising a polymer substrate having a surface, and an oxide adhesion layer bonded to the surface, wherein the oxide adhesion layer comprises a metal alkoxide subjected to treatment by one or more of the group consisting of pyrolysis, microwaving, complete hydrolysis and partial hydrolysis.

32. The composition of claim 31, wherein the metal alkoxide is zirconium tetra(tert-butoxide).

33. The composition of claim 31, wherein the metal is a Group 3-6 or Group 13-14 metal.

34. The composition of claim 31, wherein the alkoxide is selected from the group consisting of ethoxide, propoxide, iso-propoxide, butoxide, iso-butoxide, tert-butoxide and fluorinated alkoxide.

35. The composition of claim 31, comprising an additional material selected from an organic, metallic, organometallic or inorganic compound disposed on the oxide adhesion layer.

36. The composition according to claim 35 wherein the additional material comprises an organic compound sufficiently acidic to react with a metal oxide or alkoxide.

37. The composition according to claim 35 wherein the additional material comprises an organic compound selected from the group consisting of a carboxylic, phosphonic, phosphoric, phosphinic, sulfinic, sulfonic and hydroxamic compound.

38. The composition according to claim 35 wherein the additional material comprises a metallic compound or metal.

39. The composition according to claim 31 wherein the metallic compound comprises Cu, Ag, Au, Al, Ni, Rh, Pd or Pt or a salt thereof.

40. The composition according to claim 31 wherein the metallic compound is copper sulfate.

41. The composition according to claim 31 wherein the metallic compound is silver nitrate.

42. The composition according to claim 31 wherein the additional material comprises an organometallic compound that can react with an oxide, alkoxide, hydroxide, hydroxyl or π

-bond.

43. The composition according to claim 35 wherein the additional material comprises an inorganic compound.

44. The composition according to claim 35 wherein the additional material is selected from the group consisting of silanes, siloxanes, carboxylates, phosphonates, alkenes, alkines, alkyl halides, epoxides, carboxylic esters, amides, phosphonate ester and imides.

45. The composition according to claim 35 wherein the additional material is introduced to the oxide adhesion layer by evaporative or sputter deposition.

46. The composition according to claim 35 wherein the additional material is introduced to the oxide adhesion layer by immersion or extractive deposition.

47. The composition according to claim 35, wherein the oxide adhesion layer is optionally subjected to complete or partial hydrolysis prior to deposition of the additional material.

48. The composition according to claim 35, comprising subjecting a deposited additional material to heat or microwave treatment.

49. The composition according to claim 48 wherein the additional material is a metal.

50. The composition according to claim 48 wherein the additional material is an inorganic compound with a high dielectric constant.

51. The composition according to claim 48 wherein the additional material comprises a flexible circuit device.

52. The composition according to claim 35 wherein the additional material comprises one or more polymers.

53. The composition according to claim 31 wherein the adhesion layer is functionalized to elicit a biological response.

54. The composition according to claim 53 wherein the biological response is cell attraction and the adhesion layer comprises a material selected from an organic acid, nucleic acid, protein, and peptide.

55. A cardiovascular or vascular implant device comprising the composition according to claim 31.

56. The device according to claim 55 selected from the group stents, replacement heart valves, replacement heart valve components, leaflets, sewing cuffs, orifices, annuloplasty rings, pacemakers, pacemaker polymer mesh bags, pacemaker leads, pacing wires, intracardiac patches/pledgets, vascular patches, vascular grafts, intravascular catheters, and defibrillators.

57. A tissue scaffold device comprising the composition according to claim 31.

58. The device according to claim 57 selected from the group non-woven meshes, woven meshes, and foams.

59. The composition according to claim 31 wherein the adhesion layer is functionalized to increase osteoconductivity.

60. The composition according to claim 59 wherein the adhesion layer comprises a material selected from a Group 3-6 or Group 13-14 metal oxide or a a Group 3-6 or Group 13-14 metal mixed oxide alkoxide.

61. An orthopedic implant device comprising the composition according to claim 31.

62. The device according to claim 61 selected from an orthopedic trauma implant, joint implant, spinal implant, plate, screw, rods, plug, cage, pin, nail, wire, cable, anchor, scaffold, artificial joint selected from a hand joint, wrist joint, elbow joint, shoulder joint, spine joint, hip joint, knee joint and ankle joint;

bone replacement, bone fixation cerclage and dental and maxillofacial implants.

63. A spine implant device comprising the composition according to claim 31.

64. The device according to claim 63 selected from the group intervertebral cages, pedicle screws, rods, connectors, cross-links, cables, spacers, facet replacement devices, facet augmentation devices, interspinous process decompression devices, interspinous spacers, vertebral augmentation devices, wires, plates, spine arthroplasty devices, facet fixation devices, bone anchors, soft tissue anchors, hooks, spacing cages, and cement restricting cages.

65. The composition according to claim 31 wherein the adhesion layer is functionalized for bioresistance.

66. The composition according to claim 65 wherein the adhesion layer comprises at least one PEGylated region.

67. A device comprising a composition according claim 65 selected from the group of diagnostic implant, biosensor, glucose monitoring devices, external fixation device, external fixation implant, external facial fracture fixation devices and implants, orthopedic trauma implants and devices selected from plates, wires, screws, rods, nails, pins, cables, spacing cages, cement restricting cages;

cardiovascular devices and implants selected from stents, replacement heart valves, replacement heart valve components, leaflets, sewing cuffs, orifices, annuloplasty rings, pacemakers, pacemaker polymer mesh bags, pacemaker leads, pacing wires, intracardiac patches/pledgets, vascular patches, vascular grafts, and intravascular catheters;

contact lens, intraocular implants, keratoprostheses;

neurosurgical devices and implants selected from shunts, coils;

general surgical devices and implants selected from drainage catheters, shunts, tapes, meshes, ropes, cables, wires, sutures, skin staples, burn sheets, and vascular patches; and

temporary/non-permanent implants.

68. The composition according to claim 31 wherein the adhesion layer is disposed on the substrate in a pattern or micropattern.

69. The composition according to claim 35 wherein the additional material is disposed on the adhesion layer in a pattern or micropattern.

70. The composition according to claim 31 wherein the adhesion layer and/or the additional material contain at least two different regions of functionalization.

71. The composition according to claim 31, wherein the adhesion layer is continuous.

72. The composition of claim 31, wherein the polymer surface contains a surface coordinating group that is capable of coordinating with the metal atom of the metal alkoxide.

73. The composition of claim 31, wherein the polymer is selected from the group consisting of polyamides, polyurethanes, polyureas, polyesters, polyketones, polyimides, polysulfides, polysulfoxides, polysulfones, polythiophenes, polypyridines, polypyrroles, polyethers, silicones, polysiloxanes, polysaccharides, fluoropolymers, amides, imides, polypeptides, polyethylene, polystyrene, polypropylene, glass reinforced epoxies, liquid crystal polymers, thermoplastics, bismaleimide-triazine (BT) resins, benzocyclobutene polymers, Ajinomoto Buildup Films (ABF), low coefficient of thermal expansion (CTE) films of glass and epoxies, and composites including these polymers.

74. The composition of claim 31, wherein the polymer is selected from the group consisting of polyethylene terephthalate (PET), polyetheretherketones (PEEK), and nylon.

75. The composition of claim 31, wherein the alkoxide is selected from the group consisting of ethoxide, propoxide, iso-propoxide, butoxide, iso-butoxide and tert-butoxide.

76. The composition according to claim 35, wherein the additional material comprises copper.

77. The composition according to claim 35, wherein the additional material comprises copper formed from an electroless copper solution.

78. The composition according to claim 31, wherein the polymer is one or more dielectric films, and the additional material comprises a one or more metallic layers.

79. The composition according to claim 31, where the polymer is selected from glass reinforced epoxies, liquid crystal polymers, thermoplastics, bismaleimide-triazine resins, benzocyclobutene polymers, Ajinomoto Buildup Films, low coefficient of thermal expansion films of glass and epoxies, and composites including these polymers.

80. The composition according to claim 31, where the polymer is a patterned dielectric film, and comprising one or more metallic layers forming an electrical circuit.

81. A dental implant device comprising the composition according to claim 31.

82. A maxillofacial implant device comprising the composition according to claim 31.

83. A general surgical device comprising the composition according to claim 31 selected from drainage catheters, shunts, tapes, meshes, ropes, cables, wires, sutures, skin staples, burn sheets, and vascular patches.

84. A sports medicine device comprising the composition according to claim 31 selected from staples, bone anchors, soft tissue anchors.