SELECTIVE ETCHING OF SILICON NITRIDE
First Claim
1. A method for etching a dielectric layer comprising:
- providing a substrate having a dielectric layer comprising silicon and nitrogen;
forming reactive species from a process gas comprising hydrogen (H2) and nitrogen trifluoride (NF3) using a remote plasma; and
etching the dielectric layer using the reactive species.
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Abstract
Methods for etching dielectric layers comprising silicon and nitrogen are provided herein. In some embodiments, such methods may include providing a substrate having a dielectric layer comprising silicon and nitrogen disposed thereon, forming reactive species from a process gas comprising hydrogen (H2) and nitrogen trifluoride (NF3) using a remote plasma; and etching the dielectric layer using the reactive species. In some embodiments, an oxide layer is disposed adjacent to the dielectric layer. In some embodiments, the flow rate ratio of the process gas can be adjusted such that an etch selectivity of the dielectric layer to at least one of the oxide layer or the substrate is between about 0.8 to about 4.
266 Citations
20 Claims
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1. A method for etching a dielectric layer comprising:
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providing a substrate having a dielectric layer comprising silicon and nitrogen; forming reactive species from a process gas comprising hydrogen (H2) and nitrogen trifluoride (NF3) using a remote plasma; and etching the dielectric layer using the reactive species. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A computer readable medium comprising instructions that, when executed by a processor, causes a process chamber to perform a method of etching a substrate disposed in the process chamber and having a dielectric layer comprising silicon and nitrogen, the method comprising:
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forming reactive species from a process gas comprising hydrogen (H2) and nitrogen trifluoride (NF3) using a remote plasma; and etching the dielectric layer using the reactive species. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 20)
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Specification