LED METAL STRIP FLEXIBLE INTERCONNECTION

• US 20090104804A1
• Filed: 10/23/2007
• Published: 04/23/2009
• Est. Priority Date: 10/23/2007
• Status: Abandoned Application

• Current Assignee: Varroc Lighting Systems S.R.O. (Varroc Engineering Limited)
• Original Assignee: Varroc Lighting Systems S.R.O. (Varroc Engineering Limited)
• Inventors: Lin, Jeff
• Application Number:
  US11/876,838
• Publication Number:
  US 20090104804A1
• Time in Patent Office: Days
• US Class Current: 439/211
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• CPC Class Codes: F21S 43/14 Light emitting diodes [LED]
• CPC Class Codes: F21Y 2107/00 Light sources with three-dimensionally disposed light-generating elements
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H05K 1/0284 Details of three-dimensional rigid printed circuit boards H05K1/119 takes precedence; shaping of the substrate H05K3/0014
• CPC Class Codes: H05K 1/029 having a programmable lay-out, i.e. adapted for choosing between a few possibilities
• CPC Class Codes: H05K 2201/09063 Holes or slots in insulating substrate not used for electrical connections
• CPC Class Codes: H05K 2201/10106 Light emitting diode [LED]
• CPC Class Codes: H05K 2201/10598 Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB
• CPC Class Codes: H05K 2203/175 Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections
• CPC Class Codes: H05K 3/202 using self-supporting metal foil pattern
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base

Abstract

An LED interconnection apparatus and a method of electrical connection for an array of LEDs are disclosed, the LED interconnection apparatus including a back plate substrate having a plurality of adaptable through-holes formed therein and a flexible conductive pattern disposed adjacent the back plate substrate, wherein the adaptable through-holes of the back plate substrate facilitate selective access to the flexible conductive pattern to provide a simple, adaptable, and standardized method of electrical communication for an array of LEDs.

Claims

1. A method of electrical connection for an LED array, the method comprising the steps of:

providing a back plate substrate including a plurality of adaptable through-holes;

providing a flexible conductive pattern disposed adjacent the back plate substrate, wherein the adaptable through-holes of the back plate substrate facilitate selective access to the flexible conductive pattern;

forming the flexible conductive pattern using a first forming operation to conform to a shape of the back plate substrate;

coupling the flexible conductive pattern to a first side of the back plate substrate;

shaping a desired number of unformed connector terminals using a second forming operation to provide electrical interconnection; and

severing a desired portion of the flexible conductive pattern using a secondary punching operation to create a desired circuitry pattern.

2. The method according to claim 1, wherein the flexible conductive pattern includes a plurality of connector terminals, a coupling feature, and a plurality of strip separation tabs disposed therein.

3. The method according to claim 2, wherein the adaptable through-holes facilitate severing a desired number of strip separation tabs to prevent electrical communication between a first conductive strip and a second conductive strip of the flexible conductive pattern.

4. The method according to claim 1, wherein the adaptable through-holes of the back plate substrate align with a desired portion of the flexible conductive pattern.

5. The method according to claim 1, wherein the second forming operation is a selective bending of the connector terminals to provide electrical communication between adjacent flexible conductive patterns.

6. The method according to claim 1, wherein the adaptable through-holes facilitate severing a desired portion of the flexible conductive pattern along a longitudinal axis thereof to create the desired circuitry pattern.

7. An LED interconnection apparatus comprising:

a back plate substrate including a plurality of adaptable through-holes; and

a flexible conductive pattern disposed adjacent the back plate substrate, wherein the adaptable through-holes of the back plate substrate facilitate selective access to the flexible conductive pattern.

8. The LED interconnection apparatus according to claim 7, wherein the flexible conductive pattern includes a plurality of connector terminals, a coupling feature, and a plurality of strip separation tabs disposed therein.

9. The method according to claim 8, wherein the adaptable through-holes facilitate severing a desired number of strip separation tabs to prevent electrical communication between a first conductive strip and a second conductive strip of the flexible conductive pattern.

10. The LED interconnection apparatus according to claim 7, wherein the adaptable through-holes of the back plate substrate are aligned with a desired portion of the flexible conductive pattern.

11. The LED interconnection apparatus according to claim 8, wherein the connector terminals are adapted to provide electrical communication between a plurality of flexible conductive patterns.

12. The method according to claim 7, wherein the adaptable through-holes facilitate severing a desired portion of the flexible conductive pattern along a longitudinal axis thereof to create a desired circuitry pattern.

13. The LED interconnection apparatus according to claim 7, wherein the flexible conductive pattern is a dual conductive strip.

14. The LED interconnection apparatus according to claim 7, wherein the flexible conductive pattern is an annular conductive strip pattern.

15. An LED interconnection apparatus comprising:

a back plate substrate including a plurality of adaptable through-holes; and

an annular conductive strip pattern disposed adjacent the back plate substrate, wherein the adaptable through-holes of the back plate substrate allow selective access to the conductive strip.

16. The LED interconnection apparatus according to claim 15, wherein the flexible conductive pattern includes a plurality of connector terminals, a coupling feature, and a plurality of strip separation tabs disposed therein.

17. The LED interconnection apparatus according to claim 15, wherein the through-holes of the back plate substrate align with a desired portion of the flexible conductive pattern.

18. The LED interconnection apparatus according to claim 15, wherein the connector terminals are adapted to provide electrical communication between a plurality of flexible conductive patterns.

19. The, LED interconnection apparatus according to claim 15, wherein a punching operation on the annular conductive strip pattern creates a desired circuitry pattern.